SRAM Module, 512KX32, 15ns, CMOS
| Parameter Name | Attribute value |
| Maker | IDT (Integrated Device Technology) |
| package instruction | , |
| Reach Compliance Code | unknown |
| ECCN code | 3A991.B.2.A |
| IDT7MPV4135S15M | IDT7MPV4120S20M | IDT7MPV4120S15M | IDT7MPV4135S20M | IDT7MPV4135S12M | IDT7MPV4120S12M | |
|---|---|---|---|---|---|---|
| Description | SRAM Module, 512KX32, 15ns, CMOS | SRAM Module, 1MX32, 20ns, CMOS | SRAM Module, 1MX32, 15ns, CMOS | SRAM Module, 512KX32, 20ns, CMOS | SRAM Module, 512KX32, 12ns, CMOS | SRAM Module, 1MX32, 12ns, CMOS |
| Maker | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| Reach Compliance Code | unknown | unknown | unknown | unknown | compliant | compliant |
| ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| Maximum access time | - | 20 ns | 15 ns | 20 ns | 12 ns | 12 ns |
| JESD-30 code | - | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 |
| JESD-609 code | - | e0 | e0 | e0 | e0 | e0 |
| memory density | - | 33554432 bit | 33554432 bit | 16777216 bit | 16777216 bit | 33554432 bit |
| Memory IC Type | - | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| memory width | - | 32 | 32 | 32 | 32 | 32 |
| Number of functions | - | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | - | 72 | 72 | 72 | 72 | 72 |
| word count | - | 1048576 words | 1048576 words | 524288 words | 524288 words | 1048576 words |
| character code | - | 1000000 | 1000000 | 512000 | 512000 | 1000000 |
| Operating mode | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | - | 1MX32 | 1MX32 | 512KX32 | 512KX32 | 1MX32 |
| Package body material | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | - | 3 V | 3 V | 3 V | 3 V | 3 V |
| Nominal supply voltage (Vsup) | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | - | NO | NO | NO | NO | NO |
| technology | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | - | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | - | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| Terminal location | - | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
京公网安备 11010802033920号
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