EEWORLDEEWORLDEEWORLD

Part Number

Search

GRM55DR71H335MA01L

Description
CAP CER 3.3UF 50V 20% X7R 2220
CategoryPassive components    capacitor   
File Size46KB,3 Pages
ManufacturerMurata
Websitehttps://www.murata.com
Environmental Compliance  
Download Datasheet Parametric Compare View All

GRM55DR71H335MA01L Overview

CAP CER 3.3UF 50V 20% X7R 2220

GRM55DR71H335MA01L Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMurata
package instructionCHIP
Reach Compliance Codecompliant
capacitance3.3 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high2 mm
JESD-609 codee3
length5.7 mm
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance20%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingTR, EMBOSSED, 7 INCH
positive tolerance20%
Rated (DC) voltage (URdc)50 V
size code2220
surface mountYES
Temperature characteristic codeX7R
Temperature Coefficient15% ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
width5 mm
o
Part Numbering
Chip Monolithic Ceramic Capacitors for General
(Part Number)
qProduct
ID
wSeries
Product ID
GA
Code
2
3
4
GJ
8
M
GM
GQ
A
D
M
3
4
7
J
M
KR
3
M
A
LL
L
M
R
A
ZR
B
Series
Products based on the Electrical Appliance and
Material Safety Law of Japan
Safety standard certified type
Audio signal low distortion type
Acoustic noise reduction type
High frequency HiQ type
1005(in mm)/0402(in inch) size max.
Top & bottom electrode type for bonding
Product for bonding/AuSn soldering
High frequency HiQ type
1608(in mm)/0603(in inch) size min.
High effective capacitance &
High allowable ripple current
For Ethernet LAN & primary-secondary
coupling of DC-DC converters
Product limited to camera flash units
Resin external electrode type
General purpose products
Metal terminal type/High effective capacitance &
High allowable ripple current
Metal terminal type
8 terminal low ESL type
LW reversed low ESL type
10 terminal low ESL type
Controlled ESR low ESL type
On interposer substrates
(Chip
F
interposer substrates)
On interposer substrates
(Chip
U
interposer substrates)
rHeight
Dimension (T) (KRp Only)
Code
E
F
K
L
eChip
Dimensions (LgW) (Except
ZRA)
Code
02
03
05
08
0D
15
18
1U
21
22
31
32
42
43
52
55
Dimensions (LgW)
0.4g0.2mm
0.6g0.3mm
0.5g0.5mm
0.8g0.8mm
0.38g0.38mm
1.0g0.5mm
1.6g0.8mm
0.6g1.0mm
2.0g1.25mm
2.8g2.8mm
3.2g1.6mm
3.2g2.5mm
4.5g2.0mm
4.5g3.2mm
5.7g2.8mm
5.7g5.0mm
EIA
01005
0201
0202
0303
015015
0402
0603
02404
0805
1111
1206
1210
1808
1812
2211
2220
Continued on the following page.
GR
q
M
w
18
e
8
B1 1H
y
102
u
K
i
A01 D
o
!0
eDimensions
(LgW) (ZRA Only)
Code
21
Dimensions (LgW)
2.4g1.65mm
r t
rHeight
Dimension (T) (Except
KRp)
Code
2
3
4
5
6
7
8
9
A
B
C
D
E
M
N
Q
R
S
X
Dimension (T)
0.2mm
0.3mm
0.4mm
0.5mm
0.6mm
0.7mm
0.8mm
0.85mm
1.0mm
1.25mm
1.6mm
2.0mm
2.5mm
1.15mm
1.35mm
1.5mm
1.8mm
2.8mm
Depends on individual standards.
GR
Dimension (T)
1.8mm
1.9mm
2.7mm
2.8mm
3.7mm
4.8mm
6.4mm
Q
T
W

GRM55DR71H335MA01L Related Products

GRM55DR71H335MA01L GRM55ER71H475MA01L GRM219R60J475ME01D GRM55RR71H155MA01L GRM55DR71E106MA01L GRM43RF52A154ZA01L GRM43ER72A225MA01L
Description CAP CER 3.3UF 50V 20% X7R 2220 CAP 4.7UF 50V 20% X7R SMD-2220 TR-7-PL SN100 CAP 4.7UF 6.3V 20% X5R SMD-0805 TR-7-PA SN100 CAP CER 1.5UF 50V 20% X7R 2220 CAP CER 10UF 25V 20% X7R 2220 CAP CER .15UF 100V Y5V 1812 Capacitor, Ceramic, Chip, General Purpose, 2.2uF, 100V, ±20%, X7R, 1812 (4532 mm), 0.098\"T, -55º ~ +125ºC, 7\" Reel/Plastic Tape
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to
package instruction CHIP , 2220 , 0805 CHIP CHIP CHIP , 1812
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
capacitance 3.3 µF 4.7 µF 4.7 µF 1.5 µF 10 µF 0.15 µF 2.2 µF
Capacitor type CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR
dielectric materials CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
Installation features SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT
multi-layer Yes Yes Yes Yes Yes Yes Yes
negative tolerance 20% 20% 20% 20% 20% 20% 20%
Number of terminals 2 2 2 2 2 2 2
Maximum operating temperature 125 °C 125 °C 85 °C 125 °C 125 °C 85 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -30 °C -55 °C
Package shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE
method of packing TR, EMBOSSED, 7 INCH TR, EMBOSSED, 7 INCH TR, PAPER, 7 INCH TR, EMBOSSED, 7 INCH TR, EMBOSSED, 7 INCH TR, EMBOSSED, 7 INCH TR, EMBOSSED, 7 INCH
positive tolerance 20% 20% 20% 20% 20% 80% 20%
Rated (DC) voltage (URdc) 50 V 50 V 6.3 V 50 V 25 V 100 V 100 V
size code 2220 2220 0805 2220 2220 1812 1812
surface mount YES YES YES YES YES YES YES
Temperature characteristic code X7R X7R X5R X7R X7R Y5V X7R
Temperature Coefficient 15% ppm/°C 15% ppm/°C 15% ppm/°C 15% ppm/°C 15% ppm/°C -82/+22% ppm/°C 15% ppm/°C
Terminal shape WRAPAROUND WRAPAROUND WRAPAROUND WRAPAROUND WRAPAROUND WRAPAROUND WRAPAROUND
Maker Murata Murata - Murata Murata Murata Murata
high 2 mm 2.5 mm 0.85 mm - 2 mm - 2.5 mm
JESD-609 code e3 e3 e3 e3 e3 - e3
length 5.7 mm 5.7 mm 2 mm - 5.7 mm - 4.5 mm
Package form SMT SMT SMT - SMT - SMT
Terminal surface Matte Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier - Matte Tin (Sn) - with Nickel (Ni) barrier
width 5 mm 5 mm 1.25 mm - 5 mm - 3.2 mm
ATMEL releases new Cortex M7 development board
SAM V71 Xplained Ultra Evaluation Kit[align=left][color=#666666]The Atmel | SMART SAM V71 Xplained Ultra evaluation kit is ideal for evaluating and prototyping with the Atmel SAM V71, SAM V70, SAM S70...
rain_noise Microchip MCU
1000 points for helping solve the USB safe removal problem
Does anyone know the mechanism of USB safe removal? What actions does Windows take after clicking safe removal? When developing an encrypted USB disk, the encrypted disk is displayed in a virtual stat...
LIKEY Embedded System
2407 FFT???
Have you seen TI's FFT program? What data arrays are stored in the variables indati[N] and indatr[N]? The _input[2*N] array is even more confusing. 1. It is said to be a storage array for input data, ...
edwinzhu Microcontroller MCU
CAN Expansion Plan
Please give me some advice, I have never done 2430, but I want to make one for fun, please correct me[[i]This post was last edited by funydiy on 2010-8-3 23:07[/i]]...
funydiy Microcontroller MCU
Electronic Engineers Prize Survey: Fill out the survey and get 100% of the 50-yuan electronic coupons (first 300)
[align=left][color=rgb(68, 68, 68)][backcolor=rgb(255, 255, 255)][font=Tahoma, "][size=14px][size=4][font=微软雅黑]中外先智 sincerely invites netizens to participate in a prize-winning survey~ [/font][/size][...
EEWORLD社区 Integrated technical exchanges
[300 gifts ready] NXP High Energy Wireless MCU Creative Competition High Energy Launch
[align=left][b][font="][size=14.0pt]Creative Collection Time: [/size][/font][/b][font="][size=10.5pt]From now on to February 28 [/size][/font][/align][align=left][b][font="][size=14.0pt]Activity Page:...
EEWORLD社区 NXP MCU

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2651  2854  730  1208  2756  54  58  15  25  56 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号