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MAX2354ETI

Description
TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC28, 5 X 5 MM, 0.80 MM HEIGHT, TQFN-28
CategoryWireless rf/communication    Telecom circuit   
File Size1MB,32 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
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MAX2354ETI Overview

TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC28, 5 X 5 MM, 0.80 MM HEIGHT, TQFN-28

MAX2354ETI Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
MakerRochester Electronics
Parts packaging codeQFN
package instruction5 X 5 MM, 0.80 MM HEIGHT, TQFN-28
Contacts28
Reach Compliance Codeunknown
JESD-30 codeS-XQCC-N28
JESD-609 codee0
length5 mm
Humidity sensitivity level1
Number of functions1
Number of terminals28
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialUNSPECIFIED
encapsulated codeHVQCCN
Package shapeSQUARE
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)240
Certification statusCOMMERCIAL
Maximum seat height0.9 mm
Nominal supply voltage2.75 V
surface mountYES
technologyBICMOS
Telecom integrated circuit typesRF AND BASEBAND CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature20
width5 mm
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