Qualpack TS80C31X2/C32X2
1. Contents
1. Contents........................................................................................................................................................ 2
2. General Information ..................................................................................................................................... 3
3. Technology Information .............................................................................................................................. 4
3.1 W
AFER
P
ROCESS
T
ECHNOLOGY
..................................................................................................................... 4
3.2 P
RODUCT
D
ESIGN
.......................................................................................................................................... 5
3.3 P
ACKAGE
T
ECHNOLOGY
................................................................................................................................. 6
3.3.1 SOIC.300 16 leads............................................................................................................................... 6
3.3.2 Other available packages .................................................................................................................... 7
3.4 T
EST
............................................................................................................................................................. 7
3.5 D
EVICE
C
ROSS
S
ECTION
................................................................................................................................ 8
3.6 W
AFER
P
ROCESS
C
ONTROL
........................................................................................................................... 9
4. Qualification ............................................................................................................................................... 10
4.1 C
HANGE
P
ROCEDURE
................................................................................................................................... 11
4.2 Q
UALIFICATION
F
LOW
................................................................................................................................... 12
4.3 W
AFER
P
ROCESS
Q
UALIFICATION
................................................................................................................. 13
4.4 P
ACKAGE
Q
UALIFICATION
............................................................................................................................. 14
4.5 D
EVICE
Q
UALIFICATION
................................................................................................................................ 16
4.5.1 ESD and Latch-up results .................................................................................................................. 17
4.5.2 Failure Mechanisms and Corrective Actions ..................................................................................... 17
4.5.3 Qualification status............................................................................................................................. 17
4.6 O
UTGOING
Q
UALITY AND
R
ELIABILITY
............................................................................................................ 18
4.6.1 AOQ (Average Outgoing Quality) ...................................................................................................... 18
4.6.2 EFR (Early Failure Rate).................................................................................................................... 19
4.6.3 LFR (Latent Failure Rate) .................................................................................................................. 19
5. User Information ........................................................................................................................................ 20
5.1 S
OLDERING
R
ECOMMENDATIONS
.................................................................................................................. 20
5.2 DRY PACK O
RDERING RULES
..................................................................................................................... 20
5.3 ESD
CAUTION
.............................................................................................................................................. 20
6. Environmental Information ....................................................................................................................... 21
7. Other Data ................................................................................................................................................... 22
7.1 ISO9001 A
PPROVAL
C
ERTIFICATE
................................................................................................................ 22
7.2 D
ATABOOK
R
EFERENCE
................................................................................................................................ 23
7.3 A
DDRESS
R
EFERENCE
.................................................................................................................................. 23
8. Revision History......................................................................................................................................... 24
2
Rev. 2 – January 1999
Qualpack TSS463 / TSS461C
2. General Information
Product Name:
Function:
Specific features:
TSS463 / TSS461C
Van Controllers
Serial Interface (TSS463)
Wafer process:
Available plastic package types:
Locations:
Process, product development
Wafer plant
QC responsability
Assembly
Z86E
SOIC16 (TSS463), SOIC24 (TSS461C)
TEMIC Semiconductors Nantes, France
TEMIC Semiconductors Nantes, France
TEMIC Semiconductors Nantes, France
ANAM, Korea, Philippines
Probe test
Final test
TEMIC Semiconductors Nantes, France
GATEWAY Philippines
ANAM Korea
Quality Assurance
Reliability testing
Failure analysis
TEMIC Semiconductors Nantes, France
TEMIC Semiconductors Nantes, France
TEMIC Semiconductors Nantes, France
Quality Assurance Management Nantes
Signed..........................................................
Rev. 2 – January 1999
3