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GS867238AGE-450T

Description
Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
Categorystorage    storage   
File Size813KB,30 Pages
ManufacturerGSI Technology
Websitehttp://www.gsitechnology.com/
Environmental Compliance  
Download Datasheet Parametric View All

GS867238AGE-450T Overview

Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165

GS867238AGE-450T Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerGSI Technology
Parts packaging codeBGA
package instructionLBGA,
Contacts165
Reach Compliance Codecompliant
ECCN code3A991.B.2.B
Maximum access time0.45 ns
Other featuresPIPELINED ARCHITECTURE
JESD-30 codeR-PBGA-B165
JESD-609 codee1
length17 mm
memory density75497472 bit
Memory IC TypeSTANDARD SRAM
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals165
word count2097152 words
character code2000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2MX36
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.5 mm
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width15 mm
GS8672D20/38AE-550/500/450/400
165-Bump BGA
Commercial Temp
Industrial Temp
Features
• 2.5 Clock Latency
• On-Chip ECC with virtually zero SER
• Simultaneous Read and Write SigmaQuad™ Interface
• JEDEC-standard package
• Dual Double Data Rate interface
• Byte Write Capability
• Burst of 4 Read and Write
• On-Die Termination (ODT) on Data (D), Byte Write (BW),
and Clock (K, K) outputs
• 1.8 V +100/–100 mV core power supply
• 1.5 V HSTL Interface
• Pipelined read operation
• Fully coherent read and write pipelines
• ZQ pin for programmable output drive strength
• IEEE 1149.1 JTAG-compliant Boundary Scan
• Pin-compatible with 144Mb and future 288Mb devices
• 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package
• RoHS-compliant 165-bump BGA package available
72Mb SigmaQuad
TM
-II+
Burst of 4 ECCRAM
TM
Clocking and Addressing Schemes
550 MHz–400 MHz
1.8 V V
DD
1.5 V I/O
The GS8672D20/38AE SigmaQuad-II+ ECCRAMs are
synchronous devices. They employ two input register clock
inputs, K and K. K and K are independent single-ended clock
inputs, not differential inputs to a single differential clock input
buffer.
Because Separate I/O SigmaQuad-II+ B4 RAMs always
transfer data in four packets, A0 and A1 are internally set to 0
for the first read or write transfer, and automatically
incremented by 1 for the next transfers. Because the LSBs are
tied off internally, the address field of a SigmaQuad-II+ B4
RAM is always two address pins less than the advertised index
depth (e.g., the 4M x 18 has a 1M addressable index).
On-Chip Error Correction Code
GSI's ECCRAMs implement an ECC algorithm that detects
and corrects all single-bit memory errors, including those
induced by Soft Error Rate (SER) events such as cosmic rays,
alpha particles. The resulting SER of these devices is
anticipated to be <0.002 FITs/Mb — a 5-order-of-magnitude
improvement over comparable SRAMs with no On-Chip ECC,
which typically have an SER of 200 FITs/Mb or more. SER
quoted above is based on reading taken at sea level.
However, the On-Chip Error Correction (ECC) will be
disabled if a “Half Write” operation is initiated. See the
Byte
Write Contol
section for further information.
SigmaQuad™ ECCRAM Overview
The GS8672D20/38AE are built in compliance with the
SigmaQuad-II+ ECCRAM pinout standard for Separate I/O
synchronous ECCRAMs. They are 75,497,472-bit (72Mb)
ECCRAMs. The GS8672D20/38AE SigmaQuad ECCRAMs
are just one element in a family of low power, low voltage
HSTL I/O ECCRAMs designed to operate at the speeds needed
to implement economical high performance networking
systems.
Parameter Synopsis
-550
tKHKH
tKHQV
1.81 ns
0.45ns
-500
2.0 ns
0.45 ns
-450
2.2 ns
0.45ns
-400
2.5 ns
0.45 ns
Rev: 1.00 5/2010
1/30
© 2010, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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