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HYM72V64C756K8M-S

Description
Synchronous DRAM Module, 64MX72, 6ns, CMOS, DIMM-168
Categorystorage    storage   
File Size138KB,14 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Download Datasheet Parametric Compare View All

HYM72V64C756K8M-S Overview

Synchronous DRAM Module, 64MX72, 6ns, CMOS, DIMM-168

HYM72V64C756K8M-S Parametric

Parameter NameAttribute value
MakerSK Hynix
Parts packaging codeDIMM
package instructionDIMM, DIMM168
Contacts168
Reach Compliance Codecompliant
ECCN codeEAR99
access modeDUAL BANK PAGE BURST
Maximum access time6 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)100 MHz
I/O typeCOMMON
JESD-30 codeR-XDMA-N168
memory density4831838208 bit
Memory IC TypeSYNCHRONOUS DRAM MODULE
memory width72
Number of functions1
Number of ports1
Number of terminals168
word count67108864 words
character code64000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64MX72
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeDIMM
Encapsulate equivalent codeDIMM168
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
power supply3.3 V
Certification statusNot Qualified
refresh cycle8192
self refreshYES
Maximum standby current0.076 A
Maximum slew rate4.47 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationDUAL
64Mx72 bits
PC100 SDRAM Registered DIMM
with PLL, based on 32Mx8 SDRAM with LVTTL, 4 banks & 8K Refresh
HYM72V64C756K8M Series
DESCRIPTION
The HYM72V64C756K8M H-Series are high speed 3.3-Volt synchronous dynamic RAM Modules composed of eigh-
teen 32Mx8 bit Synchronous DRAMs in 54-pin TSOPII, two 48-pin TSSOP Register Buffers, one 24-pin TSSOP PLL and
8-pin TSSOP 2K bit EEPROM on a 168-pin glass-epoxy printed circuit board. One 0.22µF and one 0.0022µF decoupling
capacitors per each SDRAM are mounted on the module.
The HYM72V64C756K8M H-Series are gold plated socket type Dual In-line Memory Modules suitable for easy inter-
change and addition of 512M bytes memory. All addresses, data and control inputs are latched on the rising edge of the
master clock input. The data paths are internally pipelined to achieve very high bandwidths.
FEATURES
1.125” (28.56mm) PCB Height
168-Pin Registered DIMM with Double Sided
ECC support
One 0.22µF and one 0.0022µF decoupling
capacitors adopted
Serial Presence Detect with Serial EEPROM
Two Register Buffers & one Inverter used (with
PLL)
Supports Flow-through or Register mode by Pin
No. 147 (REGE)
Meets all the other JEDEC specifications
Single 3.3V±0.3V power supply
All device pins are LVTTL compatible
8192 refresh cycles every 64ms
• Auto precharge/precharge all banks by A
10
flag
• Possible to assert random column address every
clock cycle
• Interleaved auto refresh mode
• Programmable burst lengths and sequences
- 1,2,4,8,full page for Sequential type
- 1,2,4,8 for Interleave type
• Programmable /CAS latency ; 2,3 clocks
• Support clock suspend/power down mode by
CKE0Hynix
• Data mask function by DQM
• Mode register set programming
• Burst termination command
• Self refresh provides minimum power, full internal
ORDERING INFORMATION
Part No.
HYM72V64C756K8M-8
HYM72V64C756K8M-S
Clock
Frequency
125MHz
Internal
Bank
4 Banks
Ref.
Power
SDRAM
Package
TSOP-II
Plating
8K
Normal
Gold
100MHz
This document is a general product description and is subject to change without notice. Hyundai Electronics does not assume any responsibility for use of
circuits described. No patent licenses are implied.
Rev. 0.1/Apr. 2001

HYM72V64C756K8M-S Related Products

HYM72V64C756K8M-S HYM72V64C756K8M-8
Description Synchronous DRAM Module, 64MX72, 6ns, CMOS, DIMM-168 Synchronous DRAM Module, 64MX72, 6ns, CMOS, DIMM-168
Maker SK Hynix SK Hynix
Parts packaging code DIMM DIMM
package instruction DIMM, DIMM168 DIMM, DIMM168
Contacts 168 168
Reach Compliance Code compliant compliant
ECCN code EAR99 EAR99
access mode DUAL BANK PAGE BURST DUAL BANK PAGE BURST
Maximum access time 6 ns 6 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH
Maximum clock frequency (fCLK) 100 MHz 125 MHz
I/O type COMMON COMMON
JESD-30 code R-XDMA-N168 R-XDMA-N168
memory density 4831838208 bit 4831838208 bit
Memory IC Type SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
memory width 72 72
Number of functions 1 1
Number of ports 1 1
Number of terminals 168 168
word count 67108864 words 67108864 words
character code 64000000 64000000
Operating mode SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C
organize 64MX72 64MX72
Output characteristics 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED
encapsulated code DIMM DIMM
Encapsulate equivalent code DIMM168 DIMM168
Package shape RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
power supply 3.3 V 3.3 V
Certification status Not Qualified Not Qualified
refresh cycle 8192 8192
self refresh YES YES
Maximum standby current 0.076 A 0.076 A
Maximum slew rate 4.47 mA 4.47 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V
surface mount NO NO
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD
Terminal pitch 1.27 mm 1.27 mm
Terminal location DUAL DUAL
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