Bulletin I0131J 09/00
IR150DG..HCB SERIES
HIGH POWER RECTIFIER DIODES
Junction Size:
Wafer Size:
V
RRM
Class:
Passivation Process:
Reference IR Packaged Part:
Square 150 mils
4"
600 and 1200 V
Glassivated MESA
12F Series
Major Ratings and Characteristics
Parameters
V
FM
V
RRM
Maximum Forward Voltage
Reverse Breakdown Voltage Range
Units
1100 mV
600 and 1200 V
Test Conditions
T
J
= 25°C I
F
= 25A
T
J
= 25°C I
R
= 100µA
(1)
(1)
Nitrogen flow on die edge.
Mechanical Characteristics
Nominal Back Metal Composition, Thickness
Nominal Front Metal Composition, Thickness
Chip Dimensions
Wafer Diameter
Wafer Thickness
Maximum Width of Sawing Line
Reject Ink Dot Size
Ink Dot Location
Recommended Storage Environment
Cr - Ni - Ag (1 KA - 4 KA - 6 KA)
Cr - Ni - Ag (1 KA - 4 KA - 6 KA)
150 x 150 mils (see drawing)
100 mm, with std. < 110 > flat
300 µm
130 µm
0.25 mm diameter minimum
See drawing
Storage in original container, in dessicated
nitrogen, with no contamination
1
IR150DG..HCB Series
Bulletin I0131J 09/00
Ordering Information Table
Device Code
IR
1
1
2
3
4
5
6
7
-
-
-
-
-
-
-
International Rectifier Device
Chip Dimension in Mils
150
2
D
3
G
4
12
5
H
6
CB
7
Type of Device: D = Standard Recovery Diode
Passivation Process: G = Glassivated MESA
Voltage code: Code x 100 = V
RRM
Metallization: H = Silver (Anode) - Silver (Cathode)
Probed Uncut Die
Available Class
06 =
600V
12 = 1200V
Outline Table
All dimensions are in millimeters
2