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CY7C1413AV18-200BZC

Description
2MX18 QDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Categorystorage    storage   
File Size1MB,32 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
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CY7C1413AV18-200BZC Overview

2MX18 QDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165

CY7C1413AV18-200BZC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerRochester Electronics
Parts packaging codeBGA
package instruction15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Contacts165
Reach Compliance Codeunknown
Maximum access time0.45 ns
Other featuresPIPELINED ARCHITECTURE
JESD-30 codeR-PBGA-B165
JESD-609 codee0
length17 mm
memory density37748736 bit
Memory IC TypeQDR SRAM
memory width18
Humidity sensitivity level3
Number of functions1
Number of terminals165
word count2097152 words
character code2000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2MX18
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)220
Certification statusCOMMERCIAL
Maximum seat height1.4 mm
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width15 mm
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Description 2MX18 QDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 2MX18 QDR SRAM, 0.5ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 2MX18 QDR SRAM, 0.5ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 2MX18 QDR SRAM, 0.5ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 1MX36 QDR SRAM, 0.5ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 1MX36 QDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 1MX36 QDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
Is it lead-free? Contains lead Contains lead Lead free Lead free Contains lead Contains lead Lead free
Is it Rohs certified? incompatible incompatible conform to conform to incompatible incompatible conform to
Maker Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics
Parts packaging code BGA BGA BGA BGA BGA BGA BGA
package instruction 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 LBGA, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
Contacts 165 165 165 165 165 165 165
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
Maximum access time 0.45 ns 0.5 ns 0.5 ns 0.5 ns 0.5 ns 0.45 ns 0.45 ns
Other features PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 code R-PBGA-B165 R-PBGA-B165 R-PBGA-B165 R-PBGA-B165 R-PBGA-B165 R-PBGA-B165 R-PBGA-B165
JESD-609 code e0 e0 e1 e1 e0 e0 e1
length 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm
memory density 37748736 bit 37748736 bit 37748736 bit 37748736 bit 37748736 bit 37748736 bit 37748736 bit
Memory IC Type QDR SRAM QDR SRAM QDR SRAM QDR SRAM QDR SRAM QDR SRAM QDR SRAM
memory width 18 18 18 18 36 36 36
Humidity sensitivity level 3 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1 1
Number of terminals 165 165 165 165 165 165 165
word count 2097152 words 2097152 words 2097152 words 2097152 words 1048576 words 1048576 words 1048576 words
character code 2000000 2000000 2000000 2000000 1000000 1000000 1000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 85 °C 70 °C 70 °C 70 °C
organize 2MX18 2MX18 2MX18 2MX18 1MX36 1MX36 1MX36
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA LBGA LBGA LBGA LBGA LBGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 220 220 260 260 220 220 260
Certification status COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Maximum seat height 1.4 mm 1.4 mm 1.4 mm 1.4 mm 1.4 mm 1.4 mm 1.4 mm
Maximum supply voltage (Vsup) 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V
Minimum supply voltage (Vsup) 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
surface mount YES YES YES YES YES YES YES
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface TIN LEAD TIN LEAD TIN SILVER COPPER TIN SILVER COPPER TIN LEAD TIN LEAD TIN SILVER COPPER
Terminal form BALL BALL BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED 20 20 NOT SPECIFIED NOT SPECIFIED 20
width 15 mm 15 mm 15 mm 15 mm 15 mm 15 mm 15 mm

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