AT27BV010-70PI datasheet, PDF - EEWORLD Datasheet

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AT27BV010-70PI: DescriptionOTP ROM, 128KX8, 70ns, CMOS, PDIP32; Categorystorage storage; File Size430KB，6 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com

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AT27BV010-70PI Overview

OTP ROM, 128KX8, 70ns, CMOS, PDIP32

AT27BV010-70PI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Microchip
package instruction	DIP,
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	70 ns
Other features	UNREGULATED BATTERY POWER SUPPLY RANGE
JESD-30 code	R-PDIP-T32
JESD-609 code	e0
length	42.05 mm
memory density	1048576 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	5.59 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm

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AT27BV010-70PI Related Products

	AT27BV010-70PI	AT27BV010-12PC	AT27BV010-12PI	AT27BV010-15PI	AT27BV010-90PC	AT27BV010-70PC	AT27BV010-90PI
Description	OTP ROM, 128KX8, 70ns, CMOS, PDIP32	OTP ROM, 128KX8, 120ns, CMOS, PDIP32	OTP ROM, 128KX8, 120ns, CMOS, PDIP32	OTP ROM, 128KX8, 150ns, CMOS, PDIP32	OTP ROM, 128KX8, 90ns, CMOS, PDIP32	OTP ROM, 128KX8, 70ns, CMOS, PDIP32	OTP ROM, 128KX8, 90ns, CMOS, PDIP32
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Microchip	Microchip	Microchip	Microchip	Microchip	Microchip	Microchip
package instruction	DIP,	0.600 INCH, PLASTIC, DIP-32	DIP,	0.600 INCH, PLASTIC, DIP-32	0.600 INCH, PLASTIC, DIP-32	0.600 INCH, PLASTIC, DIP-32	0.600 INCH, PLASTIC, DIP-32
Reach Compliance Code	compliant	compli	compliant	compliant	unknown	compliant	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	70 ns	120 ns	120 ns	150 ns	90 ns	70 ns	90 ns
Other features	UNREGULATED BATTERY POWER SUPPLY RANGE	UNREGULATED BATTERY POWER SUPPLY RANGE	UNREGULATED BATTERY POWER SUPPLY RANGE	UNREGULATED BATTERY POWER SUPPLY RANGE	UNREGULATED BATTERY POWER SUPPLY RANGE	UNREGULATED BATTERY POWER SUPPLY RANGE	UNREGULATED BATTERY POWER SUPPLY RANGE
JESD-30 code	R-PDIP-T32	R-PDIP-T32	R-PDIP-T32	R-PDIP-T32	R-PDIP-T32	R-PDIP-T32	R-PDIP-T32
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
length	42.05 mm	42.05 mm	42.05 mm	42.05 mm	42.05 mm	42.05 mm	42.05 mm
memory density	1048576 bit	1048576 bi	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	85 °C	85 °C	70 °C	70 °C	85 °C
Minimum operating temperature	-40 °C	-	-40 °C	-40 °C	-	-	-40 °C
organize	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	225
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.59 mm	5.59 mm	5.59 mm	5.59 mm	5.59 mm	5.59 mm	5.59 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	30
width	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm

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