MS18R1628EH0-CM8 datasheet, PDF

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MS18R1628EH0-CM8: DescriptionRambus DRAM Module, 128MX18, CMOS, SORIMM-160; Categorystorage storage; File Size238KB，14 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/; Environmental Compliance

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MS18R1628EH0-CM8 Overview

Rambus DRAM Module, 128MX18, CMOS, SORIMM-160

MS18R1628EH0-CM8 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SAMSUNG
Parts packaging code	DMA
package instruction	DIMM, DIMM160,25
Contacts	160
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	BLOCK ORIENTED PROTOCOL
Other features	SELF CONTAINED REFRESH
Maximum clock frequency (fCLK)	800 MHz
I/O type	COMMON
JESD-30 code	R-XDMA-N160
memory density	2415919104 bit
Memory IC Type	RAMBUS DRAM MODULE
memory width	18
Number of functions	1
Number of ports	1
Number of terminals	160
word count	134217728 words
character code	128000000
Operating mode	SYNCHRONOUS
organize	128MX18
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM160,25
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.8/2.5,2.5 V
Certification status	Not Qualified
self refresh	YES
Maximum supply voltage (Vsup)	2.63 V
Minimum supply voltage (Vsup)	2.37 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	NO
technology	CMOS
Terminal form	NO LEAD
Terminal pitch	0.635 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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MS18R1622(4/8)EH0

Revision History

Version 0.1 (February 2004) -

Preliminary

- First Copy

- Based on the 1.0 ver. (July 2002) 288Mbit D-die SO-RIMM

™

Module Datasheet.

Version 1.0 (May 2004)

- Eliminate "Preliminary"

Page 0

Rev. 1.0 May 2004

MS18R1628EH0-CM8 Related Products

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Description	Rambus DRAM Module, 128MX18, CMOS, SORIMM-160	Rambus DRAM Module, 128MX18, CMOS, SORIMM-160	Rambus DRAM Module, 128MX18, CMOS, SORIMM-160	Rambus DRAM Module, 64MX18, 45ns, CMOS, SORIMM-160	Rambus DRAM Module, 64MX18, 40ns, CMOS, SORIMM-160	Rambus DRAM Module, 64MX18, 32ns, CMOS, SORIMM-160	Rambus DRAM Module, 32MX18, 32ns, CMOS, SORIMM-160	Rambus DRAM Module, 32MX18, 40ns, CMOS, SORIMM-160	Rambus DRAM Module, 32MX18, 45ns, CMOS, SORIMM-160
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	DMA	DMA	DMA	DMA	DMA	DMA	DMA	DMA	DMA
package instruction	DIMM, DIMM160,25	DIMM, DIMM160,25	DIMM, DIMM160,25	DIMM, DIMM160,25	DIMM, DIMM160,25	DIMM, DIMM160,25	DIMM, DIMM160,25	DIMM, DIMM160,25	DIMM, DIMM160,25
Contacts	160	160	160	160	160	160	160	160	160
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	BLOCK ORIENTED PROTOCOL	BLOCK ORIENTED PROTOCOL	BLOCK ORIENTED PROTOCOL	BLOCK ORIENTED PROTOCOL	BLOCK ORIENTED PROTOCOL	BLOCK ORIENTED PROTOCOL	BLOCK ORIENTED PROTOCOL	BLOCK ORIENTED PROTOCOL	BLOCK ORIENTED PROTOCOL
Other features	SELF CONTAINED REFRESH	SELF CONTAINED REFRESH	SELF CONTAINED REFRESH	SELF CONTAINED REFRESH	SELF CONTAINED REFRESH	SELF CONTAINED REFRESH	SELF CONTAINED REFRESH	SELF CONTAINED REFRESH	SELF CONTAINED REFRESH
Maximum clock frequency (fCLK)	800 MHz	800 MHz	1066 MHz	800 MHz	800 MHz	1066 MHz	1066 MHz	800 MHz	800 MHz
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XDMA-N160	R-XDMA-N160	R-XDMA-N160	R-XDMA-N160	R-XDMA-N160	R-XDMA-N160	R-XDMA-N160	R-XDMA-N160	R-XDMA-N160
memory density	2415919104 bit	2415919104 bit	2415919104 bit	1207959552 bit	1207959552 bit	1207959552 bit	603979776 bit	603979776 bit	603979776 bit
Memory IC Type	RAMBUS DRAM MODULE	RAMBUS DRAM MODULE	RAMBUS DRAM MODULE	RAMBUS DRAM MODULE	RAMBUS DRAM MODULE	RAMBUS DRAM MODULE	RAMBUS DRAM MODULE	RAMBUS DRAM MODULE	RAMBUS DRAM MODULE
memory width	18	18	18	18	18	18	18	18	18
Number of functions	1	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1	1
Number of terminals	160	160	160	160	160	160	160	160	160
word count	134217728 words	134217728 words	134217728 words	67108864 words	67108864 words	67108864 words	33554432 words	33554432 words	33554432 words
character code	128000000	128000000	128000000	64000000	64000000	64000000	32000000	32000000	32000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
organize	128MX18	128MX18	128MX18	64MX18	64MX18	64MX18	32MX18	32MX18	32MX18
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
Encapsulate equivalent code	DIMM160,25	DIMM160,25	DIMM160,25	DIMM160,25	DIMM160,25	DIMM160,25	DIMM160,25	DIMM160,25	DIMM160,25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	1.8/2.5,2.5 V	1.8/2.5,2.5 V	1.8/2.5,2.5 V	1.8/2.5,2.5 V	1.8/2.5,2.5 V	1.8/2.5,2.5 V	1.8/2.5,2.5 V	1.8/2.5,2.5 V	1.8/2.5,2.5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
self refresh	YES	YES	YES	YES	YES	YES	YES	YES	YES
Maximum supply voltage (Vsup)	2.63 V	2.63 V	2.63 V	2.63 V	2.63 V	2.63 V	2.63 V	2.63 V	2.63 V
Minimum supply voltage (Vsup)	2.37 V	2.37 V	2.37 V	2.37 V	2.37 V	2.37 V	2.37 V	2.37 V	2.37 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	0.635 mm	0.635 mm	0.635 mm	0.635 mm	0.635 mm	0.635 mm	0.635 mm	0.635 mm	0.635 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maximum access time	-	-	-	45 ns	40 ns	32 ns	32 ns	40 ns	45 ns

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