SN74AUC2G08YZPR datasheet, PDF

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SN74AUC2G08YZPR: DescriptionDUAL 2-INPUT POSITIVE-AND GATE 8-DSBGA -40 to 85; Categorylogic logic; File Size920KB，17 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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SN74AUC2G08YZPR Overview

DUAL 2-INPUT POSITIVE-AND GATE 8-DSBGA -40 to 85

SN74AUC2G08YZPR Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	VFBGA, BGA8,2X4,20
Contacts	8
Reach Compliance Code	compli
ECCN code	EAR99
Factory Lead Time	1 week
series	AUC
JESD-30 code	R-XBGA-B8
JESD-609 code	e1
length	1.9 mm
Load capacitance (CL)	15 pF
Logic integrated circuit type	AND GATE
MaximumI(ol)	0.009 A
Humidity sensitivity level	1
Number of functions	2
Number of entries	2
Number of terminals	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	VFBGA
Encapsulate equivalent code	BGA8,2X4,20
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing	TR
Peak Reflow Temperature (Celsius)	260
power supply	1.2/2.5 V
Maximum supply current (ICC)	0.01 mA
Prop。Delay @ Nom-Su	3 ns
propagation delay (tpd)	3 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	0.5 mm
Maximum supply voltage (Vsup)	2.7 V
Minimum supply voltage (Vsup)	0.8 V
Nominal supply voltage (Vsup)	1.2 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	0.9 mm

SN74AUC2G08YZPR Related Products

	SN74AUC2G08YZPR	SN74AUC2G08DCTR	SN74AUC2G08DCTRE4	SN74AUC2G08DCTRG4	SN74AUC2G08DCUR	SN74AUC2G08DCURG4
Description	DUAL 2-INPUT POSITIVE-AND GATE 8-DSBGA -40 to 85	DUAL 2-INPUT POSITIVE-AND GATE 8-SM8 -40 to 85	DUAL 2-INPUT POSITIVE-AND GATE 8-SM8 -40 to 85	DUAL 2-INPUT POSITIVE-AND GATE 8-SM8 -40 to 85	DUAL 2-INPUT POSITIVE-AND GATE 8-VSSOP -40 to 85	DUAL 2-INPUT POSITIVE-AND GATE 8-VSSOP -40 to 85
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	BGA	SOIC	SOIC	SOIC	SOIC	SOIC
package instruction	VFBGA, BGA8,2X4,20	LSSOP, SSOP8,.16	LSSOP, SSOP8,.16	LSSOP, SSOP8,.16	VSSOP-8	VSSOP, TSSOP8,.12,20
Contacts	8	8	8	8	8	8
Reach Compliance Code	compli	compli	compli	compli	compliant	compli
Factory Lead Time	1 week	1 week	1 week	6 weeks	1 week	6 weeks
Is it lead-free?	Lead free	Lead free	-	Lead free	Lead free	Lead free
series	AUC	AUC	AUC	AUC	AUC	-
JESD-30 code	R-XBGA-B8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	-
JESD-609 code	e1	e4	e4	e4	e4	-
length	1.9 mm	2.95 mm	2.95 mm	2.95 mm	2.3 mm	-
Load capacitance (CL)	15 pF	15 pF	15 pF	15 pF	15 pF	-
Logic integrated circuit type	AND GATE	AND GATE	AND GATE	AND GATE	AND GATE	-
MaximumI(ol)	0.009 A	0.009 A	0.005 A	0.009 A	0.009 A	-
Humidity sensitivity level	1	1	1	1	1	-
Number of functions	2	2	2	2	2	-
Number of entries	2	2	2	2	2	-
Number of terminals	8	8	8	8	8	-
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	-
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-
Output characteristics	3-STATE	3-STATE	3-STATE	-	3-STATE	-
Package body material	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	VFBGA	LSSOP	LSSOP	LSSOP	VSSOP	-
Encapsulate equivalent code	BGA8,2X4,20	SSOP8,.16	SSOP8,.16	SSOP8,.16	TSSOP8,.12,20	-
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	-
method of packing	TR	TR	TAPE AND REEL	TR	TR	-
Peak Reflow Temperature (Celsius)	260	260	260	260	260	-
power supply	1.2/2.5 V	1.2/2.5 V	1.2/2.5 V	1.2/2.5 V	1.2/2.5 V	-
Maximum supply current (ICC)	0.01 mA	0.01 mA	-	0.01 mA	0.01 mA	-
Prop。Delay @ Nom-Su	3 ns	3 ns	3 ns	3 ns	-	-
propagation delay (tpd)	3 ns	3 ns	3 ns	3 ns	3 ns	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
Schmitt trigger	NO	NO	NO	NO	NO	-
Maximum seat height	0.5 mm	1.3 mm	1.3 mm	1.3 mm	0.9 mm	-
Maximum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	-
Minimum supply voltage (Vsup)	0.8 V	0.8 V	0.8 V	0.8 V	0.8 V	-
Nominal supply voltage (Vsup)	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	-
surface mount	YES	YES	YES	YES	YES	-
technology	CMOS	CMOS	CMOS	CMOS	CMOS	-
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	-
Terminal form	BALL	GULL WING	GULL WING	GULL WING	GULL WING	-
Terminal pitch	0.5 mm	0.65 mm	0.65 mm	0.65 mm	0.5 mm	-
Terminal location	BOTTOM	DUAL	DUAL	DUAL	DUAL	-
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
width	0.9 mm	2.8 mm	2.8 mm	2.8 mm	2 mm	-

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