PACDN042
ESD Protection Diode
Low Clamping Voltage
Product Description
The PACDN042/43/44/45/46 family of surge protection arrays
provide a very high level of protection for sensitive electronic
components that may be subjected to electrostatic discharge (ESD).
The PACDN042/43/44/45/46 devices safely dissipate ESD strikes,
exceeding the IEC 61000−4−2 International Standard, Level 4 (±8 kV
contact discharge). All pins are rated to withstand
±20
kV ESD pulses
using the IEC 61000−4−2 contact discharge method. Using the
MIL−STD−883D (Method 3015) specification for Human Body
Model (HBM) ESD, all pins are protected from contact discharges of
greater than
±30
kV.
Features
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SOT−23−3
CASE 318
SOT−23−5
CASE 527AH
SOT−23−6
CASE 527AJ
•
Two, Three, Four, Five, or Six surge protection
•
Compact SMT Package Saves Board Space and Facilitates Layout in
Space−Critical Applications
•
In−System ESD Protection to
±
20 kV Contact Discharge, per the
IEC 61000−4−2 International Standard
•
These Devices are Pb−Free and are RoHS Compliant
Applications
SOT−143
CASE 527AF
SC70−3
CASE 419AB
CS70−5
CASE 419AC
SC70−6
CASE 419AD
TSSOP8
CASE 948AL
MSOP8
CASE 846AB
•
ESD Protection of PC Ports, Including USB Ports, Serial Ports,
MARKING DIAGRAM
Parallel Ports, IEEE1394 Ports, Docking Ports, Proprietary Ports, etc.
•
Protection of Interface Ports or IC Pins which are Exposed to High
ESD Levels
1
XXX MG
G
XXX
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
(see the last page of this document)
©
Semiconductor Components Industries, LLC, 2011
November, 2017
−
Rev. 8
1
Publication Order Number:
PACDN042/D
PACDN042
ELECTRICAL SCHEMATIC
PACDN042
GND
3
PACDN043
4
3
8
PACDN044T
GND
GND
6
5
7
1
SOT23−3
SC70−3
PACDN044Y
5
2
1
GND
SOT−143
2
1
GND
3
GND
TSSOP−8
2
4
PACDN045
4
6
5
4
GND
8
PACDN046
7
6
5
1
2
GND
SOT23−5
SC70−5
3
1
2
GND
SOT23−6
SC70−6
3
1
GND
2
3
4
MSOP−8
PACKAGE / PINOUT DIAGRAMS
Top View
Cathode
1
052
2
3−Pin SOT23
3
GND
Cathode
2
3−Pin SC70
Cathode
Top View
1
D52
3
GND
Cathode
2
GND
Top View
1
D053
3
4
Cathode
Cathode
Cathode
4−Pin SOT−143
Top View
Cathode
GND
Cathode
1
D054
4
Cathode
6
D055
5
4
2
3
5
Cathode
Cathode
GND
Cathode
Top View
1
D54
4
Cathode
2
3
5
Cathode
GND
Cathode
GND
Cathode
1
2
Top View
8
Cathode
GND
Cathode
GND
PAC
7
DN054T
3
6
4
5
5−Pin SOT23
5−Pin SC70
8−Pin TSSOP
Top View
Cathode
GND
Cathode
1
2
3
Cathode
Cathode
Cathode
Cathode
GND
Cathode
Top View
1
D55/D56
2
3
6
5
4
Cathode
Cathode
Cathode
GND
Cathode
Cathode
Cathode
1
2
3
4
Top View
8
7
6
5
D056
GND
Cathode
Cathode
Cathode
6−Pin SOT23
6−Pin SC70
8−Pin MSOP
Note: SOT23, SC70, SOT−143, TSSOP, and MSOP Packages may differ in size. These drawings are not to scale.
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2
PACDN042
Table 1. PIN DESCRIPTIONS
Pins
(Refer to Package Outline Drawings)
(Refer to Package Outline Drawings)
Name
Cathode
GND
Description
The cathode of the respective surge protection diode, which should be
connected to the node requiring transient voltage protection.
The anode of the surge protection diodes.
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Storage Temperature Range
Package Power Dissipation
SC70
SOT23−3, SOT23−5, SOT23−6, SOT−143
TSSOP, MSOP
Rating
−65
to +150
0.2
0.225
0.5
Units
°C
W
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature
Rating
−40
to +85
Units
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS
Symbol
C
V
RSO
I
LEAK
V
SIG
Capacitance
Reverse Stand−off Voltage
Parameter
Conditions
T
A
= 25°C, 2.5 VDC, 1 MHz
I
R
= 10
mA,
T
A
= 25°C
I
R
= 1 mA, T
A
= 25°C
Leakage Current
Small Signal Clamp Voltage
Positive Clamp
Negative Clamp
ESD Withstand Voltage
Human Body Model, MIL−STD−883,
Method 3015
Contact Discharge per IEC 61000−4−2
Standard
Diode Dynamic Resistance
Forward Conduction
Reverse Conduction
V
IN
= 5.0 VDC, T
A
= 25°C
I = 10 mA, T
A
= 25°C
I =
−10
mA, T
A
= 25°C
(Note 1)
(Note 1)
6.2
−0.4
±30
±20
W
5.5
6.1
1
6.8
−0.8
100
8
−1.2
Min
Typ
30
Max
Units
pF
V
V
nA
V
V
ESD
kV
R
D
1.0
1.4
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. ESD voltage applied between channel pins & ground, one pin at a time; all other channel pins open; all GND pins grounded.
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3
PACDN042
PERFORMANCE INFORMATION
Diode Capacitance
Typical diode capacitance with respect to positive cathode voltage (reverse voltage across the diode) is given in Diode
Capacitance vs. Reverse Voltage.
Figure 1. Diode Capacitance vs. Reverse Voltage
Typical High Current Diode Characteristics
Measurements are made in pulse mode with a nominal pulse width of 0.7 mS.
Figure 2. Typical Input VI Characteristics
(Pulse−mode measurements, pulse width = 0.7 mS nominal)
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4
PACDN042
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AR
D
0.25
3
E
1
2
HE
L
L1
VIEW C
T
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
DIM
A
A1
b
c
D
E
e
L
L1
H
E
T
MIN
0.89
0.01
0.37
0.08
2.80
1.20
1.78
0.30
0.35
2.10
0
°
MILLIMETERS
NOM
MAX
1.00
1.11
0.06
0.10
0.44
0.50
0.14
0.20
2.90
3.04
1.30
1.40
1.90
2.04
0.43
0.55
0.54
0.69
2.40
2.64
−−−
10
°
MIN
0.035
0.000
0.015
0.003
0.110
0.047
0.070
0.012
0.014
0.083
0
°
INCHES
NOM
0.039
0.002
0.017
0.006
0.114
0.051
0.075
0.017
0.021
0.094
−−−
MAX
0.044
0.004
0.020
0.008
0.120
0.055
0.080
0.022
0.027
0.104
10
°
3X
b
e
TOP VIEW
A
A1
SIDE VIEW
SEE VIEW C
c
END VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
2.90
0.90
3X
3X
0.80
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
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