SLIC, CDIP28, CERAMIC, DIP-28
| Parameter Name | Attribute value |
| Maker | AMD |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-CDIP-T28 |
| length | 37.1475 mm |
| Negative supply voltage rating | -5 V |
| Number of functions | 1 |
| Number of terminals | 28 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| Maximum seat height | 5.588 mm |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| Telecom integrated circuit types | SLIC |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 15.24 mm |
| AM79M576A-1DC | AM79M576APC | AM79M576AJC | AM79M576ADC | AM79M576A-2PC | AM79M576A-2DC | AM79M576A-1PC | |
|---|---|---|---|---|---|---|---|
| Description | SLIC, CDIP28, CERAMIC, DIP-28 | SLIC, 2-4 Conversion, PDIP28, PLASTIC, DIP-28 | SLIC, 2-4 Conversion, PQCC32, PLASTIC, LCC-32 | SLIC, 2-4 Conversion, CDIP28, CERAMIC, DIP-28 | SLIC, PDIP28, PLASTIC, DIP-28 | SLIC, CDIP28, CERAMIC, DIP-28 | SLIC, PDIP28, PLASTIC, DIP-28 |
| Parts packaging code | DIP | DIP | QFJ | DIP | DIP | DIP | DIP |
| package instruction | DIP, | DIP, DIP28,.6 | QCCJ, LDCC32,.5X.6 | DIP, DIP28,.6 | DIP, | DIP, | DIP, |
| Contacts | 28 | 28 | 32 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-CDIP-T28 | R-PDIP-T28 | R-PQCC-J32 | R-CDIP-T28 | R-PDIP-T28 | R-CDIP-T28 | R-PDIP-T28 |
| length | 37.1475 mm | 37.084 mm | 13.97 mm | 37.1475 mm | 37.084 mm | 37.1475 mm | 37.084 mm |
| Negative supply voltage rating | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 32 | 28 | 28 | 28 | 28 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | QCCJ | DIP | DIP | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.588 mm | 5.715 mm | 3.556 mm | 5.588 mm | 5.715 mm | 5.588 mm | 5.715 mm |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | NO | NO | NO | NO |
| Telecom integrated circuit types | SLIC | SLIC | SLIC | SLIC | SLIC | SLIC | SLIC |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL |
| width | 15.24 mm | 15.24 mm | 11.43 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | - |