LMC7111MWC datasheet, PDF - EEWORLD Datasheet

LMC7111MWC: DescriptionIC OP-AMP, 0.04 MHz BAND WIDTH, UUC, WAFER, Operational Amplifier; CategoryAnalog mixed-signal IC Amplifier circuit; File Size856KB，22 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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LMC7111MWC Overview

IC OP-AMP, 0.04 MHz BAND WIDTH, UUC, WAFER, Operational Amplifier

Parameter Name	Attribute value
Maker	National Semiconductor（TI ）
Parts packaging code	WAFER
package instruction	DIE, DIE OR CHIP
Reach Compliance Code	unknown
ECCN code	EAR99
Amplifier type	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK
frequency compensation	YES
JESD-30 code	X-XUUC-N
low-bias	YES
low-dissonance	NO
micropower	YES
Negative supply voltage upper limit
Nominal Negative Supply Voltage (Vsup)
Number of functions	1
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	DIE
Encapsulate equivalent code	DIE OR CHIP
Package shape	UNSPECIFIED
Package form	UNCASED CHIP
power	NO
power supply	2.7/10 V
Programmable power	NO
Certification status	Not Qualified
Nominal slew rate	0.015 V/us
Supply voltage upper limit	11 V
Nominal supply voltage (Vsup)	2.7 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	NO LEAD
Terminal location	UPPER
Nominal Uniform Gain Bandwidth	40 kHz
broadband	NO

	LMC7111MWC	LMC7111MDC
Description	IC OP-AMP, 0.04 MHz BAND WIDTH, UUC, WAFER, Operational Amplifier	IC OP-AMP, 0.04 MHz BAND WIDTH, UUC, DIE, Operational Amplifier
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）
Parts packaging code	WAFER	WAFER
package instruction	DIE, DIE OR CHIP	DIE, DIE OR CHIP
Reach Compliance Code	unknown	unknown
ECCN code	EAR99	EAR99
Amplifier type	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK
frequency compensation	YES	YES
JESD-30 code	X-XUUC-N	X-XUUC-N
low-bias	YES	YES
low-dissonance	NO	NO
micropower	YES	YES
Number of functions	1	1
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIE	DIE
Encapsulate equivalent code	DIE OR CHIP	DIE OR CHIP
Package shape	UNSPECIFIED	UNSPECIFIED
Package form	UNCASED CHIP	UNCASED CHIP
power	NO	NO
power supply	2.7/10 V	2.7/10 V
Programmable power	NO	NO
Certification status	Not Qualified	Not Qualified
Nominal slew rate	0.015 V/us	0.015 V/us
Supply voltage upper limit	11 V	11 V
Nominal supply voltage (Vsup)	2.7 V	2.7 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal form	NO LEAD	NO LEAD
Terminal location	UPPER	UPPER
Nominal Uniform Gain Bandwidth	40 kHz	40 kHz
broadband	NO	NO

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