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MS312RAA23NGSZ

Description
General Purpose Inductor, 23uH, 2%, 1 Element, Ceramic-Core, SMD, 0704, CHIP, 0603
CategoryPassive components    inductor   
File Size137KB,2 Pages
ManufacturerCOILCRAFT
Websitehttp://www.coilcraft.com/
Download Datasheet Parametric View All

MS312RAA23NGSZ Overview

General Purpose Inductor, 23uH, 2%, 1 Element, Ceramic-Core, SMD, 0704, CHIP, 0603

MS312RAA23NGSZ Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerCOILCRAFT
package instruction0704
Reach Compliance Codecompliant
ECCN codeEAR99
uppercase and lowercase codes0704
structureChip
core materialCERAMIC
DC Resistance0.19 Ω
Nominal inductance(L)23 µH
Inductor ApplicationsRF INDUCTOR
Inductor typeGENERAL PURPOSE INDUCTOR
JESD-609 codee0
Number of functions1
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height1.02 mm
Package length1.8 mm
Package formSMT
Package width1.12 mm
method of packingTR, Paper, 7 Inch
Minimum quality factor (at nominal inductance)39
Maximum rated current0.7 A
self resonant frequency2380 MHz
seriesMS312RAA
Shape/Size DescriptionRECTANGULAR PACKAGE
shieldNO
surface mountYES
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal locationDUAL ENDED
Terminal shapeWRAPAROUND
Test frequency250 MHz
Tolerance2%
0603 CHIP INDUCTORS
High-Reliability Chip Inductors
MS312RAA
Small size, exceptional Q and high SRFs make these
inductors ideal for high frequency applications where
size is at a premium. They also have excellent DCR and
current carrying characteristics.
This robust version of Coilcraft’s standard 0603CS series
features high temperature materials that allow operation in
ambient temperatures up to 155°C and a leach-resistant
base metalization with tin-lead (Sn-Pb) terminations that
ensures the best possible board adhesion.
Current Derating
120
110
100
90
80
70
60
50
30
20
10
0
40
Typical L vs Frequency
200
175
120 nH
Percent of rated
I
rms
-40
-20
0
20
25°C
40
60
80
100
120
140 160
150
Ambient temperature (°C)
Inductance (nH)
125
100
75
50
25
0
10
100
1000
68 nH
B
overall
F
C
I
J
I
H
33 nH
A
G
F
12 nH
3.9 nH
10000
E
terminal
D
Terminal wraparound:
approx 0.007/0,18 both ends
Frequency (MHz)
Suggested
Land Pattern
Typical Q vs Frequency
120
110
100
90
80
A
max
0.071
3.9 nH
12 nH
B
max
0.044
1,12
C
max
1,02
D
ref
0,38
E
0,76
F
0,33
G
0,86
H
1,02
I
0,64
J
0,64
0.040 0.015 0.030 0.013 0.034 0.040 0.025 0.025
1,80
Note: Dimensions are before solder application. For maximum overall
dimensions including solder, add 0.0025 in / 0,064 mm to
B
and
0.006 in / 0,15 mm to
A
and
C.
Q Factor
70
60
50
40
30
20
10
0
1
10
100
1000
10000
33 nH
68 nH
120 nH
Frequency (MHz)
Core material
Ceramic
Terminations
Tin-lead (63/37) over silver-platinum-glass frit
Ambient temperature
–55°C to +125°C with
Imax
current, +125°C
to +155°C with derated current
Storage temperature
Component: –55°C to +155°C.
Packaging: –55°C to +80°C
Resistance to soldering heat
Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL)
+25 to +155 ppm/°C
Moisture Sensitivity Level (MSL)
1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging
2000 per 7″ reel
Paper tape: 8 mm wide, 1.0 mm thick, 4 mm pocket spacing
Document MS195-1 Revised 06/12/13
®
© Coilcraft, Inc. 2013
1102 Silver Lake Road
Cary, IL 60013
Phone 800-981-0363
Fax 847-639-1508
Email cps@coilcraft.com
www.coilcraft-cps.com
This product may not be used in medical or high
risk applications without prior Coilcraft approval.
Specifications subject to change without notice.
Please check our web site for latest information.
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