GD74HC191J datasheet, PDF - EEWORLD Datasheet

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GD74HC191J: DescriptionBinary Counter, Synchronous, Bidirectional, CMOS, CDIP16,; Categorylogic logic; File Size426KB，11 Pages; ManufacturerLG Semicon Co., Ltd.

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GD74HC191J Overview

Binary Counter, Synchronous, Bidirectional, CMOS, CDIP16,

GD74HC191J Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	LG Semicon Co., Ltd.
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
Counting direction	BIDIRECTIONAL
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Load capacitance (CL)	50 pF
Load/preset input	YES
Logic integrated circuit type	BINARY COUNTER
Maximum Frequency@Nom-Sup	12000000 Hz
MaximumI(ol)	0.004 A
Operating mode	SYNCHRONOUS
Number of functions	1
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	2/6 V
Certification status	Not Qualified
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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Description	Binary Counter, Synchronous, Bidirectional, CMOS, CDIP16,	Binary Counter, Synchronous, Bidirectional, CMOS, CDIP16,	Binary Counter, Synchronous, Bidirectional, CMOS, CDIP16,	Binary Counter, Synchronous, Bidirectional, CMOS, PDSO16,	Binary Counter, Synchronous, Bidirectional, CMOS, PDSO16,	Binary Counter, Synchronous, Bidirectional, CMOS, PDIP16,	Binary Counter, Synchronous, Bidirectional, CMOS, CDIP16,	Binary Counter, Synchronous, Bidirectional, CMOS, PDIP16,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	SOP, SOP16,.25	SOP, SOP16,.25	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Counting direction	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL
JESD-30 code	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-PDSO-G16	R-PDSO-G16	R-PDIP-T16	R-XDIP-T16	R-PDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Load/preset input	YES	YES	YES	YES	YES	YES	YES	YES
Logic integrated circuit type	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER
Maximum Frequency@Nom-Sup	12000000 Hz	11000000 Hz	10000000 Hz	12000000 Hz	13000000 Hz	12000000 Hz	13000000 Hz	13000000 Hz
MaximumI(ol)	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	16	16	16	16	16	16	16	16
Maximum operating temperature	85 °C	125 °C	125 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-55 °C	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	SOP	SOP	DIP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	SOP16,.25	SOP16,.25	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE
power supply	2/6 V	5 V	2/6 V	2/6 V	5 V	2/6 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	YES	YES	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	LG Semicon Co., Ltd.	-	-	-	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.

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