EEWORLDEEWORLDEEWORLD

Part Number

Search

DPS256X32BV3-30M

Description
SRAM Module, 256KX32, 30ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66
Categorystorage    storage   
File Size618KB,7 Pages
ManufacturerTwilight Technology Inc.
Download Datasheet Parametric View All

DPS256X32BV3-30M Overview

SRAM Module, 256KX32, 30ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66

DPS256X32BV3-30M Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerTwilight Technology Inc.
Parts packaging codePGA
package instructionPGA,
Contacts66
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Maximum access time30 ns
Spare memory width16
JESD-30 codeS-CPGA-P66
memory density8388608 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals66
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize256KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height10.16 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Maximum time at peak reflow temperatureNOT SPECIFIED
512Kx16/256Kx32, 20 - 45ns, PGA
30A044-03
F
8 Megabit High Speed CMOS SRAM
DPS256X32CV3/DPS256X32BV3
DESCRIPTION:
The DPS256X32CV3/DPS256X32BV3 ‘’VERSA-STACK’’ module is a
revolutionary new high speed memory subsystem using Dense-Pac
Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted
on a co-fired ceramic substrate. It offers 8 Megabits of SRAM in a package
envelope of 1.09 x 1.09 x 0.40 inches.
The DPS256X32CV3/DPS256X32BV3 contains eight individual 128K x 8
SRAMs, packaged in their own hermetically sealed SLCCs making the
module suitable for commercial, industrial and military applications.
The DPS256X32BV3 has one active low Chip Enable (CE) and while the
DPS256X32CV3 an active low Chip Enable (CE) and an active high Select
Line (SEL).
By using SLCCs, the ‘’Versa-Stack’’ family of modules offers a higher board
density of memory than available with conventional through-hole, surface
mount, module, or hybrid techniques.
FEATURES:
Organizations Available:
256K x 32, or 512 x 16
Access Times:
20, 25, 30, 35, 45ns
Fully Static Operation
- No clock or refresh required
Low Power Dissipation:
16mW (typ.) Full Standby
1.0W (typ.) Operating (x8)
Single +5V Power Supply,
±10%
Tolerance
TTL Compatible
Common Data Inputs and Outputs
Low Data Retention Current:
80µA typ. (2.0V)
66-Pin PGA ‘’VERSA-STACK’’
Package
FUNCTIONAL BLOCK DIAGRAM
PIN-OUT DIAGRAM
PIN NAMES
A0 - A16
I/O0 - I/O31
CE0 - CE7
SEL0, SEL1
WE
OE
V
DD
V
SS
Address Inputs
Data Input/Output
Low Chip Enables
High Chip Enables
Write Enable
Output Enable
Power (+5V)
Ground
NOTE:
SEL0 and SEL1 applies to DPS256X32CV3 version only, No Connect for the
DPS256X32BV3 version.
30A044-03
REV. F
This document contains information on a product that is currently released
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
1
Very popular Bluetooth dialer solution
I saw the Bluetooth dialer upgrade solution of Shanghai Qualcomm at the IC-china exhibition not long ago , and then I also saw the Bluetooth dialer solution of CEC at the China Electronics Show in rec...
鲁宾汗 Integrated technical exchanges
Please help with the mouse failure and inaccurate touch screen under QT4!
Help with the mouse failure and inaccurate touch under QT4! Yesterday, when I ran the QT4 (self-compiled 4.8.6) sample program on the board, the touch point was inaccurate, so I used the mouse instead...
yuanlai2010 Embedded System
Using MSP430 to measure temperature and display it on LCD
I am a beginner and just started to learn msp430. I have a launchpad and want to use it to measure the external temperature and display it on LCD. I can't find any ideas at the beginning. First of all...
msp430learner Microcontroller MCU
[MIL Edge AI Computing Box FZ5 Review] First Impression of "Image Recognition"
Mir Edge AI Computing Box FZ5 Unboxing Experience:After checking the contents of the box and the packing list, I found the following in the photo. (The TF card is 32G and is inserted into the host.) A...
bigbat Embedded System
Remote control design issues based on nRF24LE1
I don't know how to do it, why can't I just upload the picture? ? Let's get back to the topic: This is the drawing that the customer provided us to modify for making an 11-key remote control. I don't ...
hwx-555 MCU
Three practical tips for optimizing EVM measurements of wideband signals
Error vector magnitude (EVM) measurements can help engineers gain insight into the performance of digital communication transmitters and receivers. For digitally modulated signals, any signal imperfec...
eric_wang Integrated technical exchanges

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2154  2286  692  199  194  44  47  14  5  4 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号