Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
NOTES: 1. Unless otherwise specified, the absolute maximum negative input voltage is equal to the negative power supply voltage.
2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace
length of zero.
recommended operating conditions
C SUFFIX
MIN
Supply voltage, VCC +
Supply voltage, VCC –
Operating free-air temperature, TA
3.5
– 3.5
0
MAX
18
– 18
70
I SUFFIX
MIN
3.5
– 3.5
– 40
MAX
18
– 18
–85
UNIT
V
V
°C
electrical characteristics over operating free-air temperature range, V
CC
±
=
±15
V (unless otherwise
specified)
PARAMETER
VIO
α
VIO
IIO
IIB
Input offset voltage
Average temperature coeffi-
cient of input offset voltage
Input
Inp t offset current‡
c rrent
Input
Inp t bias current‡
c rrent
Common-mode input voltage
range
Maximum peak output-voltage
swing
Large-signal differential
g
g
voltage
Input resistance
Common-mode rejection ratio
Supply-voltage rejection ratio
RL = 10 kΩ
VO =
±
10 V
V,
TJ = 25°C
RS
≤
10 kΩ
See Note 3
70
70
RL = 2 kΩ
25°C
0°C to 70°C
25°C
–40°C to 85°C
TEST CONDITIONS
VIC = 0,
VIC = 0,
VIC = 0
VIC = 0
RS = 10 kΩ
RS = 10 kΩ
25°C
70°C
25°C
70°C
25°C
85°C
25°C
85°C
±
11
±
12
25
15
–11.5
to
14.5
±
13.5
200
200
1012
100
100
50
TA
LF411C
25°C
LF411I
25°C
MIN
TYP
0.8
10
25
MAX
2
20†
100
2
200
4
UNIT
mV
µV/°C
pA
nA
pA
nA
V
VICR
VOM
AVD
ri
CMR
R
kSVR
V
V/mV
Ω
dB
dB
ICC
Supply current
2
3.4
mA
† At least 90% of the devices meet this limit for
α
VIO.
‡ Input bias currents of an FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive. Pulse techniques
must be used that will maintain the junction temperatures as close to the ambient temperature as possible.
NOTE 3: Supply-voltage rejection ratio is measured for both supply magnitudes increasing or decreasing simultaneously.
2
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
LF411
JFET-INPUT OPERATIONAL AMPLIFIER
SLOS011C – MARCH 1987 – REVISED OCTOBER 1997
operating characteristics, V
CC
±
=
±15
V, T
A
= 25°C
PARAMETER
SR
B1
Vn
In
Slew rate
Unity-gain bandwidth
Equivalent input noise voltage
Equivalent input noise current
f = 1 kHz,
f = 1 kHz
RS = 20
Ω
TEST CONDITIONS
MIN
8
2.7
TYP
13
3
18
0.01
MAX
UNIT
V/µs
MHz
nV/√Hz
pA/√Hz
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
3
PACKAGE OPTION ADDENDUM
www.ti.com
7-Jun-2010
PACKAGING INFORMATION
Orderable Device
LF411CD
LF411CDE4
LF411CDG4
LF411CDR
LF411CDRE4
LF411CDRG4
LF411CP
LF411CPE4
LF411ID
LF411IDR
LF411IP
(1)
Status
(1)
Package Type Package
Drawing
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SOIC
SOIC
PDIP
D
D
D
D
D
D
P
P
D
D
P
Pins
8
8
8
8
8
8
8
8
8
8
8
Package Qty
75
75
75
2500
2500
2500
50
50
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
Contact TI Distributor
or Sales Office
Contact TI Distributor
or Sales Office
Contact TI Distributor
or Sales Office
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
Samples Not Available
Samples Not Available
Samples Not Available
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
OBSOLETE
OBSOLETE
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Pb-Free (RoHS)
Pb-Free (RoHS)
TBD
TBD
TBD
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability
information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
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