HFBR-5803/5803T/5803A/5803AT
FDDI, 100 Mb/s ATM, and Fast Ethernet Transceivers in
Low Cost 1 x 9 Package Style
Data Sheet
Description
Features
The HFBR-5800 family of transceivers from Avago Tech-
nologies provide the system designer with products
to implement a range of Fast Ethernet, FDDI and ATM
(Asynchronous Transfer Mode) designs at the 100 Mb/s-
125 MBd rate.
The transceivers are all supplied in the industry standard
1 x 9 SIP package style with either a duplex SC or a duplex
ST* connector interface.
FDDI PMD, ATM and Fast Ethernet 2 km Backbone
Links
The HFBR-5803/5803 Tare 1300nm products with
optical performance compliant with the FDDI PMD
standard. The FDDI PMD standard is ISO/IEC 9314-3:
1990 and ANSI X3.166 - 1990.
These transceivers for 2 km multimode fiber backbones are
supplied in the small 1 x 9 duplex SC or ST package style.
The HFBR-5803/-5803T is useful for both ATM 100 Mb/s
interfaces and Fast Ethernet 100 Base-FX interfaces. The
ATM Forum User-Network Interface (UNI) Standard, Version
3.0, defines the Physical Layer for 100 Mb/s Multimode
Fiber Interface for ATM in Section 2.3 to be the FDDI PMD
Standard. Likewise, the Fast Ethernet Alliance defines the
Physical Layer for 100 Base-FX for Fast Ethernet to be the
FDDI PMD Standard.
ATM applications for physical layers other than 100 Mb/s
Multimode Fiber Interface are supported by Avago Tech-
nologies. Products are available for both the single mode
and the multimode fiber SONET OC-3c (STS-3c) ATM in-
terfaces and the 155 Mb/s-194 MBd multimode fiber ATM
interface as specified in the ATM Forum UNI.
Contact your Avago Technologies sales representative
for information on these alternative Fast Ethernet, FDDI
and ATM products.
• Full compliance with the optical performance
requirements of the FDDI PMD standard
• Full compliance with the FDDI LCF-PMD standard
• Full compliance with the optical performance
requirements of the ATM 100 Mb/s physical layer
• Full compliance with the optical performance
requirements of 100 Base-FX version of IEEE 802.3u
• Multisourced 1 x 9 package style with choice of
duplex SC or duplex ST* receptacle
• Wave solder and aqueous wash process compatible
• Manufactured in an ISO 9002 certified facility
• Single +3.3 V or +5 V power supply
Applications
• Multimode fiber backbone links
• Multimode fiber wiring closet to desktop links
• Very low cost multimode fiber
links from wiring closet to desktop
• Multimode fiber media converters
*ST is a registered trademark of AT&T Lightguide Cable Connectors.
Note:
The “T” in the product numbers
indicates a transceiver with a duplex ST connector receptacle.
Product numbers without a “T” indicate transceivers with a duplex SC
connector receptacle.
Ordering Information
The HFBR-5803/5803T/5803A/5803AT 1300 nm products
are available for production orders through the Avago
Technologies Component Field Sales Offices and Autho-
rized Distributors world wide.
0 °C to +70 °C
HFBR-5803/5803T
-10 °C TO +85 °C
HFBR-5803A/5803AT
Transmitter Sections
The transmitter section of the HFBR-5803 and HFBR-5805
series utilize 1300 nm Surface Emitting InGaAsP LEDs. These
LEDs are packaged in the optical subassembly portion
of the transmitter section. They are driven by a custom
silicon IC which converts differential PECL logic signals,
ECL referenced (shifted) to a +3.3 V or +5 V supply, into
an analog LED drive current.
Receiver Sections
The receiver sections of the HFBR-5803 and HFBR-5805
series utilize InGaAs PIN photodiodes coupled to a custom
silicon transimpedance preamplifier IC. These are pack-
aged in the optical subassembly portion of the receiver.
These PIN/preamplifier combinations are coupled to a
custom quantizer IC which provides the final pulse shap-
ing for the logic output and the Signal Detect function.
The data output is differential. The signal detect output
is single-ended. Both data and signal detect outputs are
PECL compatible, ECL referenced (shifted) to a +3.3 V or
+5 V power supply.
Package
The overall package concept for the Avago Technologies
transceivers consists of the following basic elements; two
optical subassemblies, an electrical subassembly and the
housing as illustrated in Figure 1 and Figure 1a.
The package outline drawings and pin out are shown in
Figures 2, 2a and 3. The details of this package outline and
pin out are compliant with the multisource definition of
the 1 x 9 SIP. The low profile of the Avago Technologies
transceiver design complies with the maximum height al-
lowed for the duplex SC connector over the entire length
of the package.
ELECTRICAL SUBASSEMBLY
DIFFERENTIAL
DATA OUT
SINGLE-ENDED
SIGNAL
DETECT OUT
QUANTIZER IC
PREAMP IC
The optical subassemblies utilize a high volume assembly
process together with low cost lens elements which result
in a cost effective building block.
The electrical subassembly consists of a high volume
multilayer printed circuit board on which the IC chips
and various surface-mounted passive circuit elements
are attached.
The package includes internal shields for the electrical
and optical subassemblies to ensure low EMI emissions
and high immunity to external EMI fields.
The outer housing including the duplex SC connector
receptacle or the duplex ST ports is molded of filled non-
conductive plastic to provide mechanical strength and
electrical isolation. The solder posts of the Agilent design
are isolated from the circuit design of the transceiver
and do not require connection to a ground plane on the
circuit board.
The transceiver is attached to a printed circuit board with
the nine signal pins and the two solder posts which exit
the bottom of the housing. The two solder posts provide
the primary mechanical strength to withstand the loads
imposed on the transceiver by mating with duplex or
simplex SC or ST connectored fiber cables.
DUPLEX SC
RECEPTACLE
PIN PHOTODIODE
OPTICAL
SUBASSEMBLIES
DIFFERENTIAL
DATA IN
DRIVER IC
LED
TOP VIEW
Figure 1. SC Connector Block Diagram.
ELECTRICAL SUBASSEMBLY
DIFFERENTIAL
DATA OUT
SINGLE-ENDED
SIGNAL
DETECT OUT
QUANTIZER IC
PREAMP IC
DUPLEX ST
RECEPTACLE
PIN PHOTODIODE
OPTICAL
SUBASSEMBLIES
DIFFERENTIAL
DATA IN
DRIVER IC
LED
TOP VIEW
Figure 1a. ST Connector Block Diagram.
Case Temperature
Measurement Point
39.12
MAX.
(1.540)
12.70
(0.500)
6.35
(0.250)
25.40
MAX.
(1.000)
AREA
RESERVED
FOR
PROCESS
PLUG
12.70
(0.500)
HFBR-5803
DATE CODE (YYWW)
SINGAPORE
+ 0.08
0.75
– 0.05
3.30 ± 0.38
+ 0.003 )
(0.130 ± 0.015) (0.030
– 0.002
AGILENT
5.93 ± 0.1
(0.233 ± 0.004)
3.30 ± 0.38
(0.130 ± 0.015)
10.35 MAX.
(0.407)
2.92
(0.115)
Ø
0.46
(9x)
(0.018)
NOTE 1
18.52
(0.729)
4.14
(0.163
1.27 + 0.25
– 0.05
(0.050 + 0.010 )
– 0.002
NOTE 1
23.55
(0.927)
20.32 [8x(2.54/.100)]
(0.800)
16.70
(0.657)
17.32 20.32
(0.682 (0.800)
23.32
(0.918)
0.87
(0.034)
23.24
(0.915)
15.88
(0.625)
NOTE 1: THE SOLDER POSTS AND ELECTRICAL PINS ARE PHOSPHOR BRONZE WITH TIN LEAD OVER NICKEL PLATING.
DIMENSIONS ARE IN MILLIMETERS (INCHES).
Figure 2. SC Connector Package Outline Drawing with standard height.
42 MAX.
(1.654)
24.8
(0.976)
5.99
(0.236)
25.4
MAX.
(1.000)
12.7
(0.500)
HFBR-5803T
DATE CODE (YYWW)
SINGAPORE
Case Temperature
Measurement Point
12.0
MAX.
(0.471)
2.6 ±0.4
(0.102 ± 0.016)
Ø 0.46
(0.018)
NOTE 1
20.32
± 0.38
(± 0.015)
3.3 ± 0.38
(0.130 ± 0.015)
+ 0.25
- 0.05
(0.050) + 0.010
( - 0.002 )
1.27
20.32
(0.800)
Ø 2.6
(0.102)
22.86
(0.900)
20.32
[(8x (2.54/0.100)]
(0.800)
21.4
(0.843)
3.6
(0.142)
17.4
(0.685)
1.3
(0.051)
23.38
(0.921)
18.62
(0.733)
NOTE 1: PHOSPHOR BRONZE IS THE BASE MATERIAL FOR THE POSTS & PINS WITH TIN LEAD OVER NICKEL PLATING.
DIMENSIONS IN MILLIMETERS (INCHES).
Figure 2a. ST Connector Package Outline Drawing with standard height.
1 = V
EE
2 = RD
3 = RD
4 = SD
5 = V
CC
6 = V
CC
7 = TD
8 = TD
9 = V
EE
Figure 3. Pin Out Diagram.
N/C
Rx
Tx
N/C
TOP VIEW
(
+ 0.08
0.5
- 0.05
(0.020) + 0.003
( - 0.002
Application Information
The Applications Engineering group in the Avago Tech-
nologies Fiber Optics Communication Division is avail-
able to assist you with the technical understanding and
design trade-offs associated with these transceivers. You
can contact them through your Avago Technologies sales
representative.
The following information is provided to answer some
of the most common questions about the use of these
parts.
Transceiver Optical Power Budget versus Link
Length
Optical Power Budget (OPB) is the available optical power
for a fiber optic link to accommodate fiber cable losses plus
losses due to in-line connectors, splices, optical switches,
and to provide margin for link aging and unplanned losses
due to cable plant reconfiguration or repair.
Figure 4 illustrates the predicted OPB associated with the
transceiver series specified in this data sheet at the Begin-
ning of Life (BOL). These curves represent the attenuation
and chromatic plus modal dispersion losses associated
with the 62.5/125 µm and 50/125 µm fiber cables only.
The area under the curves represents the remaining OPB
at any link length, which is available for overcoming non-
fiber cable related losses.
Avago Technologies LED technology has produced 1300
nm LED devices with lower aging characteristics than nor-
mally associated with these technologies in the industry.
The industry convention is 1.5 dB aging for 1300 nm LEDs.
The Avago Technologies 1300 nm LEDs will experience less
than 1 dB of aging over normal commercial equipment
mission life periods. Contact your Avago Technologies
sales representative for additional details.
12
10
HFBR-5803, 62.5/125 µm
Figure 4 was generated with a Avago Technologies fiber
optic link model containing the current industry conven-
tions for fiber cable specifications and the FDDI PMD
and LCF-PMD optical parameters. These parameters are
reflected in the guaranteed performance of the transceiver
specifications in this data sheet. This same model has been
used extensively in the ANSI and IEEE committees, including
the ANSI X3T9.5 committee, to establish the optical perfor-
mance requirements for various fiber optic interface stan-
dards. The cable parameters used come from the ISO/IEC
JTC1/SC 25/WG3 Generic Cabling for Customer Premises per
DIS 11801 document and the EIA/TIA-568-A Commercial
Building Telecommunications Cabling Standard per SP-
2840.
Transceiver Signaling Operating Rate Range and BER
Performance
For purposes of definition, the symbol (Baud) rate, also
called signaling rate, is the reciprocal of the shortest
symbol time. Data rate (bits/sec) is the symbol rate di-
vided by the encoding factor used to encode the data
(symbols/bit).
When used in Fast Ethernet, FDDI and ATM 100 Mb/s
applications the performance of the 1300 nm transceiv-
ers is guaranteed over the signaling rate of 10 MBd to
125 MBd to the full conditions listed in individual product
specification tables.
2.5
TRANSCEIVER RELATIVE OPTICAL POWER BUDGET
AT CONSTANT BER (dB)
2.0
1.5
1.0
0.5
0
0.5
0
25
50
75
100
125
150
175 200
OPTICAL POWER BUDGET (dB)
8
6
4
2
0
1.
0
HFBR-5803
50/125 µm
SIGNAL RATE (MBd)
CONDITIONS:
1. PRBS 2
7
-1
2. DATA SAMPLED AT CENTER OF DATA SYMBOL.
3. BER = 10
-6
4. T
A
= +25˚ C
5. V
CC
= 3.3 V to 5 V dc
6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.
Figure 5. Transceiver Relative Optical Power Budget at Constant
BER vs. Signaling Rate.
1.5
2.0
2.5
0.3 0.5
FIBER OPTIC CABLE LENGTH (km)
Figure 4. Optical Power Budget at BOL versus Fiber Optic Cable
Length.
The transceivers may be used for other applications at
signaling rates outside of the 10 MBd to 125 MBd range with
some penalty in the link optical power budget primarily
caused by a reduction of receiver sensitivity. Figure 5 gives
an indication of the typical performance of these 1300 nm
products at different rates.
These transceivers can also be used for applications which
require different Bit Error Rate (BER) performance. Figure 6
illustrates the typical trade-off between link BER and the
receivers input optical power level.
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