DPS256X16CA3-25B datasheet, PDF

DPS256X16CA3-25B: DescriptionSRAM Module, 512KX8, 25ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50; Categorystorage storage; File Size229KB，10 Pages; ManufacturerTwilight Technology Inc.

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DPS256X16CA3-25B Overview

SRAM Module, 512KX8, 25ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Twilight Technology Inc.
Parts packaging code	PGA
package instruction	APGA, PGA50,5X10
Contacts	50
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	25 ns
Other features	USER CONFIGURABLE AS 256K X 16
I/O type	COMMON
JESD-30 code	R-CPGA-P50
length	25.146 mm
memory density	4194304 bit
Memory IC Type	SRAM MODULE
memory width	8
Number of functions	1
Number of terminals	50
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512KX8
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	APGA
Encapsulate equivalent code	PGA50,5X10
Package shape	RECTANGULAR
Package form	GRID ARRAY, PIGGYBACK
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum seat height	11.9888 mm
Maximum standby current	0.0072 A
Minimum standby current	2 V
Maximum slew rate	0.39 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED
width	13.716 mm

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