LM218DE datasheet, PDF - EEWORLD Datasheet

LM218DE: DescriptionOperational Amplifier, 1 Func, 6000uV Offset-Max, BIPolar, CDIP8,; CategoryAnalog mixed-signal IC Amplifier circuit; File Size144KB，2 Pages; ManufacturerRaytheon Company; Websitehttps://www.raytheon.com/

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LM218DE Overview

Operational Amplifier, 1 Func, 6000uV Offset-Max, BIPolar, CDIP8,

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Raytheon Company
package instruction	DIP, DIP8,.3
Reach Compliance Code	unknown
Amplifier type	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK
frequency compensation	YES
Maximum input offset voltage	6000 µV
JESD-30 code	R-XDIP-T8
JESD-609 code	e0
low-dissonance	NO
Number of functions	1
Number of terminals	8
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	+-5/+-20 V
Certification status	Not Qualified
surface mount	NO
technology	BIPOLAR
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	LM218DE	LM118DE	LM318DE
Description	Operational Amplifier, 1 Func, 6000uV Offset-Max, BIPolar, CDIP8,	Operational Amplifier, 1 Func, 6000uV Offset-Max, BIPolar, CDIP8,	Operational Amplifier, 1 Func, 15000uV Offset-Max, BIPolar, CDIP8,
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	Raytheon Company	Raytheon Company	Raytheon Company
Reach Compliance Code	unknown	unknown	unknown
Amplifier type	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK
frequency compensation	YES	YES	YES
Maximum input offset voltage	6000 µV	6000 µV	15000 µV
JESD-30 code	R-XDIP-T8	R-XDIP-T8	R-XDIP-T8
JESD-609 code	e0	e0	e0
low-dissonance	NO	NO	NO
Number of functions	1	1	1
Number of terminals	8	8	8
Maximum operating temperature	85 °C	125 °C	70 °C
Minimum operating temperature	-25 °C	-55 °C	-
Package body material	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP
Encapsulate equivalent code	DIP8,.3	DIP8,.3	DIP8,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE
power supply	+-5/+-20 V	+-5/+-20 V	+-5/+-20 V
Certification status	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO
technology	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	OTHER	MILITARY	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL
package instruction	DIP, DIP8,.3	-	DIP, DIP8,.3

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