CM1442
LCD and Camera EMI Filter
Array with ESD Protection
Product Description
The CM1442 is a family of pi−style EMI filter arrays with ESD
protection, which integrates six and eight filters (C−R−C) in Chip
Scale Package form factor with 0.40 mm pitch. The CM1442 has
component values of 15 pF
−
100
W
−
15 pF per channel. The CM1442
has a cut−off frequency of 120 MHz and can be used in applications
where the data rates are as high as 48 Mbps. The parts include
avalanche−type ESD diodes on every pin, which provide a very high
level of protection for sensitive electronic components that may be
subjected to electrostatic discharge (ESD). The ESD protection diodes
safely dissipate ESD strikes of
±15
kV, well beyond the maximum
requirement of the IEC61000−4−2 international standard. Using the
MIL−STD−883 (Method 3015) specification for Human Body Model
(HBM) ESD, the pins are protected for contact discharges at greater
than
±30
kV.
This device is particularly well suited for portable electronics (e.g.
wireless handsets, PDAs, notebook computers) because of its small
package format and easy−to−use pin assignments. In particular, the
CM1442 is ideal for EMI filtering and protecting data and control lines
for the I/O data ports, LCD display and camera interface in mobile
handsets.
The CM1442 incorporates
OptiGuardt
which results in improved
reliability at assembly. The CM1442 is available in a space−saving,
low−profile Chip Scale Package with RoHS compliant lead−free
finishing. It is manufactured with a 0.40 mm pitch and 0.25 mm CSP
solder ball to provide up to 28% board space saving versus competing
CSP devices with 0.50 mm pitch and 0.30 mm CSP solder ball.
Features
http://onsemi.com
WLCSP15
CP SUFFIX
CASE 567BP
WLCSP20
CP SUFFIX
CASE 567BU
MARKING DIAGRAM
N426
CM1442−06
15−Bump CSP Package
N426
N428
N428
CM1442−08
20−Bump CSP Package
= CM1442−06CP
= CM1442−08CP
ORDERING INFORMATION
Device
CM1442−06CP
CM1442−08CP
Package
CSP−15
(Pb−Free)
CSP−20
(Pb−Free)
Shipping
†
3500/Tape & Reel
3500/Tape & Reel
•
Six and Eight Channels of EMI Filtering with Integrated ESD
•
•
•
•
•
•
Protection
†For information on tape and reel specifications,
0.4 mm Pitch, 15−Bump, 2.360 mm x 1.053 mm Footprint Chip
including part orientation and tape sizes, please
Scale Package (CM1442−06)
refer to our Tape and Reel Packaging Specification
0.4 mm Pitch, 20−Bump, 3.160 mm x 1.053 mm Footprint Chip
Brochure, BRD8011/D.
Scale Package (CM1442−08)
Pi−Style EMI Filters in a Capacitor−Resistor−Capacitor
•
Greater than 30 dB Attenuation (Typical) at 1 GHz
(C−R−C) Network
•
Chip Scale Package Features Extremely Low Lead
±15
kV ESD Protection on Each Channel
Inductance for Optimum Filter and ESD Performance
(IEC 61000−4−2 Level 4, Contact Discharge)
•
OptiGuardtCoated
for Improved Reliability at
±30
kV ESD Protection on Each Channel (HBM)
Assembly
These Devices are Pb−Free and are RoHS Compliant
Applications
•
LCD and Camera Data Lines in Mobile Handsets
•
I/O Port Protection for Mobile Handsets, Notebook
Computers, PDAs, etc.
•
Wireless Handsets
•
EMI Filtering for Data Ports in Cell Phones, PDAs or
Notebook Computers
•
Handheld PCs/PDAs
•
LCD and Camera Modules
©
Semiconductor Components Industries, LLC, 2011
March, 2011
−
Rev. 3
1
Publication Order Number:
CM1442/D
CM1442
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Storage Temperature Range
DC Power per Resistor
DC Package Power Rating
Rating
−65
to +150
100
500
Units
°C
mW
mW
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
Rating
−40
to +85
Units
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS
(Note 1)
Symbol
R
C
TOTAL
C
V
DIODE
I
LEAK
V
SIG
Resistance
Total Channel Capacitance
Capacitance C1
Standoff Voltage
Diode Leakage Current (reverse bias)
Signal Clamp Voltage
Positive Clamp
Negative Clamp
In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883, Method 3015
b) Contact Discharge per IEC 61000−4−2 Level 4
Dynamic Resistance
Positive
Negative
Cut−off Frequency
Z
SOURCE
= 50
W,
Z
LOAD
= 50
W
R = 100
W,
C = 15 pF
At 2.5 VDC Reverse Bias,
1 MHz, 30 mVAC
At 2.5 VDC Reverse Bias,
1 MHz, 30 mVAC
I
DIODE
= 10
mA
V
DIODE
= 3.3 V
I
LOAD
= 10 mA
I
LOAD
=
−10
mA
(Notes 2 and 3)
5.6
−1.5
±30
±15
2.3
0.9
115
Parameter
Conditions
Min
80
24
12
Typ
100
30
15
6.0
0.1
6.8
−0.8
1
9.0
−0.4
Max
120
36
18
Units
W
pF
pF
V
mA
V
V
ESD
kV
R
DYN
W
f
C
MHz
1. T
A
= 25
°
C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
3. Unused pins are left open.
http://onsemi.com
3
京公网安备 11010802033920号
EEWORLD
