SN74LVC541ADBR datasheet, PDF - EEWORLD Datasheet

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SN74LVC541ADBR: DescriptionBuffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin SSOP T/R; CategoryBuffer and line drives; File Size2MB，33 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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SN74LVC541ADBR Overview

Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin SSOP T/R

SN74LVC541ADBR Parametric

Parameter Name	Attribute value
EU restricts the use of certain hazardous substances	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.39.00.01
SVHC	Yes
Logic Family	LVC
Logic Function	Buffer/Line Driver
Number of Elements per Chip	1
Number of Channels per Chip	8
Number of Inputs per Chip	8
Number of Input Enables per Chip	0
Number of Outputs per Chip	8
Number of Output Enables per Chip	2 Low
Bus Hold	No
Polarity	Non-Inverting
Maximum Propagation Delay Time @ Maximum CL (ns)	5.6@2.7V\|5.1@3.3V
Absolute Propagation Delay Time (ns)	17.5
Process Technology	CMOS
Input Signal Type	Single-Ended
Output Type	3-State
Maximum Low Level Output Current (mA)	24
Maximum High Level Output Current (mA)	-24
Minimum Operating Supply Voltage (V)	1.65
Typical Operating Supply Voltage (V)	1.8\|2.5\|3.3
Maximum Operating Supply Voltage (V)	3.6
Tolerant I/Os (V)	5
Maximum Quiescent Current (uA)	10
Propagation Delay Test Condition (pF)	50
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	125
Packaging	Tape and Reel
Standard Package Name	SOP
Pin Count	20
Supplier Package	SSOP
Mounting	Surface Mount
Package Height	2(Max) - 0.05(Min)
Package Length	7.5(Max)
Package Width	5.6(Max)
PCB changed	20
Lead Shape	Gull-wing

SN74LVC541ADBR Related Products

	SN74LVC541ADBR	SN74LVC541ADGVR	SN74LVC541ADWR	SN74LVC541ARGYR
Description	Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin SSOP T/R	Octal Buffer/Driver With 3-State Outputs 20-TVSOP -40 to 125	Octal Buffer/Driver With 3-State Outputs 20-SOIC -40 to 125	Octal Buffer/Driver With 3-State Outputs 20-VQFN -40 to 125
Brand Name	-	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	-	Lead free	Lead free	Lead free
Is it Rohs certified?	-	conform to	conform to	conform to
Parts packaging code	-	SOIC	SOIC	QFN
package instruction	-	TSSOP, TSSOP20,.25,16	SOP, SOP20,.4	HVQCCN, LCC20/24,.14X.18,20
Contacts	-	20	20	20
Reach Compliance Code	-	compli	compli	compli
ECCN code	-	EAR99	EAR99	EAR99
Factory Lead Time	-	1 week	1 week	1 week
Other features	-	WITH DUAL OUTPUT ENABLE	WITH DUAL OUTPUT ENABLE	WITH DUAL OUTPUT ENABLE
Control type	-	ENABLE LOW	ENABLE LOW	ENABLE LOW
Counting direction	-	UNIDIRECTIONAL	UNIDIRECTIONAL	UNIDIRECTIONAL
series	-	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z
JESD-30 code	-	R-PDSO-G20	R-PDSO-G20	R-PQCC-N20
JESD-609 code	-	e4	e4	e4
length	-	5 mm	12.8 mm	4.5 mm
Load capacitance (CL)	-	50 pF	50 pF	50 pF
Logic integrated circuit type	-	BUS DRIVER	BUS DRIVER	BUS DRIVER
MaximumI(ol)	-	0.024 A	0.024 A	0.024 A
Humidity sensitivity level	-	1	1	2
Number of digits	-	8	8	8
Number of functions	-	1	1	1
Number of ports	-	2	2	2
Number of terminals	-	20	20	20
Maximum operating temperature	-	125 °C	125 °C	125 °C
Minimum operating temperature	-	-40 °C	-40 °C	-40 °C
Output characteristics	-	3-STATE	3-STATE	3-STATE
Output polarity	-	TRUE	TRUE	TRUE
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	TSSOP	SOP	HVQCCN
Encapsulate equivalent code	-	TSSOP20,.25,16	SOP20,.4	LCC20/24,.14X.18,20
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
method of packing	-	TR	TR	TR
Peak Reflow Temperature (Celsius)	-	260	260	260
power supply	-	3.3 V	3.3 V	3.3 V
Prop。Delay @ Nom-Su	-	5.1 ns	5.1 ns	5.1 ns
propagation delay (tpd)	-	15.7 ns	15.7 ns	15.7 ns
Certification status	-	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	1.2 mm	2.65 mm	1 mm
Maximum supply voltage (Vsup)	-	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	-	1.65 V	1.65 V	1.65 V
Nominal supply voltage (Vsup)	-	3.3 V	3.3 V	3.3 V
surface mount	-	YES	YES	YES
technology	-	CMOS	CMOS	CMOS
Temperature level	-	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	-	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	-	GULL WING	GULL WING	NO LEAD
Terminal pitch	-	0.4 mm	1.27 mm	0.5 mm
Terminal location	-	DUAL	DUAL	QUAD
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	-	4.4 mm	7.5 mm	3.5 mm
Base Number Matches	-	1	1	1

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