EEWORLDEEWORLDEEWORLD

Part Number

Search

PA28F200BV-B120

Description
Flash, 256KX8, 180ns, PDSO44, 0.525 X 1.110 INCH, PLASTIC, SOP-44
Categorystorage    storage   
File Size609KB,54 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
Download Datasheet Parametric Compare View All

PA28F200BV-B120 Overview

Flash, 256KX8, 180ns, PDSO44, 0.525 X 1.110 INCH, PLASTIC, SOP-44

PA28F200BV-B120 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeSOIC
package instruction0.525 X 1.110 INCH, PLASTIC, SOP-44
Contacts44
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time180 ns
Other featuresCAN BE OPERATED IN 4.5V TO 5.5V; CAN BE CONFG AS 128K X 16; BOTTOM BOOT BLOCK
Spare memory width8
startup blockBOTTOM
command user interfaceYES
Data pollingNO
Durability100000 Write/Erase Cycles
JESD-30 codeR-PDSO-G44
JESD-609 codee0
length28.2 mm
memory density2097152 bi
Memory IC TypeFLASH
memory width8
Number of functions1
Number of departments/size1,2,1,1
Number of terminals44
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP44,.63
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
power supply3.3/5 V
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height2.95 mm
Department size16K,8K,96K,128K
Maximum standby current0.000008 A
Maximum slew rate0.065 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
switch bitNO
typeNOR TYPE
width13.3 mm
Base Number Matches1
E
n
n
n
n
n
n
PRELIMINARY
2-MBIT (128K X 16, 256K X 8)
SmartVoltage BOOT BLOCK FLASH
MEMORY FAMILY
28F200BV-T/B, 28F200CV-T/B, 28F002BV-T/B
Intel SmartVoltage Technology
5V or 12V Program/Erase
3.3V or 5V Read Operation
Increased Programming Throughput
at 12V V
PP
Very High-Performance Read
5V: 60/80/120 ns Max. Access Time,
30/40 ns Max. Output Enable Time
3V: 110/150/180 ns Max Access
65/90 ns Max. Output Enable Time
Low Power Consumption
Max 60 mA Read Current at 5V
Max 30 mA Read Current at
3.3V–3.6V
x8/x16-Selectable Input/Output Bus
28F200 for High Performance 16- or
32-bit CPUs
x8-Only Input/Output Architecture
28F002B for Space-Constrained
8-bit Applications
Optimized Array Blocking Architecture
One 16-KB Protected Boot Block
Two 8-KB Parameter Blocks
One 96-KB Main Block
One 128-KB Main Block
Top or Bottom Boot Locations
Absolute Hardware-Protection for Boot
Block
Software EEPROM Emulation with
Parameter Blocks
Extended Temperature Operation
–40°C to +85°C
n
Extended Cycling Capability
100,000 Block Erase Cycles
(Commercial Temperature)
10,000 Block Erase Cycles
(Extended Temperature)
Automated Word/Byte Program and
Block Erase
Industry-Standard Command User
Interface
Status Registers
Erase Suspend Capability
SRAM-Compatible Write Interface
Automatic Power Savings Feature
1 mA Typical I
CC
Active Current in
Static Operation
Reset/Deep Power-Down Input
0.2 µA I
CC
Typical
Provides Reset for Boot Operations
Hardware Data Protection Feature
Write Lockout during Power
Transitions
Industry-Standard Surface Mount
Packaging
40-Lead TSOP
44-Lead PSOP: JEDEC ROM
Compatible
48-Lead TSOP
56-Lead TSOP
Footprint Upgradeable to 4-Mbit and
8-Mbit Boot Block Flash Memories
ETOX™ IV Flash Technology
n
n
n
n
n
n
n
n
n
n
n
December 1996
Order Number: 290531-004

PA28F200BV-B120 Related Products

PA28F200BV-B120 E28F002BV-T80 TE28F002BV-T80 E28F002BV-T60 E28F002BV-T120 PA28F200BV-T120 E28F002BV-B60 E28F002BV-B80 E28F002BV-B120 TE28F002BV-B80
Description Flash, 256KX8, 180ns, PDSO44, 0.525 X 1.110 INCH, PLASTIC, SOP-44 Flash, 256KX8, 150ns, PDSO40, 10 X 20 MM, TSOP-40 Flash, 256KX8, 110ns, PDSO40, 10 X 20 MM, TSOP-40 Flash, 256KX8, 110ns, PDSO40, 10 X 20 MM, TSOP-40 Flash, 256KX8, 180ns, PDSO40, 10 X 20 MM, TSOP-40 Flash, 256KX8, 180ns, PDSO44, 0.525 X 1.110 INCH, PLASTIC, SOP-44 Flash, 256KX8, 110ns, PDSO40, 10 X 20 MM, TSOP-40 Flash, 256KX8, 150ns, PDSO40, 10 X 20 MM, TSOP-40 Flash, 256KX8, 180ns, PDSO40, 10 X 20 MM, TSOP-40 Flash, 256KX8, 110ns, PDSO40, 10 X 20 MM, TSOP-40
Parts packaging code SOIC TSOP TSOP TSOP TSOP SOIC TSOP TSOP TSOP TSOP
package instruction 0.525 X 1.110 INCH, PLASTIC, SOP-44 10 X 20 MM, TSOP-40 10 X 20 MM, TSOP-40 10 X 20 MM, TSOP-40 10 X 20 MM, TSOP-40 0.525 X 1.110 INCH, PLASTIC, SOP-44 TSOP1, TSSOP40,.8,20 TSOP1, TSSOP40,.8,20 10 X 20 MM, TSOP-40 TSOP1, TSSOP40,.8,20
Contacts 44 40 40 40 40 44 40 40 40 40
Reach Compliance Code unknow unknow unknow unknow unknow unknow unknow unknow unknow unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 180 ns 150 ns 110 ns 110 ns 180 ns 180 ns 110 ns 150 ns 180 ns 110 ns
Other features CAN BE OPERATED IN 4.5V TO 5.5V; CAN BE CONFG AS 128K X 16; BOTTOM BOOT BLOCK CAN BE OPERATED IN 4.5V TO 5.5V; TOP BOOT BLOCK CAN BE OPERATED IN 4.5V TO 5.5V; TOP BOOT BLOCK CAN BE OPERATED IN 4.5V TO 5.5V; TOP BOOT BLOCK CAN BE OPERATED IN 4.5V TO 5.5V; TOP BOOT BLOCK CAN BE OPERATED IN 4.5V TO 5.5V; CAN BE CONFG AS 128K X 16; TOP BOOT BLOCK CAN BE OPERATED IN 4.5V TO 5.5V; BOTTOM BOOT BLOCK CAN BE OPERATED IN 4.5V TO 5.5V; BOTTOM BOOT BLOCK CAN BE OPERATED IN 4.5V TO 5.5V; BOTTOM BOOT BLOCK CAN BE OPERATED IN 4.5V TO 5.5V; BOTTOM BOOT BLOCK
startup block BOTTOM TOP TOP TOP TOP TOP BOTTOM BOTTOM BOTTOM BOTTOM
command user interface YES YES YES YES YES YES YES YES YES YES
Data polling NO NO NO NO NO NO NO NO NO NO
Durability 100000 Write/Erase Cycles 100000 Write/Erase Cycles 10000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 10000 Write/Erase Cycles
JESD-30 code R-PDSO-G44 R-PDSO-G40 R-PDSO-G40 R-PDSO-G40 R-PDSO-G40 R-PDSO-G44 R-PDSO-G40 R-PDSO-G40 R-PDSO-G40 R-PDSO-G40
length 28.2 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm 28.2 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm
memory density 2097152 bi 2097152 bi 2097152 bi 2097152 bi 2097152 bi 2097152 bi 2097152 bi 2097152 bi 2097152 bi 2097152 bi
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
memory width 8 8 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of departments/size 1,2,1,1 1,2,1,1 1,2,1,1 1,2,1,1 1,2,1,1 1,2,1,1 1,2,1,1 1,2,1,1 1,2,1,1 1,2,1,1
Number of terminals 44 40 40 40 40 44 40 40 40 40
word count 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000 256000 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 85 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 85 °C
organize 256KX8 256KX8 256KX8 256KX8 256KX8 256KX8 256KX8 256KX8 256KX8 256KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP TSOP1 TSOP1 TSOP1 TSOP1 SOP TSOP1 TSOP1 TSOP1 TSOP1
Encapsulate equivalent code SOP44,.63 TSSOP40,.8,20 TSSOP40,.8,20 TSSOP40,.8,20 TSSOP40,.8,20 SOP44,.63 TSSOP40,.8,20 TSSOP40,.8,20 TSSOP40,.8,20 TSSOP40,.8,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 3.3/5 V 3.3/5 V 3.3/5 V 3.3/5 V 3.3/5 V 3.3/5 V 3.3/5 V 3.3/5 V 3.3/5 V 3.3/5 V
Programming voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.95 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 2.95 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Department size 16K,8K,96K,128K 16K,8K,96K,128K 16K,8K,96K,128K 16K,8K,96K,128K 16K,8K,96K,128K 16K,8K,96K,128K 16K,8K,96K,128K 16K,8K,96K,128K 16K,8K,96K,128K 16K,8K,96K,128K
Maximum standby current 0.000008 A 0.000008 A 0.000008 A 0.000008 A 0.000008 A 0.000008 A 0.000008 A 0.000008 A 0.000008 A 0.000008 A
Maximum slew rate 0.065 mA 0.065 mA 0.07 mA 0.065 mA 0.065 mA 0.065 mA 0.065 mA 0.065 mA 0.065 mA 0.07 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES YES YES
technology MOS MOS MOS MOS MOS MOS MOS MOS MOS MOS
Temperature level COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 1.27 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
switch bit NO NO NO NO NO NO NO NO NO NO
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 13.3 mm 10 mm 10 mm 10 mm 10 mm 13.3 mm 10 mm 10 mm 10 mm 10 mm
Base Number Matches 1 1 1 1 1 1 1 1 1 1
stm32l476 SDIO debug
I'm debugging the SDIO of 476 to drive an SD card. I found that the SDIO register SDIO_CLKCR can only be configured once, and it cannot be modified no matter how long the delay is. According to the de...
jeansonm stm32/stm8
Has anyone reviewed the STM32 AD? How does it compare to other MCUs?
I have been using STM32 for a long time, but I have never used its AD, and I don’t know much about it. I used the 12-bit AD of 430 before, and I felt that the CPU power consumption was low and stable,...
liso stm32/stm8
[TI's First Low Power Design Competition] Progress of the MSP430FR5969 Communication Module
Because of the design concept of low power consumption, I used Bluetooth transmission to communicate between MSP430FR5969 and PC. How to use USB Dongle to send and receive data is what I have been stu...
lonerzf Microcontroller MCU
Waveform Generator Paper
Waveform generator thesis and circuit diagram design, please check it....
TSB51 MCU
NRF2401 Chinese Data
[i=s] This post was last edited by paulhyde on 2014-9-15 04:25 [/i] NRF2401 Chinese documentation...
dianqi302 Electronics Design Contest
exti9_5_irqhandler Can anyone explain it in detail?
exti9_5_irqhandler Who can explain in detail? Or tell me where to find the information about this, thank you....
gaokushuai Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2230  2158  2713  2186  2614  45  44  55  53  23 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号