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MS312RAAR33GSN

Description
General Purpose Inductor, 330uH, 2%, 1 Element, Ceramic-Core, SMD, CHIP, 0603
CategoryPassive components    inductor   
File Size136KB,2 Pages
ManufacturerCOILCRAFT
Websitehttp://www.coilcraft.com/
Download Datasheet Parametric View All

MS312RAAR33GSN Overview

General Purpose Inductor, 330uH, 2%, 1 Element, Ceramic-Core, SMD, CHIP, 0603

MS312RAAR33GSN Parametric

Parameter NameAttribute value
MakerCOILCRAFT
Reach Compliance Codeunknown
ECCN codeEAR99
core materialCERAMIC
DC Resistance3.89 Ω
Nominal inductance(L)330 µH
Inductor ApplicationsRF INDUCTOR
Inductor typeGENERAL PURPOSE INDUCTOR
JESD-609 codee0
Manufacturer's serial numberMS312RAA
Number of functions1
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Minimum quality factor (at nominal inductance)26
Maximum rated current0.1 A
self resonant frequency620 MHz
Shape/Size DescriptionRECTANGULAR PACKAGE
shieldNO
surface mountYES
Terminal surfaceTIN LEAD
Terminal locationDUAL ENDED
Terminal shapeWRAPAROUND
Test frequency100 MHz
Tolerance2%
0603 CHIP INDUCTORS
High-Reliability Chip Inductors
MS312RAA
Small size, exceptional Q and high SRFs make these
inductors ideal for high frequency applications where
size is at a premium. They also have excellent DCR and
current carrying characteristics.
This robust version of Coilcraft’s standard 0603CS series
features high temperature materials that allow operation in
ambient temperatures up to 155°C and a leach-resistant
base metalization with tin-lead (Sn-Pb) terminations that
ensures the best possible board adhesion.
Current Derating
120
110
100
90
80
70
60
50
30
20
10
0
-40
-20
0
20
40
60
80
100
120
140 160
40
Typical L vs Frequency
400
350
300
270 nH
Percent of rated
I
rms
Ambient temperature (°C)
Inductance (nH)
250
200
150
100
50
0
10
100
1000
120 nH
68 nH
B
overall
F
A
G
F
E
terminal
25°C
C
I
J
I
H
33 nH
12 nH
3.9 nH
10000
D
Terminal wraparound:
approx 0.007/0,18 both ends
Frequency (MHz)
Suggested
Land Pattern
Typical Q vs Frequency
100
90
80
70
A
max
0.071
1,80
12 nH
3.9 nH
B
max
0.044
1,12
C
max
1,02
D
ref
0,38
E
0,76
F
0,33
G
0,86
H
1,02
I
0,64
J
0,64
0.040 0.015 0.030 0.013 0.034 0.040 0.025 0.025
33 nH
68 nH
270 nH
Note: Dimensions are before solder application. For maximum overall
dimensions including solder, add 0.0025 in / 0,064 mm to
B
and
0.006 in / 0,15 mm to
A
and
C.
Q factor
60
50
40
30
20
10
0
10
100
120 nH
1000
10000
Frequency (MHz)
Core material
Ceramic
Terminations
Tin-lead (63/37) over silver-platinum-glass frit
Ambient temperature
–55°C to +125°C with
Imax
current, +125°C
to +155°C with derated current
Storage temperature
Component: –55°C to +155°C.
Packaging: –55°C to +80°C
Resistance to soldering heat
Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL)
+25 to +155 ppm/°C
Moisture Sensitivity Level (MSL)
1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging
2000 per 7″ reel
Paper tape: 8 mm wide, 1.0 mm thick, 4 mm pocket spacing
®
Specifications subject to change without notice.
Please check our website for latest information.
Document MS195-1
Revised 08/02/11
1102 Silver Lake Road
Cary IL 60013
© Coilcraft, Inc. 2011
Phone 800-981-0363
Fax 847-639-1508
E-mail cps@coilcraft.com
Web www.coilcraft-cps.com

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