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DS2430AP+T

Description
256 X 1 1-WIRE SERIAL EEPROM, PBCY3
Categorystorage   
File Size634KB,16 Pages
ManufacturerDALLAS
Websitehttp://www.dalsemi.com
Download Datasheet Parametric Compare View All

DS2430AP+T Overview

256 X 1 1-WIRE SERIAL EEPROM, PBCY3

DS2430AP+T Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals3
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage6 V
Minimum supply/operating voltage2.8 V
Rated supply voltage5 V
maximum clock frequency0.0163 MHz
Processing package descriptionTO-92, 3-PIN
stateACTIVE
CraftsmanshipMOS
packaging shaperound
Package Sizecylindrical
Terminal formTHROUGH-hole
terminal coatingtin lead
Terminal locationBOTTOM
Packaging MaterialsPlastic/Epoxy
Temperature levelINDUSTRIAL
memory width1
organize256 × 1
storage density256 deg
operating modeASYNCHRONOUS
Number of digits256 words
Number of digits256
Memory IC type1-wire serial electrically erasable read-only memory
serial parallelserial
Maximum TWC of write cycle10 ms
DS2430A
256-Bit 1-Wire EEPROM
www.maxim-ic.com
FEATURES
256-bit Electrically Erasable Programmable
Read Only Memory (EEPROM) plus 64-bit
one-time programmable application register
Unique, factory-lasered and tested 64-bit
registration number (8-bit family code + 48-bit
serial number + 8-bit CRC tester) assures
absolute identity because no two parts are alike
Built-in multidrop controller ensures
compatibility with other MicroLAN products
EEPROM organized as one page of 32 bytes
for random access
Reduces control, address, data, and power to a
single data pin
Directly connects to a single port pin of a
microprocessor and communicates at up to
16.3kbits per second
8-bit family code specifies DS2430A
communication requirements to reader
Presence detector acknowledges when reader
first applies voltage
Low cost TO-92 or 6-pin TSOC and Flip Chip
surface mount package
Reads and writes over a wide voltage range of
2.8V to 6.0V from -40°C to +85°C
PIN ASSIGNMENT
TO-92
DALLAS
DS2430A
ew
rN
fo
1
2
3
1 2 3
BOTTOM VIEW
See Mech.
Drawings Section
D
PIN DESCRIPTION
Pin 1
Pin 2
Pin 3
Pin 4
Pin 5
Pin 6
TO-92
Ground
Data
NC
––––
––––
––––
TSOC
Ground
Data
NC
NC
NC
NC
de
d
ec
om
m
en
ORDERING INFORMATION
DS2430A
TO-92 Package
DS2430AP
6-pin TSOC Package
DS2430A/T&R
TO-92 Package, Tape & Reel
DS2430AP/T&R TSOC Package, Tape & Reel
DS2430A+
TO-92 Package
DS2430AP+
6-pin TSOC Package
DS2430A+T&R
TO-92 Package, Tape & Reel
DS2430AP+T&R TSOC Package, Tape & Reel
DS2430AX
Flip Chip, 10k Tape & Reel
DS2430AX-S
Flip Chip, 2.5k Tape & Reel
+ Indicates lead-free compliance.
NOTE:
The leads of TO-92 packages on tape-
and-reel are formed to approximately 100 mil
(2.54 mm) spacing. For details refer to drawing
56-G0006-003.
ot
R
N
1 of 16
es
i
1
2
3
TSOC PACKAGE
6
5
4
TOP VIEW
3.7mm x 4.0mm x 1.5mm
See Mech.
Drawing Section
4
3
1
2
Flip Chip, Top View
with Laser Mark,
Contacts Not Visible.
“rrd” = Revision/Date
#xx = Lot Number
See
56-G7016-001
for
package outline.
gn
SIDE VIEW
2430A
rrd#xx
Flip Chip
Ground
Data
NC
NC
––––
––––
080807

DS2430AP+T Related Products

DS2430AP+T DS2430A/T&R DS2430AP+T&R DS2430AP/T&R DS2430A+T&R DS2430A+R
Description 256 X 1 1-WIRE SERIAL EEPROM, PBCY3 256 X 1 1-WIRE SERIAL EEPROM, PBCY3 256 X 1 1-WIRE SERIAL EEPROM, PBCY3 256 X 1 1-WIRE SERIAL EEPROM, PBCY3 256 X 1 1-WIRE SERIAL EEPROM, PBCY3 256 X 1 1-WIRE SERIAL EEPROM, PBCY3
Number of functions 1 1 1 1 1 1
Number of terminals 3 3 3 3 3 3
Maximum operating temperature 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel
Minimum operating temperature -40 Cel -40 Cel -40 Cel -40 Cel -40 Cel -40 Cel
Maximum supply/operating voltage 6 V 6 V 6 V 6 V 6 V 6 V
Minimum supply/operating voltage 2.8 V 2.8 V 2.8 V 2.8 V 2.8 V 2.8 V
Rated supply voltage 5 V 5 V 5 V 5 V 5 V 5 V
maximum clock frequency 0.0163 MHz 0.0163 MHz 0.0163 MHz 0.0163 MHz 0.0163 MHz 0.0163 MHz
Processing package description TO-92, 3-PIN TO-92, 3-PIN TO-92, 3-PIN TO-92, 3-PIN TO-92, 3-PIN TO-92, 3-PIN
state ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
Craftsmanship MOS MOS MOS MOS MOS MOS
packaging shape round round round round round round
Package Size cylindrical cylindrical cylindrical cylindrical cylindrical cylindrical
Terminal form THROUGH-hole THROUGH-hole THROUGH-hole THROUGH-hole THROUGH-hole THROUGH-hole
terminal coating tin lead tin lead tin lead tin lead tin lead tin lead
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Packaging Materials Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
memory width 1 1 1 1 1 1
organize 256 × 1 256 × 1 256 × 1 256 × 1 256 × 1 256 × 1
storage density 256 deg 256 deg 256 deg 256 deg 256 deg 256 deg
operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Memory IC type 1-wire serial electrically erasable read-only memory 1-wire serial electrically erasable read-only memory 1-wire serial electrically erasable read-only memory 1-wire serial electrically erasable read-only memory 1-wire serial electrically erasable read-only memory 1-wire serial electrically erasable read-only memory
serial parallel serial serial serial serial serial serial
Maximum TWC of write cycle 10 ms 10 ms 10 ms 10 ms 10 ms 10 ms
Number of digits 256 256 256 256 256 256
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