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CY7C1361B-133BGC

Description
256KX36 CACHE SRAM, 6.5ns, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
Categorystorage    storage   
File Size2MB,35 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
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CY7C1361B-133BGC Overview

256KX36 CACHE SRAM, 6.5ns, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119

CY7C1361B-133BGC Parametric

Parameter NameAttribute value
MakerRochester Electronics
Parts packaging codeBGA
package instruction14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
Contacts119
Reach Compliance Codeunknown
Maximum access time6.5 ns
Other featuresFLOW-THROUGH ARCHITECTURE
JESD-30 codeR-PBGA-B119
length22 mm
memory density9437184 bit
Memory IC TypeCACHE SRAM
memory width36
Number of functions1
Number of terminals119
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX36
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
Certification statusCOMMERCIAL
Maximum seat height2.4 mm
Maximum supply voltage (Vsup)3.63 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
width14 mm
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CY7C1361B-133BGC Related Products

CY7C1361B-133BGC CY7C1361B-100AJC CY7C1361B-100BZI CY7C1361B-117BGC CY7C1363B-117AJC CY7C1363B-117BGC CY7C1363B-117AC CY7C1363B-117BGI CY7C1363B-133AI
Description 256KX36 CACHE SRAM, 6.5ns, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 256KX36 CACHE SRAM, 8.5ns, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 256KX36 CACHE SRAM, 8.5ns, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 256KX36 CACHE SRAM, 7.5ns, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 512KX18 CACHE SRAM, 7.5ns, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 512KX18 CACHE SRAM, 7.5ns, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 512KX18 CACHE SRAM, 7.5ns, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 512KX18 CACHE SRAM, 7.5ns, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 512KX18 CACHE SRAM, 6.5ns, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
Maker Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics
Parts packaging code BGA QFP BGA BGA QFP BGA QFP BGA QFP
package instruction 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 BGA, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 LQFP, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 LQFP,
Contacts 119 100 165 119 100 119 100 119 100
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
Maximum access time 6.5 ns 8.5 ns 8.5 ns 7.5 ns 7.5 ns 7.5 ns 7.5 ns 7.5 ns 6.5 ns
Other features FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE
JESD-30 code R-PBGA-B119 R-PQFP-G100 R-PBGA-B165 R-PBGA-B119 R-PQFP-G100 R-PBGA-B119 R-PQFP-G100 R-PBGA-B119 R-PQFP-G100
length 22 mm 20 mm 15 mm 22 mm 20 mm 22 mm 20 mm 22 mm 20 mm
memory density 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit
Memory IC Type CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM
memory width 36 36 36 36 18 18 18 18 18
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 119 100 165 119 100 119 100 119 100
word count 262144 words 262144 words 262144 words 262144 words 524288 words 524288 words 524288 words 524288 words 524288 words
character code 256000 256000 256000 256000 512000 512000 512000 512000 512000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 85 °C 70 °C 70 °C 70 °C 70 °C 85 °C 85 °C
organize 256KX36 256KX36 256KX36 256KX36 512KX18 512KX18 512KX18 512KX18 512KX18
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA LQFP TBGA BGA LQFP BGA LQFP BGA LQFP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY FLATPACK, LOW PROFILE GRID ARRAY, THIN PROFILE GRID ARRAY FLATPACK, LOW PROFILE GRID ARRAY FLATPACK, LOW PROFILE GRID ARRAY FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Maximum seat height 2.4 mm 1.6 mm 1.2 mm 2.4 mm 1.6 mm 2.4 mm 1.6 mm 2.4 mm 1.6 mm
Maximum supply voltage (Vsup) 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V
Minimum supply voltage (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES YES
Temperature level COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL GULL WING BALL BALL GULL WING BALL GULL WING BALL GULL WING
Terminal pitch 1.27 mm 0.65 mm 1 mm 1.27 mm 0.65 mm 1.27 mm 0.65 mm 1.27 mm 0.65 mm
Terminal location BOTTOM QUAD BOTTOM BOTTOM QUAD BOTTOM QUAD BOTTOM QUAD
width 14 mm 14 mm 13 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
Terminal surface - NOT SPECIFIED NOT SPECIFIED TIN LEAD TIN LEAD TIN LEAD - - -
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