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DN5Q24LTEB

Description
Diode Termination Array, 18-Line, PDSO24, PLASTIC, QSOP-24
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size59KB,2 Pages
ManufacturerKOA Speer
Websitehttp://www.koaspeer.com/
Download Datasheet Parametric View All

DN5Q24LTEB Overview

Diode Termination Array, 18-Line, PDSO24, PLASTIC, QSOP-24

DN5Q24LTEB Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerKOA Speer
Parts packaging codeSOIC
package instructionSSOP,
Contacts24
Reach Compliance Codecompliant
ECCN codeEAR99
Differential outputNO
Interface integrated circuit typeDIODE BUS TERMINATION ARRAY
JESD-30 codeR-PDSO-G24
JESD-609 codee0
length8.66 mm
Humidity sensitivity level1
Number of functions1
Number of signal lines18
Number of terminals24
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.8 mm
surface mountYES
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width3.81 mm
DN5
diode terminator network
This diode network is designed to provide nineteen
channels of active termination for high-speed data signals
to eliminate signal undershoot and overshoot. The network
has the added benefit of acting to suppress any ESD
voltage events by shunting the energy to ground assuring
maximum reliability of electronic systems in the field.
Trigger levels are defined by the positive and negative
bias levels set by the user.
features
Negligible reverse recovery time
Low capacitance
Low forward voltage drop
18-channel terminator in a single package
Resolved bus impedance mismatch
applications
Termination of data/control signals @
66 MHz
Dynamic RAM bus termination
RISC architecture
dimensions and construction
Size
Code
Dimensions
inches
(mm)
L
W
p
.341
(8.66)
.150
(3.81)
.033
(0.84)
L
Bonding
Wire
p
Lead
Q24
W
Die
Pad
Si
Molded Wafer
Resin
ordering information
New Part #
DN5
Type
Q24
Package
Symbol
Package type symbol + number of pins
QSOP: Q24
L
Termination
Material
L: SnPb
TEB
Packaging
TEB: 13" embossed
plastic tape
For further information on packaging, please refer to Appendix C.
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
11/01/03
KOA Speer Electronics, Inc.
• Bolivar Drive • P Box 547 • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com
.O.
181
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