MT8JTF25664AY-80BXX datasheet, PDF

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MT8JTF25664AY-80BXX: DescriptionDDR DRAM Module, 256MX64, CMOS, LEAD FREE, UDIMM-240; Categorystorage storage; File Size398KB，11 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

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MT8JTF25664AY-80BXX Overview

DDR DRAM Module, 256MX64, CMOS, LEAD FREE, UDIMM-240

MT8JTF25664AY-80BXX Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Micron Technology
Parts packaging code	DIMM
package instruction	DIMM,
Contacts	240
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	SINGLE BANK PAGE BURST
Other features	SELF CONTAINED REFRESH
JESD-30 code	R-XDMA-N240
JESD-609 code	e4
memory density	17179869184 bit
Memory IC Type	DDR DRAM MODULE
memory width	64
Number of functions	1
Number of ports	1
Number of terminals	240
word count	268435456 words
character code	256000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256MX64
Package body material	UNSPECIFIED
encapsulated code	DIMM
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
self refresh	YES
Maximum supply voltage (Vsup)	1.575 V
Minimum supply voltage (Vsup)	1.425 V
Nominal supply voltage (Vsup)	1.5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Gold (Au)
Terminal form	NO LEAD
Terminal location	DUAL
Maximum time at peak reflow temperature	30

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1GB, 2GB (x64, SR) 240-Pin DDR3 SDRAM UDIMM

Features

DDR3 SDRAM UDIMM

MT8JTF12864A – 1GB

MT8JTF25664A – 2GB

For component data sheets, refer to Micron’s Web site:

www.micron.com

Features

• DDR3 functionality and operations supported as

defined in the component data sheet

• 240-pin, unbuffered dual in-line memory module

(UDIMM)

• Fast data transfer rates: PC3-10600, PC3-8500,

or PC3-6400

• 1GB (128 Meg x 64), 2GB (256 Meg x 64)

• V

= V

Q = +1.5V ±0.075V

• V

DDSPD

= +3.0V to +3.6V

• Reset pin for improved system stability

• Nominal and dynamic on-die termination (ODT) for

data, strobe, and mask signals

• Single rank

• Fixed burst chop (BC) of 4 and burst length (BL) of 8

via the mode register set (MRS)

• Adjustable data-output drive strength

• Serial presence-detect (SPD) EEPROM

• Gold edge contacts

• Lead-free

• Fly-by topology

• Terminated control, command, and address bus

Figure 1:

240-Pin UDIMM (MO-269 R/C A)

PCB height: 30mm (1.18in)

Options

•

Operating temperature

Marking

–

Commercial (0°C

≤

+70°C)

None

–

Industrial (–40°C

≤

+85°C)

• Package

–

240-pin DIMM (lead-free)

• Frequency/CAS latency

–

1.5ns @ CL = 9 (DDR3-1333)

-1G4

–

1.5ns @ CL = 10 (DDR3-1333)

-1G3

–

1.87ns @ CL = 7 (DDR3-1066)

-1G1

–

1.87ns @ CL = 8 (DDR3-1066)

-1G0

–

2.5ns @ CL = 5 (DDR3-800)

-80C

–

2.5ns @ CL = 6 (DDR3-800)

-80B

Notes: 1. Contact Micron for industrial temperature

module offerings.

2. Not recommended for new designs.

Table 1:

Speed

Grade

-1G4

-1G3

-1G1

-1G0

-80C

-80B

Key Timing Parameters

Data Rate (MT/s)

Industry

Nomenclature

PC3-10600

PC3-8500

PC3-6400

CL = 10 CL = 9

1333

–

1333

–

CL = 8

1066

–

CL = 7

1066

–

1066

–

CL = 6

800

CL = 5

–

800

–

RCD

(ns)

13.5

(ns)

13.5

13.125

12.5

(ns)

49.5

50.625

52.5

13.125

12.5

PDF: 09005aef82b21119/Source: 09005aef82b2112c

JTF8c128_256x64AY.fm - Rev. B 6/08 EN

Micron Technology, Inc., reserves the right to change products or specifications without notice.

Products and specifications discussed herein are subject to change by Micron without notice.

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Is it lead-free?	Lead free	Lead free	-	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	-	conform to	conform to	conform to	conform to	conform to	conform to
Maker	Micron Technology	Micron Technology	-	-	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology
Parts packaging code	DIMM	DIMM	-	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
package instruction	DIMM,	LEAD FREE, UDIMM-240	-	DIMM,	LEAD FREE, UDIMM-240	DIMM,	LEAD FREE, UDIMM-240	DIMM,	LEAD FREE, UDIMM-240
Contacts	240	240	-	240	240	240	240	240	240
Reach Compliance Code	compliant	compliant	-	compliant	compliant	compliant	compliant	compliant	compli
ECCN code	EAR99	EAR99	-	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	-	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST
Other features	SELF CONTAINED REFRESH	SELF CONTAINED REFRESH	-	SELF CONTAINED REFRESH	SELF CONTAINED REFRESH	SELF CONTAINED REFRESH	SELF CONTAINED REFRESH	SELF CONTAINED REFRESH	SELF CONTAINED REFRESH
JESD-30 code	R-XDMA-N240	R-XDMA-N240	-	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240
JESD-609 code	e4	e4	-	e4	e4	e4	e4	e4	e4
memory density	17179869184 bit	17179869184 bit	-	8589934592 bit	8589934592 bit	8589934592 bit	17179869184 bit	17179869184 bit	17179869184 bi
Memory IC Type	DDR DRAM MODULE	DDR DRAM MODULE	-	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE
memory width	64	64	-	64	64	64	64	64	64
Number of functions	1	1	-	1	1	1	1	1	1
Number of ports	1	1	-	1	1	1	1	1	1
Number of terminals	240	240	-	240	240	240	240	240	240
word count	268435456 words	268435456 words	-	134217728 words	134217728 words	134217728 words	268435456 words	268435456 words	268435456 words
character code	256000000	256000000	-	128000000	128000000	128000000	256000000	256000000	256000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	-	70 °C	70 °C	85 °C	70 °C	85 °C	70 °C
organize	256MX64	256MX64	-	128MX64	128MX64	128MX64	256MX64	256MX64	256MX64
Package body material	UNSPECIFIED	UNSPECIFIED	-	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM	-	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
Package shape	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	-	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	260	260	-	260	260	260	260	260	260
Certification status	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
self refresh	YES	YES	-	YES	YES	YES	YES	YES	YES
Maximum supply voltage (Vsup)	1.575 V	1.575 V	-	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V
Minimum supply voltage (Vsup)	1.425 V	1.425 V	-	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V
Nominal supply voltage (Vsup)	1.5 V	1.5 V	-	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V
surface mount	NO	NO	-	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	-	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL
Terminal surface	Gold (Au)	Gold (Au)	-	Gold (Au)	Gold (Au)	Gold (Au)	Gold (Au)	Gold (Au)	Gold (Au)
Terminal form	NO LEAD	NO LEAD	-	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal location	DUAL	DUAL	-	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	-	30	30	30	30	30	30

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