PEEL273C-35 datasheet, PDF - EEWORLD Datasheet

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PEEL273C-35: DescriptionEE PLD, 35ns, PLA-Type, CMOS, CDIP24; CategoryProgrammable logic devices Programmable logic; File Size238KB，4 Pages; ManufacturerIntegrated Circuit Systems（IDT ）

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PEEL273C-35 Overview

EE PLD, 35ns, PLA-Type, CMOS, CDIP24

PEEL273C-35 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Integrated Circuit Systems（IDT ）
package instruction	DIP, DIP24,.3
Reach Compliance Code	unknown
Architecture	PLA-TYPE
JESD-30 code	R-XDIP-T24
JESD-609 code	e0
Number of entries	22
Output times	10
Number of product terms	42
Number of terminals	24
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Programmable logic type	EE PLD
propagation delay	35 ns
Certification status	Not Qualified
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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PEEL273C-35 Related Products

	PEEL273C-35	PEEL273C-30	PEEL273C-40	PEEL273P-12	PEEL273P-15	PEEL273P-30	PEEL273P-35	PEEL273P-40
Description	EE PLD, 35ns, PLA-Type, CMOS, CDIP24	EE PLD, 30ns, PLA-Type, CMOS, CDIP24	EE PLD, 40ns, PLA-Type, CMOS, CDIP24	EE PLD, 12ns, PLA-Type, CMOS, PDIP24	EE PLD, 15ns, PLA-Type, CMOS, PDIP24	EE PLD, 30ns, PLA-Type, CMOS, PDIP24	EE PLD, 35ns, PLA-Type, CMOS, PDIP24	EE PLD, 40ns, PLA-Type, CMOS, PDIP24
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Integrated Circuit Systems（IDT ）	Integrated Circuit Systems（IDT ）	Integrated Circuit Systems（IDT ）	Integrated Circuit Systems（IDT ）	Integrated Circuit Systems（IDT ）	Integrated Circuit Systems（IDT ）	Integrated Circuit Systems（IDT ）	Integrated Circuit Systems（IDT ）
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Architecture	PLA-TYPE	PLA-TYPE	PLA-TYPE	PLA-TYPE	PLA-TYPE	PLA-TYPE	PLA-TYPE	PLA-TYPE
JESD-30 code	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-PDIP-T24	R-PDIP-T24	R-PDIP-T24	R-PDIP-T24	R-PDIP-T24
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
Number of entries	22	22	22	22	22	22	22	22
Output times	10	10	10	10	10	10	10	10
Number of product terms	42	42	42	42	42	42	42	42
Number of terminals	24	24	24	24	24	24	24	24
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Programmable logic type	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD
propagation delay	35 ns	30 ns	40 ns	12 ns	15 ns	30 ns	35 ns	40 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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