FMM5804X
17.5-31.5GHz Power Amplifier MMIC
FEATURES
• Output Power: (P1dB): 23.0dBm (Typ.)
• High Gain: (G1dB): 18dB (Typ.)
• High PAE:
η
add = 18% (Typ.)
• Wide Frequency Band: 17.5-31.5 GHz
• Impedance Matched Zin/Zout = 50Ω
• 0.25µm PHEMT Technology
DESCRIPTION
The FMM5804X is a high-gain, wide band 4-stage
MMIC amplifier designed for operation in the 17.5-31.5 GHz
frequency range. This amplifier has an input and output designed for use
in 50Ω systems.This device is well suited for point-to-point, point-to-multi-
point(LMDS) and satellite communication system applications.
Eudyna’s stringent Quality Assurance Program assures the highest
reliability and consistent performance.
ABSOLUTE MAXIMUM RATING (Ambient Temperature Ta=25°C)
Item
Drain Voltage
Gate Voltage
Input Power
Storage Temperature
Channel Temperature
Operating Backside Temperature
Symbol
VDD
VGG
Pin
Tstg
Tch
Top
Condition
Rating
10
-3.0
16
-65 to +175
175
-40 to +95
Unit
V
V
dBm
°C
°C
°C
Eudyna recommends the following conditions for the long term reliable operation of GaAs FETs:
1. The drain-source operating voltage (VDD) should not exceed 6 volts.
2. The forward and reverse gate currents should not exceed 1.0 and -0.08 mA respectively.
3. This product should be hermetically packaged.
ELECTRICAL CHARACTERISTICS (Ambient Temperature Tc=25°C)
Item
Frequency Range
Output Power at 1 dB G.C.P.
Power Gain at 1 dB G.C.P.
Drain Current
Power-Added Efficiency
Input Return Loss
Output Return Loss
Symbol
f
P
1dB
G
1dB
Iddrf
η
add
RLi
RLo
VDD = 6V
f = 17.5 ~ 31.5 GHz
*: at f = 17.5-30.0 GHz
**: at f = 30.0-31.5 GHz
IDD
=
250mA (Typ.)
ZS = ZL = 50Ω
Conditions
Limits
Min. Typ. Max.
17.5-31.5
23*
21**
15
-
-
-
-
25*
23**
18
300
18
-15
-8
-
-
-
400
-
-
-
Unit
GHz
dBm
dB
mA
%
dB
dB
Note:
RF parameter sample size 10pcs. Criteria (accept/reject)=(0/1)
G.C.P.: Gain Compression Point
Edition 1.5
September 2004
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FMM5804X
17.5-31.5GHz Power Amplifier MMIC
CHIP OUTLINE
0
VGG1
80
1410
1335
1140
1140
550
VGG2
1150
VGG3
1750
VGG4
2050
2530
Unit:
µm
RFin
RFout
0
75
80
240
VDD1
0
840
VDD2
2330 2470
VDD3 VDD4
Chip Size: 2610±30µm x 1410±30µm
Chip Thickness:70±20µm
Pad Dimensions: 1. DC 80 x 80µm
2. RF 120 x 80µm
2610
0
For further information please contact:
CAUTION
Eudyna Devices Inc. products contain
gallium arsenide
(GaAs)
which can be hazardous to the human body and the environment.
For safety, observe the following procedures:
Eudyna Devices USA Inc.
2355 Zanker Rd.
San Jose, CA 95131-1138, U.S.A.
TEL: (408) 232-9500
FAX: (408) 428-9111
www.us.eudyna.com
• Do not put this product into the mouth.
• Do not alter the form of this product into a gas, powder, or liquid
through burning, crushing, or chemical processing as these by-products
are dangerous to the human body if inhaled, ingested, or swallowed.
• Observe government laws and company regulations when discarding this
product. This product must be discarded in accordance with methods
specified by applicable hazardous waste procedures.
Eudyna Devices Europe Ltd.
Network House
Norreys Drive
Maidenhead, Berkshire SL6 4FJ
United Kingdom
TEL: +44 (0) 1628 504800
FAX: +44 (0) 1628 504888
Eudyna Devices Asia Pte Ltd.
Hong Kong Branch
Rm. 1101, Ocean Centre, 5 Canton Rd.
Tsim Sha Tsui, Kowloon, Hong Kong
TEL: +852-2377-0227
FAX: +852-2377-3921
Eudyna Devices Inc. reserves the right to change products and specifications
without notice. The information does not convey any license under rights of
Eudyna Devices Inc. or others.
© 2004 Eudyna Devices USA Inc.
Printed in U.S.A.
Eudyna Devices Inc.
Sales Division
1, Kanai-cho, Sakae-ku
Yokohama, 244-0845, Japan
TEL: +81-45-853-8156
FAX: +81-45-853-8170
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