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FGPF30N30TDTU

Description
Insulated Gate Bipolar Transistor, 300V V(BR)CES, N-Channel, TO-220AB, ROHS COMPLIANT, TO-220F, 3 PIN
CategoryDiscrete semiconductor    The transistor   
File Size628KB,9 Pages
ManufacturerFairchild
Websitehttp://www.fairchildsemi.com/
Environmental Compliance
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Insulated Gate Bipolar Transistor, 300V V(BR)CES, N-Channel, TO-220AB, ROHS COMPLIANT, TO-220F, 3 PIN

FGPF30N30TDTU Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerFairchild
Parts packaging codeTO-220AB
package instructionFLANGE MOUNT, R-PSFM-T3
Contacts3
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresLOW CONDUCTION LOSS
Shell connectionISOLATED
Collector-emitter maximum voltage300 V
ConfigurationSINGLE WITH BUILT-IN DIODE
Maximum landing time (tf)300 ns
Gate emitter threshold voltage maximum5.5 V
Gate-emitter maximum voltage30 V
JEDEC-95 codeTO-220AB
JESD-30 codeR-PSFM-T3
Number of components1
Number of terminals3
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeN-CHANNEL
Maximum power dissipation(Abs)44.6 W
Certification statusNot Qualified
surface mountNO
Terminal formTHROUGH-HOLE
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsPOWER CONTROL
Transistor component materialsSILICON
Nominal off time (toff)400 ns
Nominal on time (ton)55 ns
FGPF30N30TD 300V, 30A PDP Trench IGBT
September 2007
FGPF30N30TD
300V, 30A PDP Trench IGBT
Features
• High current capability
• Low saturation voltage: V
CE(sat)
=1.4V @ I
C
= 20A
• High input impedance
• Fast switching
• RoHS complaint
tm
General Description
Using Novel Trench IGBT Technology, Fairchild’s new sesries of
trench IGBTs offer the optimum performance for PDP applica-
tions where low conduction and switching losses are essential.
Applications
• PDP System
C
TO-220F
1
1.Gate
2.Collector
3.Emitter
E
Absolute Maximum Ratings
Symbol
V
CES
V
GES
I
C pulse (1)
I
F
I
FM
P
D
T
J
T
stg
T
L
Description
Collector to Emitter Voltage
Gate to Emitter Voltage
Pulsed Collector Current
Diode Continuous Forward Current
Diode Maximum Forward Current
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction Temperature
Storage Temperature Range
Maximum Lead Temp. for soldering
Purposes, 1/8” from case for 5 seconds
@ T
C
= 25
o
C
@ T
C
= 100
o
C
@ T
C
=
25
o
C
Ratings
300
±
30
80
10
40
44.6
17.8
-55 to +150
-55 to +150
300
Units
V
V
A
A
A
W
W
o
o
@ T
C
= 100°C
C
C
o
C
Thermal Characteristics
Symbol
R
θJC
(IGBT)
R
θJC
(DIODE)
R
θJA
Notes :
(1) Repetitive tese, Pulse width = 100usec, Duty = 0.1
* Ic_pluse limited by max Tj
Parameter
Thermal Resistance, Junction to Case
Thermal Resistance, Junction-to-Case for Diode
Thermal Resistance, Junction to Ambient
Typ.
-
--
-
Max.
2.8
3.0
62.5
Units
o
C/W
o
C/W
o
C/W
©2007 Fairchild Semiconductor Corporation
1
www.fairchildsemi.com
FGPF30N30TD Rev. A

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