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IDT72V70210BC8

Description
Digital Time Switch, PBGA144, 13 X 13 MM, 1.0 MM PITCH, BGA-144
CategoryWireless rf/communication    Telecom circuit   
File Size110KB,19 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric Compare View All

IDT72V70210BC8 Overview

Digital Time Switch, PBGA144, 13 X 13 MM, 1.0 MM PITCH, BGA-144

IDT72V70210BC8 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instruction13 X 13 MM, 1.0 MM PITCH, BGA-144
Contacts144
Reach Compliance Codenot_compliant
JESD-30 codeS-PBGA-B144
JESD-609 codee0
length13 mm
Humidity sensitivity level3
Number of functions1
Number of terminals144
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA144,12X12,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)225
power supply3.3 V
Certification statusNot Qualified
Maximum seat height1.97 mm
Maximum slew rate0.02 mA
Nominal supply voltage3.3 V
surface mountYES
Telecom integrated circuit typesDIGITAL TIME SWITCH
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width13 mm
3.3 VOLT TIME SLOT INTERCHANGE
DIGITAL SWITCH
1,024 x 1,024
.EATURES:
IDT72V70210
32 serial input and output streams
1,024 x 1,024 channel non-blocking switching at 2.048 Mb/s
Per-channel Variable Delay Mode for low-latency applications
Per-channel Constant Delay Mode for frame integrity applications
Automatic identification of ST-BUS
®
and GCI serial streams
Automatic frame offset delay measurement
Per-stream frame delay offset programming
Per-channel high impedance output control
Per-channel processor mode to allow microprocessor writes to
TX streams
Direct microprocessor access to all internal memories
Memory block programming for quick set-up
IEEE-1149.1 (JTAG) Test Port
Internal Loopback for testing
·
Available in 144-pin Ball Grid Array (BGA) and 144-pin Thin Quad
Flatpack (TQFP) packages
Operating Temperature Range -40°C to +85°C
°
°
3.3V I/O with 5V tolerant inputs and TTL compatible outputs
DESCRIPTION:
The IDT72V70210 has a non-blocking switch capacity of 1,024 x 1,024
channels at 2.048 Mb/s. With 32 inputs and 32 outputs, programmable per
stream control, and a variety of operating modes the IDT72V70210 is designed
for the TDM time slot interchange function in either voice or data applications.
Some of the main features of the IDT72V70210 are low power 3.3 Volt
operation, automatic ST-BUS
®
/GCI sensing, memory block programming,
simple microprocessor interface, one cycle direct internal memory accesses,
JTAG Test Access Port (TAP) and per stream programmable input offset delay,
variable or constant throughput modes, internal loopback, output enable, and
Processor Mode.
.UNCTIONAL BLOCK DIAGRAM
Vcc GND
RESET
TMS
TDI
TDO
TCK
TRST
ODE
Test Port
RX0
RX1
RX2
RX3
RX4
RX5
RX6
RX7
RX8
RX9
RX10
RX11
RX12
RX13
RX14
RX15
RX16
RX17
RX18
RX19
RX20
RX21
RX22
RX23
RX24
RX25
RX26
RX27
RX28
RX29
RX30
RX31
Loopback
Output
MUX
Data Memory
Receive
Serial Data
Streams
Transmit
Serial Data
Streams
Internal
Registers
Connection
Memory
TX0
TX1
TX2
TX3
TX4
TX5
TX6
TX7
TX8
TX9
TX10
TX11
TX12
TX13
TX14
TX15
TX16
TX17
TX18
TX19
TX20
TX21
TX22
TX23
TX24
TX25
TX26
TX27
TX28
TX29
TX30
TX31
Timing Unit
Microprocessor Interface
5714 drw01
CLK
F0i
FE
IC
DS
CS
R/W
A0-A11
DTA
D0-D15
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The ST-BUS
is a trademark of Mitel Corp.
JANUARY 2002
DSC-5714/3
1
2001 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.

IDT72V70210BC8 Related Products

IDT72V70210BC8 IDT72V70210DA8
Description Digital Time Switch, PBGA144, 13 X 13 MM, 1.0 MM PITCH, BGA-144 Digital Time Switch, PQFP144, 20 X 20 MM, 0.5 MM, TQFP-144
Is it Rohs certified? incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code BGA QFP
package instruction 13 X 13 MM, 1.0 MM PITCH, BGA-144 20 X 20 MM, 0.5 MM, TQFP-144
Contacts 144 144
Reach Compliance Code not_compliant not_compliant
JESD-30 code S-PBGA-B144 S-PQFP-G144
JESD-609 code e0 e0
length 13 mm 20 mm
Humidity sensitivity level 3 3
Number of functions 1 1
Number of terminals 144 144
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA LFQFP
Package shape SQUARE SQUARE
Package form GRID ARRAY FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 225 240
Certification status Not Qualified Not Qualified
Maximum seat height 1.97 mm 1.6 mm
Nominal supply voltage 3.3 V 3.3 V
surface mount YES YES
Telecom integrated circuit types DIGITAL TIME SWITCH DIGITAL TIME SWITCH
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn63Pb37) Tin/Lead (Sn85Pb15)
Terminal form BALL GULL WING
Terminal pitch 1 mm 0.5 mm
Terminal location BOTTOM QUAD
Maximum time at peak reflow temperature 30 20
width 13 mm 20 mm

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