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SN74AUP1G97DBVTE4

Description
Logic Gates Lo PWR Config Multi Funct Gate
Categorylogic    logic   
File Size22KB,1 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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SN74AUP1G97DBVTE4 Overview

Logic Gates Lo PWR Config Multi Funct Gate

SN74AUP1G97DBVTE4 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeSOT-23
package instructionLSSOP, TSOP6,.11,37
Contacts6
Reach Compliance Codeunknow
seriesAUP/ULP/V
JESD-30 codeR-PDSO-G6
JESD-609 codee4
length2.9 mm
Load capacitance (CL)30 pF
Logic integrated circuit typeLOGIC CIRCUIT
MaximumI(ol)0.0017 A
Humidity sensitivity level1
Number of functions1
Number of terminals6
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLSSOP
Encapsulate equivalent codeTSOP6,.11,37
Package shapeRECTANGULAR
Package formSMALL OUTLINE, LOW PROFILE, SHRINK PITCH
method of packingTR
Peak Reflow Temperature (Celsius)260
power supply1.2/3.3 V
Prop。Delay @ Nom-Su26.7 ns
Certification statusNot Qualified
Schmitt triggerYES
Maximum seat height1.45 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)0.8 V
Nominal supply voltage (Vsup)1.2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.95 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width1.6 mm

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Description Logic Gates Lo PWR Config Multi Funct Gate Logic Gates Lo PWR Config Multi Funct Gate Logic Gates Lo PWR Config Multi Funct Gate Logic Gates Lo PWR Config Multi Funct Gate Logic Gates Lo PWR Config Multi Funct Gate
Is it lead-free? Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to
Parts packaging code SOT-23 SOT-23 SOT-23 SOIC SOIC
package instruction LSSOP, TSOP6,.11,37 LSSOP, TSOP6,.11,37 LSSOP, TSOP6,.11,37 TSSOP, TSSOP6,.08 TSSOP, TSSOP6,.08
Contacts 6 6 6 6 6
Reach Compliance Code unknow unknow unknow unknow unknow
series AUP/ULP/V AUP/ULP/V AUP/ULP/V AUP/ULP/V AUP/ULP/V
JESD-30 code R-PDSO-G6 R-PDSO-G6 R-PDSO-G6 R-PDSO-G6 R-PDSO-G6
JESD-609 code e4 e4 e4 e4 e4
length 2.9 mm 2.9 mm 2.9 mm 2 mm 2 mm
Load capacitance (CL) 30 pF 30 pF 30 pF 30 pF 30 pF
Logic integrated circuit type LOGIC CIRCUIT LOGIC CIRCUIT LOGIC CIRCUIT LOGIC CIRCUIT LOGIC CIRCUIT
MaximumI(ol) 0.0017 A 0.0017 A 0.0017 A 0.0017 A 0.0017 A
Humidity sensitivity level 1 1 1 1 1
Number of functions 1 1 1 1 1
Number of terminals 6 6 6 6 6
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LSSOP LSSOP LSSOP TSSOP TSSOP
Encapsulate equivalent code TSOP6,.11,37 TSOP6,.11,37 TSOP6,.11,37 TSSOP6,.08 TSSOP6,.08
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing TR TR TR TR TR
Peak Reflow Temperature (Celsius) 260 260 260 260 260
power supply 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V
Prop。Delay @ Nom-Su 26.7 ns 26.7 ns 26.7 ns 26.7 ns 26.7 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger YES YES YES YES YES
Maximum seat height 1.45 mm 1.45 mm 1.45 mm 1.1 mm 1.1 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 0.8 V 0.8 V 0.8 V 0.8 V 0.8 V
Nominal supply voltage (Vsup) 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.95 mm 0.95 mm 0.95 mm 0.65 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 1.6 mm 1.6 mm 1.6 mm 1.25 mm 1.25 mm
Base Number Matches - 1 1 1 -
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