RC28F320C3BA110 datasheet, PDF

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RC28F320C3BA110: DescriptionFlash, 2MX16, 110ns, PBGA64, LEAD FREE, BGA-64; Categorystorage storage; File Size638KB，70 Pages; ManufacturerNumonyx ( Micron ); Websitehttps://www.micron.com

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RC28F320C3BA110 Overview

Flash, 2MX16, 110ns, PBGA64, LEAD FREE, BGA-64

RC28F320C3BA110 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Numonyx ( Micron )
Parts packaging code	BGA
package instruction	TBGA, BGA64,8X8,40
Contacts	64
Reach Compliance Code	unknown
ECCN code	3A991.B.1.A
Maximum access time	110 ns
Other features	USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK
startup block	BOTTOM
command user interface	YES
Universal Flash Interface	YES
Data polling	NO
JESD-30 code	R-PBGA-B64
length	13 mm
memory density	33554432 bit
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of departments/size	8,63
Number of terminals	64
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TBGA
Encapsulate equivalent code	BGA64,8X8,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.8/3.3,3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Department size	4K,32K
Maximum standby current	0.000025 A
Maximum slew rate	0.018 mA
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	NO
type	NOR TYPE
width	10 mm

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Numonyx™ Advanced+ Boot Block Flash

Memory (C3)

28F800C3, 28F160C3, 28F320C3 (x16)

Datasheet

Product Features

Flexible SmartVoltage Technology

— 2.7 V– 3.6 V read/program/erase

— 12 V for fast production programming

1.65 V to 2.5 V or 2.7 V to 3.6 V I/O Option

— Reduces overall system power

High Performance

— 2.7 V– 3.6 V: 70 ns max access time

Optimized Architecture for Code Plus Data

Storage

— Eight 4 Kword blocks, top or bottom

parameter boot

— Up to 127 x 32 Kword blocks

— Fast program suspend capability

— Fast erase suspend capability

Flexible Block Locking

— Lock/unlock any block

— Full protection on power-up

— Write Protect (WP#) pin for hardware block

protection

Low Power Consumption

— 9 mA typical read

— 7 uA typical standby with Automatic Power

Savings feature

Extended Temperature Operation

— -40 °C to +85 °C

128-bit Protection Register

— 64 bit unique device identifier

— 64 bit user programmable OTP cells

Extended Cycling Capability

— Minimum 100,000 block erase cycles

Software

— Supported by Numonyx Advanced Flash

File Managers -- Numonyx™ VFM,

Numonyx™ FDI, etc.

— Code and data storage in the same

memory device

— Robust Power Loss Recovery for Data Loss

Prevention

— Common Flash Interface

Standard Surface Mount Packaging

— 48-Ball

μBGA*/VFBGA

— 64-Ball Easy BGA packages

— 48-TSOP package

Intel ETOX* VIII (0.13

μm)

Flash Technology

— 8, 16, 32 Mbit

Intel ETOX* VII (0.18

μm)

Flash Technology

— 16, 32 Mbit

Intel ETOX* VI (0.25

μm)

Flash Technology

— 8, 16 and 32 Mbit

290645-24

March 2008

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH NUMONYX™ PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR

OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN NUMONYX'S TERMS AND

CONDITIONS OF SALE FOR SUCH PRODUCTS, NUMONYX ASSUMES NO LIABILITY WHATSOEVER, AND NUMONYX DISCLAIMS ANY EXPRESS OR IMPLIED

WARRANTY, RELATING TO SALE AND/OR USE OF NUMONYX PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A

PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Numonyx

products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications.

Legal Lines and Disclaimers

Numonyx B.V. may make changes to specifications and product descriptions at any time, without notice.

Numonyx B.V. may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented

subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or

otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Numonyx reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

Contact your local Numonyx sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Numonyx literature may be obtained by visiting the

Numonyx website at

http://www.numonyx.com.

Numonyx, the Numonyx logo, and StrataFlash are trademarks or registered trademarks of Numonyx B.V. or its subsidiaries in other countries.

*Other names and brands may be claimed as the property of others.

Datasheet

March 2008

290645-24

C3 Discrete

Contents

1.0

Introduction

.............................................................................................................. 7

1.1

Nomenclature ..................................................................................................... 7

1.2

Conventions ....................................................................................................... 8

Functional Overview

.................................................................................................. 9

2.1

Product Overview ................................................................................................ 9

2.2

Block Diagram .................................................................................................. 10

2.3

Memory Map..................................................................................................... 10

Package Information

............................................................................................... 13

3.1

mBGA* and VF BGA Package .............................................................................. 13

3.2

TSOP Package................................................................................................... 14

3.3

Easy BGA Package............................................................................................. 15

Ballout and Signal Descriptions

............................................................................... 16

4.1

48-Lead TSOP Package ...................................................................................... 16

4.2

64-Ball Easy BGA Package .................................................................................. 19

4.3

Signal Descriptions ............................................................................................ 19

Maximum Ratings and Operating Conditions............................................................

5.1

Absolute Maximum Ratings................................................................................. 21

5.2

Operating Conditions ......................................................................................... 21

Electrical Specifications

........................................................................................... 23

6.1

Current Characteristics....................................................................................... 23

6.2

DC Voltage Characteristics.................................................................................. 24

AC Characteristics

................................................................................................... 26

7.1

AC Read Characteristics ..................................................................................... 26

7.2

AC Write Characteristics ..................................................................................... 30

7.3

Erase and Program Timings ................................................................................ 34

7.4

AC I/O Test Conditions....................................................................................... 34

7.5

Device Capacitance ........................................................................................... 35

Power and Reset Specifications

............................................................................... 36

8.1

Active Power (Program/Erase/Read) .................................................................... 36

8.2

Automatic Power Savings (APS) .......................................................................... 36

8.3

Standby Power.................................................................................................. 36

8.4

Deep Power-Down Mode..................................................................................... 36

8.5

Power and Reset Considerations .......................................................................... 37

8.5.1 Power-Up/Down Characteristics................................................................ 37

8.5.2 RP# Connected to System Reset .............................................................. 37

8.5.3 VCC, VPP and RP# Transitions.................................................................. 37

8.5.4 Reset Specifications................................................................................ 37

8.6

Power Supply Decoupling ................................................................................... 38

Device Operations

................................................................................................... 39

9.1

Bus Operations ................................................................................................. 39

9.1.1 Read .................................................................................................... 39

9.1.2 Write .................................................................................................... 39

9.1.3 Output Disable ....................................................................................... 39

9.1.4 Standby ................................................................................................ 39

9.1.5 Reset.................................................................................................... 40

2.0

3.0

4.0

5.0

6.0

7.0

8.0

9.0

10.0 Modes of Operation

................................................................................................. 41

March 2008

290645-24

Datasheet

C3 Discrete

10.1

10.2

10.3

Read Mode........................................................................................................41

10.1.1 Read Array ............................................................................................41

10.1.2 Read Identifier .......................................................................................41

10.1.3 CFI Query ..............................................................................................42

10.1.4 Read Status Register...............................................................................42

10.1.4.1 Clear Status Register .................................................................43

Program Mode...................................................................................................43

10.2.1 12-Volt Production Programming ..............................................................43

10.2.2 Suspending and Resuming Program ..........................................................44

Erase Mode .......................................................................................................44

10.3.1 Suspending and Resuming Erase ..............................................................44

11.0 Security Modes

........................................................................................................48

11.1 Flexible Block Locking.........................................................................................48

11.1.1 Locking Operation...................................................................................48

11.1.1.1 Locked State ............................................................................49

11.1.1.2 Unlocked State .........................................................................49

11.1.1.3 Lock-Down State.......................................................................49

11.2 Reading Block-Lock Status ..................................................................................49

11.3 Locking Operations during Erase Suspend .............................................................49

11.4 Status Register Error Checking ............................................................................50

11.5 128-Bit Protection Register .................................................................................50

11.5.1 Reading the Protection Register ................................................................50

11.5.2 Programming the Protection Register.........................................................51

11.5.3 Locking the Protection Register.................................................................51

11.6 V

Program and Erase Voltages ..........................................................................51

11.6.1 Program Protection .................................................................................51

Datasheet

March 2008

290645-24

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