4000/14000/40000 SERIES, QUAD 2-INPUT NOR GATE, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| Parts packaging code | DIP |
| package instruction | DIP, DIP14,.3 |
| Contacts | 14 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| series | 4000/14000/40000 |
| JESD-30 code | R-GDIP-T14 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | NOR GATE |
| Number of functions | 4 |
| Number of entries | 2 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5/15 V |
| Prop。Delay @ Nom-Sup | 250 ns |
| propagation delay (tpd) | 250 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Maximum supply voltage (Vsup) | 18 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| CD4001BD | CD4002BD | CD4025BH | CD4001BH | CD4002BH | CD4025BD | |
|---|---|---|---|---|---|---|
| Description | 4000/14000/40000 SERIES, QUAD 2-INPUT NOR GATE, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14 | 4000/14000/40000 SERIES, DUAL 4-INPUT NOR GATE, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14 | 4000/14000/40000 SERIES, TRIPLE 3-INPUT NOR GATE, UUC14, DIE-14 | 4000/14000/40000 SERIES, QUAD 2-INPUT NOR GATE, UUC14, DIE-14 | 4000/14000/40000 SERIES, DUAL 4-INPUT NOR GATE, UUC14, DIE-14 | 4000/14000/40000 SERIES, TRIPLE 3-INPUT NOR GATE, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14 |
| Parts packaging code | DIP | DIP | DIE | DIE | DIE | DIP |
| package instruction | DIP, DIP14,.3 | HERMETIC SEALED, CERAMIC, DIP-14 | DIE, | DIE, | DIE, | DIP, DIP14,.3 |
| Contacts | 14 | 14 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | not_compliant | not_compliant | unknown | unknown | unknown | unknown |
| series | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 |
| JESD-30 code | R-GDIP-T14 | R-GDIP-T14 | R-XUUC-N14 | R-XUUC-N14 | R-XUUC-N14 | R-GDIP-T14 |
| Logic integrated circuit type | NOR GATE | NOR GATE | NOR GATE | NOR GATE | NOR GATE | NOR GATE |
| Number of functions | 4 | 2 | 3 | 4 | 2 | 3 |
| Number of entries | 2 | 4 | 3 | 2 | 4 | 3 |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DIP | DIE | DIE | DIE | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | IN-LINE |
| propagation delay (tpd) | 250 ns | 250 ns | 250 ns | 250 ns | 250 ns | 250 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V |
| Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE |
| Terminal location | DUAL | DUAL | UPPER | UPPER | UPPER | DUAL |
| Maker | Texas Instruments | Texas Instruments | - | - | Texas Instruments | Texas Instruments |