EEWORLDEEWORLDEEWORLD

Part Number

Search

S72WS01GSF0YHMJ53

Description
Memory Circuit, Flash+SDRAM, 32MX16, CMOS, PBGA186, 11 X 13 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-186
Categorystorage    storage   
File Size591KB,12 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Environmental Compliance
Download Datasheet Parametric View All

S72WS01GSF0YHMJ53 Overview

Memory Circuit, Flash+SDRAM, 32MX16, CMOS, PBGA186, 11 X 13 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-186

S72WS01GSF0YHMJ53 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSPANSION
Parts packaging codeBGA
package instructionTFBGA, BGA186,13X17,25
Contacts186
Reach Compliance Codeunknown
Maximum access time100 ns
Other features512 MBIT SDRAM
JESD-30 codeR-PBGA-B186
length13 mm
memory density536870912 bit
Memory IC TypeMEMORY CIRCUIT
memory width16
Mixed memory typesFLASH+SDRAM
Number of functions1
Number of terminals186
word count33554432 words
character code32000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
organize32MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA186,13X17,25
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
power supply1.8 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formBALL
Terminal pitch0.65 mm
Terminal locationBOTTOM
width11 mm
S72WS-S based MCP Products
1.8 Volt-only x16 Flash Memory and SDRAM on Split Bus
Simultaneous Read/Write, Burst Mode MirrorBit
®
Eclipse
NOR
Flash on Bus 1 Mobile SDRAM on Bus 2
Data Sheet
(Advance Information)
S72WS-S based MCP Products Cover Sheet
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Notice On Data Sheet Designations
for definitions.
Publication Number
S72WS-S_00
Revision
02
Issue Date
August 12, 2008

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2209  2130  550  341  148  45  43  12  7  3 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号