|
5962F9175801MPA |
5962-9175801MPA |
5962-9175801M2A |
5962F9175801MXA |
| Description |
IC OP-AMP, 3500 uV OFFSET-MAX, 300 MHz BAND WIDTH, CDIP8, CERDIP-8, Operational Amplifier |
IC OP-AMP, 3500 uV OFFSET-MAX, 300 MHz BAND WIDTH, CDIP8, CERDIP-8, Operational Amplifier |
IC OP-AMP, 3500 uV OFFSET-MAX, 300 MHz BAND WIDTH, CQCC20, LCC-20, Operational Amplifier |
IC OP-AMP, 3500 uV OFFSET-MAX, 300 MHz BAND WIDTH, CDSO10, CERAMIC, SOIC-10, Operational Amplifier |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
| Maker |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
| Parts packaging code |
DIP |
DIP |
QFN |
SOIC |
| package instruction |
DIP, DIP8,.3 |
CERDIP-8 |
QCCN, LCC20,.35SQ |
SOP, SOP10,.45 |
| Contacts |
8 |
8 |
20 |
10 |
| Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| Amplifier type |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
- |
OPERATIONAL AMPLIFIER |
| Architecture |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
- |
VOLTAGE-FEEDBACK |
| Maximum average bias current (IIB) |
20 µA |
20 µA |
- |
20 µA |
| Maximum bias current (IIB) at 25C |
10 µA |
10 µA |
- |
10 µA |
| Nominal Common Mode Rejection Ratio |
65 dB |
65 dB |
- |
65 dB |
| frequency compensation |
YES |
YES |
- |
YES |
| Maximum input offset voltage |
3500 µV |
3500 µV |
- |
3500 µV |
| JESD-30 code |
R-GDIP-T8 |
R-GDIP-T8 |
- |
R-GDSO-G10 |
| JESD-609 code |
e0 |
e0 |
- |
e0 |
| low-bias |
NO |
NO |
- |
NO |
| low-dissonance |
NO |
NO |
- |
NO |
| micropower |
NO |
NO |
- |
NO |
| Negative supply voltage upper limit |
-7 V |
-7 V |
- |
-7 V |
| Nominal Negative Supply Voltage (Vsup) |
-5 V |
-5 V |
- |
-5 V |
| Number of functions |
1 |
1 |
- |
1 |
| Number of terminals |
8 |
8 |
- |
10 |
| Maximum operating temperature |
125 °C |
125 °C |
- |
125 °C |
| Minimum operating temperature |
-55 °C |
-55 °C |
- |
-55 °C |
| Package body material |
CERAMIC, GLASS-SEALED |
CERAMIC, GLASS-SEALED |
- |
CERAMIC, GLASS-SEALED |
| encapsulated code |
DIP |
DIP |
- |
SOP |
| Encapsulate equivalent code |
DIP8,.3 |
DIP8,.3 |
- |
SOP10,.45 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
- |
RECTANGULAR |
| Package form |
IN-LINE |
IN-LINE |
- |
SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
- |
NOT SPECIFIED |
| power |
NO |
NO |
- |
NO |
| power supply |
+-5 V |
+-5 V |
- |
+-5 V |
| Programmable power |
NO |
NO |
- |
NO |
| Certification status |
Not Qualified |
Not Qualified |
- |
Not Qualified |
| Filter level |
MIL-STD-883 |
MIL-STD-883 |
- |
MIL-STD-883 |
| Maximum seat height |
5.08 mm |
5.08 mm |
- |
2.33 mm |
| Nominal slew rate |
1100 V/us |
1100 V/us |
- |
1100 V/us |
| Supply voltage upper limit |
7 V |
7 V |
- |
7 V |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
- |
5 V |
| surface mount |
NO |
NO |
- |
YES |
| technology |
BIPOLAR |
BIPOLAR |
- |
BIPOLAR |
| Temperature level |
MILITARY |
MILITARY |
- |
MILITARY |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) - hot dipped |
- |
Tin/Lead (Sn/Pb) |
| Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
- |
GULL WING |
| Terminal pitch |
2.54 mm |
2.54 mm |
- |
1.27 mm |
| Terminal location |
DUAL |
DUAL |
- |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
- |
NOT SPECIFIED |
| Nominal Uniform Gain Bandwidth |
300000 kHz |
300000 kHz |
- |
300000 kHz |
| Minimum voltage gain |
630 |
400 |
- |
630 |
| broadband |
YES |
YES |
- |
YES |
| width |
7.62 mm |
7.62 mm |
- |
6.12 mm |