TE Connectivity are the leading European supplier of standard and custom designed
aluminium housed resistors for general-purpose use, power supplies, power generation
and the traction industry. The HS is a range of extremely stable, high quality wire wound
resistors capable of dissipating high power in a limited space with relatively low surface
temperature. The power is rapidly dissipated as heat through the aluminium housing to a
specified heatsink.
The resistors are made from quality materials for optimum reliability and stability. TE can
test resistors to conform to relevant international, MIL or customer specifications.
TE are happy to advise on the use of resistors for pulse applications and to supply
information for high voltage use and low-ohmic value, alternative mountings and
termination type.
Characteristics - Electrical
HSA & HSC - 5 Watts to 75 Watts
HSA5
Dissipation @ 25°C with Heatsink (Watts):
Without Heatsink:
Ohmic Value Min (Ohms):
Max:
Max. Working Voltage (DC or ACrms) Volts:
Dielectric Strength (AC Peak) Volts:
Stability (% resistance change, 1000 hours) (%):
Standard Heatsink - Area (mm ):
2
HSA10
16
8
R01
15K
265
1400
1
41500
1
2 hole
HSA25
25
12.5
R01
36K
550
2500
1
53500
1
2 hole
HSA50
50
20
R01
100K
1250
2500
1
53500
1
2 hole
HSC75
75
45
R05
50K
1400
5000
2
99500
3
4 hole
10
5.5
R01
10K
160
1400
1
41500
1
2 hole
Thickness (mm):
Number of Mounting Holes:
Characteristics - Electrical
HSC - 100 Watts to 300 Watts
HSC100
Dissipation @ 25°C with Heatsink (Watts):
Without Heatsink:
Ohmic Value Min (Ohms):
Max:
Max. Working Voltage (DC or ACrms) Volts:
Dielectric Strength (AC Peak) Volts:
Stability (% resistance change, 1000 hours) (%):
Standard Heatsink - Area (mm ):
2
HSC150
150
55
R10
100K
2500
5000
2
99500
3
4 hole
HSC200
200
50
R10
50K
1900
5600
3
375000
3
6 hole
HSC250
250
60
R10
68K
2200
5600
3
476500
3
6 hole
HSC300
300
75
R10
82K
2500
5600
3
578000
3
6 hole
100
50
R05
100K
1900
5000
2
99500
3
4 hole
Thickness (mm):
Number of Mounting Holes:
1773035 CIS BI 10/2011
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are standard equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
For email, phone or live chat, go to:
te.com/help
Aluminium Housed Power Resistors
Type HS Series
Characteristics - Electrical
Long Term Stability:
For improvements in long-term stability, resistors must be derated
as follows; for 50% of stated ΔR maximum dissipation must not
exceed 70% of rating; for 25% of stated ΔR maximum, dissipation
must not exceed 50% of rating
Insulation Resistance:
Heat Dissipation:
Dry: 10,000MΩ minimum. After moisture test: 1000MΩ minimum.
Although the use of proprietary heat sinks with lower thermal
resistance is acceptable, up rating is not recommended.
The use of proprietary heat sink compound to improve thermal
conductivity is recommended for optimum performance of all
sizes but essential for HSC200, HSC250 & HSC300
Specification:
Temperature coefficient below 100R, 50ppm/°C
Temperature coefficient above 100R, 30ppm/°C
Tolerance, 5% standard: 10%, 3%, 2%, 0.5% & 0.25% available
Tolerance for values below R10, 10% standard
Derating Curve HSA5 to HSA50
60
50
40
30
20
HSA50
Power (W)
HSA25
HSA10
10
HSA5
0
0
25
50
75
100 125 150 175 200
Heatsink Temp. (degC)
225
250 275
Derating Curve HSC75 to HSC300
350
300
250
Power (W)
200
150
100
50
0
HSC300
HSC250
HSC200
HSC150
HSC100
HSC75
0
25
50
75
100 125 150 175 200
Heatsink Temp. (degC)
225
250 275
Pulse Energy HSA5 to HSC75
400
Pulse Energy (Joules)
350
300
250
200
150
100
50
0
0.01
0.1
HSA5
1
10
100
1000
HSA50
10000
100000
Resistance (Ohms)
HSA10
HSA25
HSC75
1773035 CIS BI 10/2011
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are standard equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
For email, phone or live chat, go to:
te.com/help
Aluminium Housed Power Resistors
Type HS Series
Pulse Energy HSC100 to HSC300
2000
1800
1600
1400
1200
1000
800
600
400
200
0
0.01
Pulse Energy (Joules)
0.1
HSC100
1
10
100
1000
10000
100000
Resistance (Ohms)
HSC150
HSC200
HSC250
HSC300
Power Overload
30
Multiples of Rated Power
25
20
15
10
5
0
0.1 1 2
3
4
5
6 7 8 9 10 11 12 13 14 20 25 30 40 60
Duration of Overload (secs)
This graph indicates the amount that the rated power (at 20°C) of the
standard HS Series resistor may be increased for overloads of 100mS to 60S
Surface Temperature Rise
200
HSC300
Surface Temp. Rise (°C)
HSC250
HSA50
HSA25
HSC100
HSC75
HSA10
HSA5
HSC150
HSC200
100
0
0 20
60
100
150
200
250
300
Power Dissipation (Watts)
For resistor mounted on standard heatsink, related to power dissipation
Product Specifications -
HSA5 - HSC150
L
HSC200 - HSC300
20.0
4.0
Thread M6
5.0
25.0
Type
HSA5, 10
HSA25, 50
HSC75, 100, 150
L
7
10
8
1773035 CIS BI 10/2011
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are standard equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
For email, phone or live chat, go to:
te.com/help
Aluminium Housed Power Resistors
Type HS Series
Dimensions -
HSA5 - HSA50
M
L
H
R
HSC75 - HSC150
M
L
H
N
J
2 x Mounting Hole
HSA5 - 2.4mm
HSA10 - 2.4mm
HSA25 - 3.3mm
HSA50 - 3.3mm
4 x Mounting Hole
HSC75 - 4.4mm
HSC100 - 4.4mm
HSC150 - 4.4mm
HSC200+
M
L
H
H
R
N
6 x Mounting Hole
HSC200 - 5.3mm
HSC250 - 5.3mm
HSC300 - 6.5mm
N
J
J
R
P
Type
HSA5
HSA10
HSA25
HSA50
HSC75
HSC100
HSC150
HSC200
HSC250
HSC300
H±0.3
11.3
14.3
18.3
39.7
29.0
35.0
58.0
35.0
44.5
52.0
J±0.3
12.4
15.9
19.8
21.4
37.0
37.0
37.0
57.2
57.2
59.0
K±0.2
2.4
2.4
3.3
3.3
4.4
4.4
4.4
5.3
5.3
6.5
L Max
17.0
21.0
29.0
51.0
49.0
65.5
98.0
90.0
109.0
128.0
M Max
30.0
36.5
51.0
72.5
71.0
87.5
122.0
143.0
163.0
180.0
N Max
17.0
21.0
28.0
30.0
47.5
47.5
47.5
73.0
73.0
73.0
P Max
9.0
11.0
15.0
17.0
26.0
26.0
26.0
42.0
42.0
42.0
U
R Min
1.9
1.9
2.8
2.8
5.0
5.0
5.0
5.6
5.6
5.6
T±0.5
4.3
5.2
7.2
8.2
11.5
11.5
11.5
20.25
20.25
20.25
U Max
2.5
3.2
3.2
3.2
3.5
3.5
3.5
5.3
5.3
5.3
How to Order
HS
Common Part
HS - Standard
NHS - Low
Inductance
A
Mounting Style
A - Single
Opposing
mounting Feet
B - Flange One
Side
C - Flange Two
Sides
50
Power Rating
10
16
25
50
75
Watt
Watt
Watt
Watt
Watt
= HSA5
= HSA10
= HSA25
= HSA50
= HSA75
etc
680R
Resistance Value
0.1ohm
(100 mille ohms)
R10
1ohm
(1000 mille ohms)
1R0
1K
(1000 ohms)
1KO
J
Tolerance
F - 1%
G - 2%
E - 3%
J - 5%
K - 10%
TE Connectivity, TE connectivity (logo) and TE (logo) are trademarks.
Other logos, product and Company names mentioned herein may be trademarks of their respective owners.
While TE has made every reasonable effort to ensure the accuracy of the information in this datasheet, TE does not guarantee that it is error-free, nor does TE make any other
representation, warranty or guarantee that the information is accurate, correct, reliable or current. TE reserves the right to make any adjustments to the information contained herein
at any time without notice. TE expressly disclaims all implied warranties regarding the information contained herein, including, but not limited to, any implied warranties of merchantabili-
ty or fitness for a particular purpose. The dimensions in this datasheet are for reference purposes only and are subject to change without notice. Specifications are subject to change
without notice. Consult TE for the latest dimensions and design specifications.
Job Responsibilities: 1. Undertake the design and technical change tasks of FPGA liquid crystal driver board and graphic card, and be responsible for the sorting and archiving of the technical documen...
Hi everyone:I am making the above circuit. I use a breadboard to connect it. Vin inputs a 500 mVp-p, and Vc uses a VR to adjust the voltage, but the output voltage is 0V. I tried 3 samples and the res...
I'm looking for a method to call a text file from an ASP page in WinCE.Net. I've tried but can't create a Scripting.FileSystemObject object and an ADODB.Stream object in a WinCE.Net ASP page. Do you h...
Bonding: Bonding in English, literally translated as "chip wire bonding". Bonding is a wire bonding method in the chip production process. It is generally used to connect the internal circuit of the c...
As cars become smarter, there will be more and more onboard cameras and information display screens in cars. All of these devices need to be connected to a processor. The TI FPD-Link III chipset provi...
Some time ago, I attended the 4th Energy Chemistry Forum of the Chinese Chemical Society and learned about high-energy-density and high-safety batteries. I would like to summarize and share this wi...[Details]
"Have you set your calendar reminder?"
On August 24, Nvidia Robotics' official account posted a photo of a black gift box on a social media platform, with an attached greeting card sig...[Details]
Ever since the Tesla fire incident, electric cars, already known for their poor reputation, have been subjected to even more scathing criticism. Despite this, many people are still willing to buy t...[Details]
According to foreign media reports, secondary battery materials company POSCO Future M announced that it has successfully developed two experimental (prototype) positive electrode materials for the...[Details]
On August 18th, Galaxis, a specialist in integrated intelligent intralogistics robotics, officially unveiled its next-generation, ultra-narrow aisle forklift mobile robot, the "VFR Ultra-Narrow Ser...[Details]
This paper proposes a temperature real-time transmission and display solution based on LED optical data transmission, with Jingwei Yager low-power FPGA HR (Yellow River) series as the main controll...[Details]
A half-bridge is an inverter topology for converting DC to AC. A typical half-bridge circuit consists of two controller switches, a three-wire DC power supply, two feedback diodes, and two capacito...[Details]
A tubular motor is an electric motor that is typically used to control the movement of machines and equipment. Tubular motors are generally divided into two categories: linear tubular motors and ro...[Details]
Preface
Low-voltage motors are widely used in nonferrous metallurgical plants. Their abnormal operation not only impacts normal production but can also threaten human life. Therefore, providin...[Details]
A scale, a large, ground-mounted scale, is typically used to measure the tonnage of truck cargo. It's the primary weighing device used in factories, mines, and businesses for bulk cargo measurement...[Details]
introduction
The widespread use of air conditioner communication circuits began with the rise of household inverter air conditioners. With China's energy conservation and emission reduction in...[Details]
introduction
The OMAP-L138 dual-core processor is a new generation of low-power single-chip systems (SoCs) from TI. It is widely used in communications, industrial, medical diagnostic, and aud...[Details]
0 Introduction
DVI (Digital Visual Interface) is a hot topic in current digital display research and application. Video processing technologies for DVI output not only address issues such as h...[Details]
In microwave amplification circuits, the power chip is the core of the entire circuit. A large number of semiconductor devices in the chip will generate a lot of heat when working. If the heat diss...[Details]
Reasons for the wear of the roller press reducer shaft:
1. Since the expansion sleeve is subjected to a large torque, the mating surfaces of the shaft and the sleeve move relative to each other...[Details]