MT46V32M8TG-75ZIT:F datasheet, PDF

Datasheet> All Categories > storage> MT46V32M8TG-75ZIT:F

MT46V32M8TG-75ZIT:F: Description16M X 16 DDR DRAM, 0.7 ns, PDSO66; Categorystorage; File Size3MB，93 Pages; ManufacturerMicron; Websitehttp://www.micron.com/

Download Datasheet Parametric View All

MT46V32M8TG-75ZIT:F Overview

16M X 16 DDR DRAM, 0.7 ns, PDSO66

MT46V32M8TG-75ZIT:F Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	66
Maximum operating temperature	70 Cel
Minimum operating temperature	0.0 Cel
Maximum supply/operating voltage	2.7 V
Minimum supply/operating voltage	2.5 V
Rated supply voltage	2.6 V
Minimum access time	0.7000 ns
Processing package description	0.40 INCH, lead FREE, plastic, TSOP-66
Lead-free	Yes
EU RoHS regulations	Yes
state	DISCONTINUED
Craftsmanship	CMOS
packaging shape	Rectangle
Package Size	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
surface mount	Yes
Terminal form	GULL WING
Terminal spacing	0.6500 mm
terminal coating	MATTE Tin
Terminal location	pair
Packaging Materials	Plastic/Epoxy
Temperature level	COMMERCIAL
memory width	16
organize	16M × 16
storage density	2.68E8 deg
operating mode	Synchronize
Number of digits	1.68E7 words
Number of digits	16M
Access method	Four BANK PAGE BURST
Memory IC type	double rate synchronous dynamic random access memory dynamic random access memory
Number of ports	1

Preview

Download Datasheet

View All

256Mb: x4, x8, x16 DDR SDRAM

Features

Double Data Rate (DDR) SDRAM

MT46V64M4 – 16 Meg x 4 x 4 banks

MT46V32M8 – 8 Meg x 8 x 4 banks

MT46V16M16 – 4 Meg x 16 x 4 banks

Features

• V

= +2.5V ±0.2V, V

Q = +2.5V ±0.2V

• V

= +2.6V ±0.1V, V

Q = +2.6V ±0.1V (DDR400)

• Bidirectional data strobe (DQS) transmitted/

received with data, that is, source-synchronous data

capture (x16 has two – one per byte)

• Internal, pipelined double-data-rate (DDR)

architecture; two data accesses per clock cycle

• Differential clock inputs (CK and CK#)

• Commands entered on each positive CK edge

• DQS edge-aligned with data for READs; center-

aligned with data for WRITEs

• DLL to align DQ and DQS transitions with CK

• Four internal banks for concurrent operation

• Data mask (DM) for masking write data

(x16 has two – one per byte)

• Programmable burst lengths (BL): 2, 4, or 8

• Auto refresh

–

64ms, 8192-cycle(Commercial & Industrial)

–

16ms, 8192-cycle (Automotive)

• Self refresh (not available on AT devices)

• Longer-lead TSOP for improved reliability (OCPL)

• 2.5V I/O (SSTL_2-compatible)

• Concurrent auto precharge option supported

•

RAS lockout supported (

RAP =

RCD)

Options

Marking

• Configuration

–

64 Meg x 4 (16 Meg x 4 x 4 banks)

64M4

–

32 Meg x 8 (8 Meg x 8 x 4 banks)

32M8

–

16 Meg x 16 (4 Meg x 16 x 4 banks)

16M16

• Plastic package – OCPL

–

66-pin TSOP

–

66-pin TSOP (Pb-free)

• Plastic package

–

60-ball FBGA (8mm x 14mm)

–

60-ball FBGA (8mm x 14mm) (Pb-free)

–

60-ball FBGA (8mm x 12.5mm)

–

60-ball FBGA (8mm x 12.5mm)

(Pb-free)

• Timing – cycle time

–

5ns @ CL = 3 (DDR400B)

-5B

–

6ns @ CL = 2.5 (DDR333) FBGA only

-6

–

6ns @ CL = 2.5 (DDR333) TSOP only

-6T

-75E

–

7.5ns @ CL = 2 (DDR266)

-75Z

–

7.5ns @ CL = 2 (DDR266A)

-75

–

7.5ns @ CL = 2.5 (DDR266B)

• Self refresh

–

Standard

None

–

Low-power self refresh

• Temperature rating

–

Commercial (0°C to +70°C)

None

–

Industrial (–40°C to +85°C)

–

Automotive (–40°C to +105°C)

• Revision

–

x4, x8

–

x16

–

x4, x8, x16

Notes: 1. Only available on Revision F and G.

2. Only available on Revision K.

3. Not recommended for new designs.

4. Contact Micron for availability.

PDF: 09005aef80768abb/Source: 09005aef82a95a3a

256Mb_DDR_x4x8x16_D1.fm - 256Mb DDR: Rev. O, Core DDR: Rev. B 1/09 EN

Micron Technology, Inc., reserves the right to change products or specifications without notice.

Products and specifications discussed herein are subject to change by Micron without notice.

256Mb: x4, x8, x16 DDR SDRAM

Table of Contents

State Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

General Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

Automotive Tempature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

Functional Block Diagrams. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

Pin and Ball Assignments and Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

Electrical Specifications – DC and AC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37

Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45

DESELECT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49

NO OPERATION (NOP). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49

LOAD MODE REGISTER (LMR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49

ACTIVE (ACT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50

READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51

WRITE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52

PRECHARGE (PRE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53

BURST TERMINATE (BST) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53

AUTO REFRESH (AR). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53

SELF REFRESH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53

Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54

INITIALIZATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54

REGISTER DEFINITION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57

ACTIVE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61

READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62

WRITE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74

PRECHARGE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87

AUTO REFRESH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .89

SELF REFRESH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .90

Power-down (CKE Not Active) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .92

PDF: 09005aef80768abb/Source: 09005aef82a95a3a

256Mb_DDRTOC.fm - 256Mb DDR: Rev. O, Core DDR: Rev. B 1/09 EN

Micron Technology, Inc., reserves the right to change products or specifications without notice.

Recommended Resources

SBX1483-11/12/51/52 (TVs, VCRs, audio equipment, air conditioners and toys) infrared remote control receiving circuit

High-precision 400uA floating current source circuit diagram

1μs pulse circuit

Comparator circuit with hysteresis (Schmitt trigger)

Charger hardware box

Ball mill automatic grinding door circuit

How to convert CString to char *??: Thanks...; mysky163 Embedded System

Which expert can give me a complete cadence project?: Help: Can any expert give me a complete cadence project, with a complete set of examples and geber files from vias, pads, component packages, schematics, and PCB wiring stages. I have learned cadence ...; bigbat PCB Design

Looking for an expert in writing SPI solutions: Dear master, I want to find a master who is good at SPI protocol, and I want to ask the master to help me make a plan. I have several batches of ADC chips MCP3553-E on hand, and I want to send CS SCK ...; benny512 MCU

AVR is really as few people use it as many colleagues said!!!: I heard a colleague say that few people use AVR because it is expensive and old. I didn’t take it seriously at the time and thought it was the wishful thinking of people who didn’t play with AVR. But ...; gh131413 Microchip MCU

[Repost] Popular Science of Components: How IC Chips Are Packaged: [align=left][font=微软雅黑]Getting an IC chip requires a long process from design to manufacturing. However, a chip is quite small and thin. If it is not protected from the outside, it will be easily scra...; 皇华Ameya360 Power technology

Introduction to MSP430 internal FLASH: 1. The characteristics of the Flash memory of Msp430 are: 1) Generate internal programming voltage 2) Programmable by bit, byte, word, and can be operated individually or continuously 3) Ultra-low pow...; 灞波儿奔 Microcontroller MCU

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components