EE PLD, 30ns, PLA-Type, CMOS, PDIP24,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMI Semiconductor |
| Reach Compliance Code | unknown |
| Architecture | PLA-TYPE |
| JESD-30 code | R-PDIP-T24 |
| JESD-609 code | e0 |
| Number of entries | 22 |
| Output times | 10 |
| Number of product terms | 42 |
| Number of terminals | 24 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Programmable logic type | EE PLD |
| propagation delay | 30 ns |
| Certification status | Not Qualified |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| PEEL273P-30 | PEEL273C-15 | PEEL273C-30 | PEEL273P-15 | |
|---|---|---|---|---|
| Description | EE PLD, 30ns, PLA-Type, CMOS, PDIP24, | EE PLD, 15ns, PLA-Type, CMOS, CDIP24, | EE PLD, 30ns, PLA-Type, CMOS, CDIP24, | EE PLD, 15ns, PLA-Type, CMOS, PDIP24, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | AMI Semiconductor | AMI Semiconductor | AMI Semiconductor | AMI Semiconductor |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| Architecture | PLA-TYPE | PLA-TYPE | PLA-TYPE | PLA-TYPE |
| JESD-30 code | R-PDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-PDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Number of entries | 22 | 22 | 22 | 22 |
| Output times | 10 | 10 | 10 | 10 |
| Number of product terms | 42 | 42 | 42 | 42 |
| Number of terminals | 24 | 24 | 24 | 24 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Programmable logic type | EE PLD | EE PLD | EE PLD | EE PLD |
| propagation delay | 30 ns | 15 ns | 30 ns | 15 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |