EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

SN74AUC2G06YZPR

Description
Dual Inverter Buffer/Driver with Open Drain Outputs 6-DSBGA -40 to 85
Categorylogic    logic   
File Size952KB,17 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
Stay tuned Parametric Compare

SN74AUC2G06YZPR Online Shopping

Suppliers Part Number Price MOQ In stock  
SN74AUC2G06YZPR - - View Buy Now

SN74AUC2G06YZPR Overview

Dual Inverter Buffer/Driver with Open Drain Outputs 6-DSBGA -40 to 85

SN74AUC2G06YZPR Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeBGA
package instructionVFBGA, BGA6,2X3,20
Contacts6
Reach Compliance Codecompli
ECCN codeEAR99
seriesAUC
JESD-30 codeR-XBGA-B6
JESD-609 codee1
length1.4 mm
Load capacitance (CL)15 pF
Logic integrated circuit typeINVERTER
MaximumI(ol)0.009 A
Humidity sensitivity level1
Number of functions2
Number of entries1
Number of terminals6
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output characteristicsOPEN-DRAIN
Package body materialUNSPECIFIED
encapsulated codeVFBGA
Encapsulate equivalent codeBGA6,2X3,20
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packingTR
Peak Reflow Temperature (Celsius)260
power supply1.2/2.5 V
Maximum supply current (ICC)0.01 mA
Prop。Delay @ Nom-Su3.3 ns
propagation delay (tpd)3.3 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height0.5 mm
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)0.8 V
Nominal supply voltage (Vsup)1.2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.5 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width0.9 mm
Base Number Matches1

SN74AUC2G06YZPR Related Products

SN74AUC2G06YZPR SN74AUC2G06DBVR SN74AUC2G06DCKR SN74AUC2G06YEPR
Description Dual Inverter Buffer/Driver with Open Drain Outputs 6-DSBGA -40 to 85 Dual Inverter Buffer/Driver with Open Drain Outputs 6-SOT-23 -40 to 85 Dual Inverter Buffer/Driver with Open Drain Outputs 6-SC70 -40 to 85 IC INVERTER 2CH 2-INP 6DSBGA
Is it Rohs certified? conform to conform to conform to incompatible
Parts packaging code BGA SOT-23 SOIC BGA
package instruction VFBGA, BGA6,2X3,20 LSSOP, TSOP6,.11,37 TSSOP, TSSOP6,.08 VFBGA, BGA6,2X3,20
Contacts 6 6 6 6
Reach Compliance Code compli compli compli not_compliant
series AUC AUC AUC AUC
JESD-30 code R-XBGA-B6 R-PDSO-G6 R-PDSO-G6 R-XBGA-B6
length 1.4 mm 2.9 mm 2 mm 1.4 mm
Load capacitance (CL) 15 pF 15 pF 15 pF 15 pF
Logic integrated circuit type INVERTER INVERTER INVERTER INVERTER
MaximumI(ol) 0.009 A 0.009 A 0.009 A 0.005 A
Number of functions 2 2 2 2
Number of entries 1 1 1 1
Number of terminals 6 6 6 6
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Output characteristics OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN
Package body material UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED
encapsulated code VFBGA LSSOP TSSOP VFBGA
Encapsulate equivalent code BGA6,2X3,20 TSOP6,.11,37 TSSOP6,.08 BGA6,2X3,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing TR TR TR TAPE AND REEL
Peak Reflow Temperature (Celsius) 260 260 260 NOT SPECIFIED
power supply 1.2/2.5 V 1.2/2.5 V 1.2/2.5 V 1.2/2.5 V
propagation delay (tpd) 3.3 ns 3.3 ns 3.3 ns 3.3 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 0.5 mm 1.45 mm 1.1 mm 0.5 mm
Maximum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V
Minimum supply voltage (Vsup) 0.8 V 0.8 V 0.8 V 0.8 V
Nominal supply voltage (Vsup) 1.2 V 1.2 V 1.2 V 1.2 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL GULL WING GULL WING BALL
Terminal pitch 0.5 mm 0.95 mm 0.65 mm 0.5 mm
Terminal location BOTTOM DUAL DUAL BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 0.9 mm 1.6 mm 1.25 mm 0.9 mm
Brand Name Texas Instruments Texas Instruments Texas Instruments -
Is it lead-free? Lead free Lead free Lead free -
ECCN code EAR99 EAR99 EAR99 -
JESD-609 code e1 e4 e4 -
Humidity sensitivity level 1 1 1 -
Maximum supply current (ICC) 0.01 mA 0.01 mA 0.01 mA -
Prop。Delay @ Nom-Su 3.3 ns 3.3 ns 3.3 ns -
Schmitt trigger NO NO NO -
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) -
Maker - Texas Instruments Texas Instruments Texas Instruments
Factory Lead Time - 1 week 1 week 1 week
The chip on the camera fell out. How to solder it?
There was a little bit of cold soldering, so I took it off, but the solder got lost, and I don't know how to solder it back on. You can't buy such a tin mesh...
sky999 Integrated technical exchanges
[Evaluation and experience of Zhongke Yihaiwei EQ6HL45 development platform] +07.USB test and simulation (zmj)
[Evaluation and experience of Zhongke Yihaiwei EQ6HL45 development platform] +07.USB test and simulation (zmj) The Zhongke Yihaiwei EQ6HL45 development platform contains a USB2.0 communication interfa...
卿小小 Domestic Chip Exchange
R2L1 reports an error "Insufficient RAM for Flash Algorithms" when downloading in Keil5!
The specific situation is a bit confusing, see the picture....
ylyfxzsx Renesas Electronics MCUs
Please tell me what is the principle of the battery anti-passivation function in the microcontroller and how to achieve it
Please tell me what is the principle and how to implement the battery anti-passivation function in the microcontroller...
一沙一世 stm32/stm8
The HPM6700 series of domestic core processors has been merged into the main repository code of the OpenHarmony community
The code for the HPM6700 series high-performance MCU general development board has been completed and merged into the OpenAtom OpenHarmony ("OpenHarmony") trunk. This means that Pioneer Semiconductor ...
谍纸天眼 Domestic Chip Exchange
Permanent magnet synchronous motor vector control experiment sharing based on HIL+RCP
What I want to share with you today is the permanent magnet synchronous motor vector control experiment based on HIL+RCP of Senmu Leishi EasyGO. As you can see, this is the model file of easygo netbox...
smls_小森 Test/Measurement

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1762  1518  1147  760  1287  36  31  24  16  26 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号