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MC14536BDWR2

Description
IC,TIMER,CMOS,SOP,16PIN,PLASTIC
CategoryAnalog mixed-signal IC    The signal circuit   
File Size1MB,17 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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MC14536BDWR2 Overview

IC,TIMER,CMOS,SOP,16PIN,PLASTIC

MC14536BDWR2 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNXP
package instructionSOP, SOP16,.4
Reach Compliance Codeunknown
JESD-30 codeR-PDSO-G16
JESD-609 codee0
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP16,.4
Package shapeRECTANGULAR
Package formSMALL OUTLINE
power supply5/15 V
Certification statusNot Qualified
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL

MC14536BDWR2 Related Products

MC14536BDWR2 MC14536BCPDS MC14536BALD MC14536BCLDS
Description IC,TIMER,CMOS,SOP,16PIN,PLASTIC IC,TIMER,CMOS,DIP,16PIN,PLASTIC IC,TIMER,CMOS,DIP,16PIN,CERAMIC IC,TIMER,CMOS,DIP,16PIN,CERAMIC
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker NXP NXP NXP NXP
package instruction SOP, SOP16,.4 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown unknown unknown
JESD-30 code R-PDSO-G16 R-PDIP-T16 R-XDIP-T16 R-XDIP-T16
JESD-609 code e0 e0 e0 e0
Number of terminals 16 16 16 16
Maximum operating temperature 85 °C 85 °C 125 °C 85 °C
Minimum operating temperature -40 °C -40 °C -55 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC CERAMIC
encapsulated code SOP DIP DIP DIP
Encapsulate equivalent code SOP16,.4 DIP16,.3 DIP16,.3 DIP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE IN-LINE IN-LINE IN-LINE
power supply 5/15 V 5/15 V 5/15 V 5/15 V
surface mount YES NO NO NO
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL MILITARY INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL
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