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MCM63Z936ZP8R

Description
ZBT SRAM, 512KX36, 8ns, CMOS, PBGA119, PLASTIC, BGA-119
Categorystorage    storage   
File Size2MB,35 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric View All

MCM63Z936ZP8R Overview

ZBT SRAM, 512KX36, 8ns, CMOS, PBGA119, PLASTIC, BGA-119

MCM63Z936ZP8R Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMotorola ( NXP )
package instructionBGA, BGA119,7X17,50
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time8 ns
Other featuresALSO REQUIRE 2.5 OR 3.3 V I/O SUPPLY
I/O typeCOMMON
JESD-30 codeR-PBGA-B119
JESD-609 codee0
length22 mm
memory density18874368 bit
Memory IC TypeZBT SRAM
memory width36
Number of functions1
Number of terminals119
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX36
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA119,7X17,50
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2.5/3.3,3.3 V
Certification statusNot Qualified
Maximum seat height2.4 mm
Maximum standby current0.01 A
Minimum standby current3.14 V
Maximum slew rate0.29 mA
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm
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