MXLLCE8.5ATR datasheet, PDF - EEWORLD Datasheet

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MXLLCE8.5ATR: DescriptionTrans Voltage Suppressor Diode, 1500W, 8.5V V(RWM), Unidirectional, 1 Element, Silicon, PLASTIC, CASE 1, 2 PIN; CategoryDiscrete semiconductor diode; File Size269KB，4 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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MXLLCE8.5ATR Overview

Trans Voltage Suppressor Diode, 1500W, 8.5V V(RWM), Unidirectional, 1 Element, Silicon, PLASTIC, CASE 1, 2 PIN

MXLLCE8.5ATR Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Microsemi
package instruction	PLASTIC, CASE 1, 2 PIN
Contacts	2
Manufacturer packaging code	CASE 1
Reach Compliance Code	unknown
ECCN code	EAR99
Other features	HIGH RELIABILITY
Maximum breakdown voltage	10.4 V
Minimum breakdown voltage	9.44 V
Breakdown voltage nominal value	9.92 V
Shell connection	ISOLATED
Maximum clamping voltage	14.4 V
Configuration	SINGLE
Diode component materials	SILICON
Diode type	TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 code	O-PALF-W2
JESD-609 code	e0
Maximum non-repetitive peak reverse power dissipation	1500 W
Number of components	1
Number of terminals	2
Package body material	PLASTIC/EPOXY
Package shape	ROUND
Package form	LONG FORM
polarity	UNIDIRECTIONAL
Maximum power dissipation	5 W
Certification status	Not Qualified
Maximum repetitive peak reverse voltage	8.5 V
surface mount	NO
technology	AVALANCHE
Terminal surface	TIN LEAD
Terminal form	WIRE
Terminal location	AXIAL

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TECHNICAL DATA SHEET

Gort Road Business Park, Ennis, Co. Clare, Ireland.

Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298

Website: http://www.microsemi.com

6 Lake Street, Lawrence, MA 01841

Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803

1500 Watt Low Capacitance

Transient Voltage Suppressor

- High Reliability controlled devices

- Unidirectional (A) construction

- Plastic encapsulated TVS series for Thru Hole mounting

- Selections for 6.5 to 170 V standoff voltages (V

)

LEVELS

M, MA, MX, MXL

DEVICES

MLCE6.5A thru MLCE170A, e3

FEATURES



High reliability controlled devices with wafer fabrication and assembly lot traceability

100 % surge tested devices

Unidirectional construction. For bidirectional option see Figure 4.

Suppresses transients up to 1500 watts @10/1000µs (see Figure 1)

Clamps transients in less than 100 pico seconds

Optional upscreening available by replacing the M prefix with MA, MX or MXL. These prefixes specify

various screening and conformance inspection options based on MIL-PRF-19500. Refer to

MicroNote

129

for more details on the screening options.

Surface mount equivalent packages also available as MSMC(G/J)LCE6.5A - MSMC(G/J)LCE170A in

separate data sheet (consult factory for other surface mount options)

Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B

RoHS Compliant devices available by adding “e3” suffix

3σ lot norm screening performed on Standby Current I

CASE 1

APPLICATIONS / BENEFITS



Protection from switching transients and induced RF

Low capacitance for data line protection to 1 MHz

Protection for aircraft fast data rate lines up to Level 5 Waveform 4 and Level 2 Waveform 5A in

RTCA/DO-160D (also see MicroNote 130) & ARINC 429 with bit rates of 100 kb/s (per ARINC 429, Part

1, par 2.4.1.1)

Protection from ESD and EFT per IEC 61000-4-2 and IEC 61000-4-4

Secondary lightning protection per IEC 61000-4-5 with 42 Ohms source impedance:

Class 1:

Class 2:

Class 3:

Class 4:

Class 1 :

Class 2:

Class 3:

Class 4:

MLCE6.5A to MLCE170A

MLCE6.5A to MLCE150A

MLCE6.5A to MLCE70A

MLCE6.5A to MLCE36A

MLCE6.5A to

MLCE90A

MLCE45 A

MLCE22A

MLCE11A



Secondary lightning protection per IEC 61000-4-5 with 12 Ohms source impedance:



Secondary lightning protection per IEC 61000-4-5 with 2 Ohms source impedance:

Class 2: MLCE6.5A to MLCE20A

Class 3: MLCE6.5A to MLCE10A

MAXIMUM RATINGS



Peak Pulse Power dissipation at 25 ºC: 1500 watts at 10/1000 μs (see Figure 1) with impulse repetition

rate of 0.01% or less* at lead temperature T

of 25°C

Operating & Storage Temperatures: -65 ºC to +150 ºC

Thermal Resistance: 22 ºC/W junction to lead at 3/8 inch (10 mm) from body, or 82 ºC/W junction to

ambient when mounted on FR4 PC board with 4 mm

copper pads (1oz), track width 1 mm, length 25mm

Steady-State Power dissipation*: 5 watts at TL = 40 ºC, or 1.52 watts at TA = 25 ºC when mounted on

FR4 PC board described for thermal resistance

Solder Temperatures: 260

C for 10 s (maximum)

* TVS devices are not typically used for dc power dissipation and are instead operated at ≤ V

except for transients that briefly

drive the device into avalanche breakdown (V

to V

region) of the TVS element. Also see Figures 3 and 4 for further protection

details in rated peak power for unidirectional and bidirectional configurations respectively.

RF01009 Rev A, June 2010

High Reliability Product Group

Page 1 of 4

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