2 mm 4/5-Row, Vertical, Solder or Press-Fit Tail, Shouldered Pin
MP2 Series
Solder Tail
• End-to-end stackable
• Select load capability
• Monoblockable
• Shoulder Pin
Press Fit
• End-to-end stackable
• Early mate late break for hot swapping (press-fit EMLB
adjusted by application tooling)
• Select load capability
• Monoblockable
• Push-on shoulder pin
• Optional feed-through tail for rear plug-up midplane
applications
• Accepts Universal Tooling
• RoHS Compliant. See the Regulatory Information
Appendix (RIA) in the “RoHS compliance” section of
www.3M.com/Interconnects for compliance information
(RIA E1 & C1 apply)
Date Modified: September 9, 2009
TS-1120-C
Sheet 1 of 4
Physical
Insulation:
Material: High Temp LCP
Flammability: UL 94V-0
Color: Beige
Color:
Material: Phosphor Bronze
Plating:
Underplating: 50 μ” [1.27 μm] Nickel
Wiping Area: See Ordering Information
Solder Tails: See Ordering Information
Electrical
Current Rating:
Signal: 1.5 A - All contacts simultaneously
Insulation Resistance:
10
3
MΩ
Withstanding Voltage:
1,000 V
AC
Environmental
Temperature Rating:
-55°C to +125°C
Process Temperature Rating:
260°C (Profile per J-STD-020C)
Moisture Sensitivity Level:
1 (per J-STD-020C)
UL File No.: E68080
3
Electronic Solutions Division
Interconnect Solutions
http://www.3M.com/interconnects/
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
3M
™
MetPak
™
2-FB Header
2 mm 4/5-Row, Vertical, Solder or Press-Fit Tail, Shouldered Pin
POSITION X
"A" 6.00
.236
2.00
.079
MP2 Series
POSITION 2
POSITION 1
15.80
.622
11.50
.453
1.40
.055
2.00
.079
17.00
.669
FOR SPECIAL MONOBLOCKS
AND PIN ARRANGEMENTS
CONTACT 3M SALES
REPRESENTATIVE
mm
[inch]
3.50
.138
12.00
.472
Tolerance Unless Noted
0
mm
±3
0.0
±0.3
0.00
±0.13
4 ROW PRODUCT
17.80
.701
13.52
.532
[ ] Dimensions for Reference Only
MATING LENGTH
"B" TAIL LENGTH
14.00
.551
E D C B A
ROW
"C"
5 ROW PRODUCT
SOLDER TAIL
PRODUCT
PRESS-FIT
PRODUCT
PRESS-FIT
PRODUCT
REAR
PLUG-UP
Note:
1. Refer to IEC 61076-4-104 Futurebus+
®
global standard.
2. “Press Fit” describes a contact tail having a compliant section designed to make a reliable electrical connection with a
plated through-hole (PTH) in a printed circuit board, typically a “back plane.”
Ordering Information
MP2 - HXXX - XXXX - S - XXXXX
H = Header
Pin Count
(See Table 1)
Rows
4 = 4 Rows
5 = 5 Rows
Loading Pattern
(See Table 2)
Plating Options:
(See Table 4)
Shouldered Pins
Tail Length
(See Table 3)
Termination Style
P = Press-Fit
S = Solder Tail
TS-1120-C
Sheet 2 of 4
3
Electronic Solutions Division
Interconnect Solutions
http://www.3M.com/interconnects/
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
3M
™
MetPak
™
2-FB Header
2 mm 4/5-Row, Vertical, Solder or Press-Fit Tail, Shouldered Pin
Table 1 - Connector & Row Lengths
Pin
Count
024
048
072
096
120
144
168
192
030
060
090
120
150
180
210
240
Dim. “A”
mm [inch]
11.95 [0.471]
23.95 [0.943]
35.95 [1.415]
47.95 [1.889]
59.95 [2.36]
71.95 [2.833]
83.95 [3.305]
95.95 [3.778]
11.95 [0.471]
23.95 [0.943]
35.95 [1.415]
47.95 [1.888]
59.95 [2.361]
71.95 [2.833]
83.95 [3.305]
95.95 [3.778]
Dim “C”
mm [inch]
10.00 [0.394]
22.00 [0.866]
34.00 [1.339]
46.00 [1.811]
58.00 [2.283]
70.00 [2.756]
82.00 [3.228]
94.00 [3.701]
10.00 [0.394]
22.00 [0.866]
34.00 [1.339]
46.00 [1.811]
58.00 [2.283]
70.00 [2.756]
82.00 [3.228]
94.00 [3.701]
Rows
4
4
4
4
4
4
4
4
5
5
5
5
5
5
5
5
RF
(RIA E1 &
C1 apply)
(RIA E1 &
C1 apply)
KR
FJ
(RIA E1 &
C1 apply)
(RIA E1 &
C1 apply)
(RIA E1 &
C1 apply)
(RIA E1 &
C1 apply)
TR40B
TR30
MP2 Series
Solder
Tails
(RIA E3 &
C2 apply)
(RIA E3 &
C2 apply)
(RIA E3 &
C2 apply)
Table 4 - Plating Options
Plating
Suffix
TG
TG30
Press-Fit
Tails*
(RIA E2 &
C2 apply)
(RIA E2 &
C2 apply)
(RIA E2 &
C2 apply)
Plating Composition
0.25 μm [10 μ”] Min. Au Contact Area
2.54 μm [100 μ”] Min. SnPb Tail Area
1.27 μm [50 μ”] Min. Ni all over
0.76 μm [30 μ”] Min. Au Contact Area
2.54 μm [100 μ”] Min. SnPb Tail Area
1.27 μm [50 μ”] Min. Ni all over
0.08 μm [3 μ”] Min. Au Contact Area
0.67 μm [27 μ”] Min. PdNi Contact Area
2.54 μm [100 μ”] Min. SnPb Tail Area
1.27 μm [50 μ”] Min. Ni all over
0.13 μm [5 μ”] Min. Hard Au Contact Area,
Lubricated
1.02 μm [40 μ”] Min. PdNi Contact Area
0.10 μm [4 μ”] Min. Pd Contact Area
2.54 μm [100 μ”] Min. SnPb Tail Area
1.27 μm [50 μ”] Min. Ni all over
0.25 μm [10 μ”] Min. Au Contact Area
5.08 μm [200 μ”] Min. Matt Whisker Mitigating
Sn Tail Area
1.27 μm [50 μ”] Min. Ni all over
0.76 μm [30 μ”] Min. Au Contact Area
5.08 μm [200 μ”] Min. Matt Whisker Mitigating
Sn Tail Area
1.27 μm [50 μ”] Min. Ni all over
1.27 μm [50 μ”] Min. Au Contact Area, Lubri-
cated
5.08 μm [200 μ”] Min. Matt Whisker Mitigating
Sn Tail Area
1.27 μm [50 μ”] Min. Ni all over
0.08 μm [3 μ”] Min. Au Contact Area
0.67 μm [27 μ”] Min. PdNi Contact Area
5.08 μm [200 μ”] Min. Matt Whisker Mitigating
Sn Tail Area
1.27 μm [50 μ”] Min. Ni all over
0.13 μm [5 μ”] Min. Hard Au Contact Area,
Lubricated
1.02 μm [40 μ”] Min. PdNi Contact Area
0.10 μm [4 μ”] Min. Pd Contact Area
5.08 μm [200 μ”] Min. Matt Whisker Mitigating
Sn Tail Area
0.76 μm [30 μ”] Min. Au Dual Contact Areas
0.10 μm [4 μ”] Min. Au Needle Eye
1.27 μm [50 μ”] Min. Ni all over
(RIA E2 &
C2 apply)
(RIA E3 &
C2 apply)
Table 3 - Tail Length Options
Termination Option No.
Solder Tail
1
2
3
Press-Fit* Tail
1
4.60 [0.181]
3.53 [0.139]
Dim. “B”
LR
(RIA E1 &
C1 apply)
(RIA E1 &
C1 apply)
*Compliant-Pin Tail
5 (Contact 3M)
7 (Contact 3M)
2.72 [0.107]
13.60 [0.535]
17.00 [0.669]
PD
(RIA E1 &
C1 apply)
(RIA E1 &
C1 apply)
KV
(RIA E1 &
C1 apply)
(RIA E1 &
C1 apply)
Table 2 - Mate Length vs. Loading Pattern
Loading Pattern
Code
1
2
3
4
5
6
7
8
9
A
B
C
D
E
G
H
J
K
Description
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
Mate length
Row A
5.00 [0.197]
6.50 [0.256]
6.50 [0.256]
6.50 [0.256]
5.75 [0.226]
7.25 [0.285]
6.50 [0.256]
6.50 [0.256]
5.00 [0.197]
5.00 [0.197]
5.75 [0.226]
5.00 [0.197]
5.75 [0.226]
7.25 [0.285]
7.25 [0.285]
5.00 [0.197]
8.00 [0.315]
5.00 [0.197]
Mate length
Row B
5.00 [0.197]
5.00 [0.197]
5.75 [0.226]
6.50 [0.256]
7.25 [0.285]
5.75 [0.226]
5.75 [0.226]
5.00 [0.197]
6.50 [0.256]
5.75 [0.226]
5.75 [0.226]
5.00 [0.197]
5.75 [0.226]
7.25 [0.285]
5.75 [0.226]
5.75 [0.226]
8.00 [0.315]
6.50 [0.256]
Mate length
Row C
5.00 [0.197]
5.00 [0.197]
5.75 [0.226]
6.50 [0.256]
5.75 [0.226]
5.75 [0.226]
5.00 [0.197]
6.50 [0.256]
5.00 [0.197]
6.50 [0.256]
5.75 [0.226]
6.50 [0.256]
7.25 [0.285]
7.25 [0.285]
5.75 [0.226]
5.75 [0.226]
8.00 [0.315]
7.25 [0.285]
Mate length
Row D
5.00 [0.197]
5.00 [0.197]
6.50 [0.256]
6.50 [0.256]
5.75 [0.226]
5.75 [0.226]
5.00 [0.197]
6.50 [0.256]
5.00 [0.197]
5.75 [0.226]
5.75 [0.226]
5.00 [0.197]
5.75 [0.226]
7.25 [0.285]
5.00 [0.197]
7.25 [0.285]
8.00 [0.315]
6.50 [0.256]
Mate length
Row E
(5-Row Prod. Only)
5.00 [0.197]
5.00 [0.197]
6.50 [0.256]
6.50 [0.256]
5.75 [0.226]
5.75 [0.226]
5.00 [0.197]
6.50 [0.256]
5.00 [0.197]
5.00 [0.197]
5.75 [0.226]
5.00 [0.197]
5.75 [0.226]
7.25 [0.285]
5.00 [0.197]
7.25 [0.285]
8.00 [0.315]
5.00 [0.197]
TS-1120-C
Sheet 3 of 4
3
Electronic Solutions Division
Interconnect Solutions
http://www.3M.com/interconnects/
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
3M
™
MetPak
™
2-FB Header
2 mm 4/5-Row, Vertical, Solder or Press-Fit Tail, Shouldered Pin
12.00
.472
16.00 MIN
.630
2.00
.079
2.00
.079
MP2 Series
1 6 .0 0 M IN
.6 3 0
A1
12.00
.472
"C"
12.00
.472
"D" PLATED THRU HO LE
Ø
0.10
2.00
.079
1.50
+.10
-.00
6.00
.236
UNPLATED
CENTER HOLES OPTIONAL
FOR 3M PRODUCT
Ø
.059
+.004
-.000
Ø
0.10
"D " P L A T E D T H R U H O L E
Ø
0 .1 0
RECOMMENDED 4 ROW SOLDER
TAIL PCB HOLE MOUNTING PATTERN
RECOMMENDED 4 ROW PRESS-FIT
Table 5 -- HOLE PLATING For TG, TG30, TR30, TR40B FINISHES ONLY
HOLE
“D”
Finished Dia. mm [in]
0.65-0.80 [.0256-.0315]
Cu Thickness mm [in]
0.025 [.001] min.
SnPb Thickness microns [μ”]
15 [600] max.
Drilled Hole Dia. mm [in]
0.81-0.86 [.0319-.0339]
Table 6 -- HOLE PLATING For FJ, KR, RF, LR, and PD FINISHES ONLY
Hole
“D”
Finished Dia.
mm [in]
0.700-0.800
[.0276-.0315]
Cu Thickness
mm [in]
0.025-0.045
[0.001-0.002]
Immersion
Matte Sn
Thickness
microns [μ”]
0.5 - 2.5
[20 - 100]
Electrolitic Au
Thickness
microns [μ”]
0.1 - 0.5
[4 - 20]
OSP ENTEK
Thickness
microns [μ”]
0.2 - 0.5
[8 - 20]
Drilled Hole Dia.
mm [in]
0.830-0.860 [.0330-.0340] or
0.85mm [ #66] TWIST DRILL
14.00
.551
6.00
.236
2.00
.079
18.00 MIN
.709
2.00
.079
"D " P L A T E D T H R U H O L E
Ø
0 .1 0
A1
12.00
.472
"C"
12.00
.472
2.00
.079
Ø
1.50
.059
+.10
-.00
+.004
-.000
"D" PLATED THRU HOLE
Ø 0.10
UNPLATED
CENTER HOLES OPTIONAL
FOR 3M PRODUCT
Ø 0.10
1 8 .0 0 M IN
.7 0 9
RECOMMENDED 5 ROW SOLDER
TAIL PCB HOLE MOUNTING PATTERN
RECOMMENDED 5 ROW PRESS-FIT
PCB HOLE MOUNTING PATTERN
TS-1120-C
Sheet 4 of 4
3
Electronic Solutions Division
Interconnect Solutions
http://www.3M.com/interconnects/
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
Important Notice
All statements, technical information, and recommendations related to 3M’s products are based on information believed to be reliable, but the accuracy or completeness
is not guaranteed. Before using this product, you must evaluate it and determine if it is suitable for your intended application. You assume all risks and liability associated
with such use. Any statements related to the product which are not contained in 3M’s current publications, or any contrary statements contained on your purchase order
shall have no force or effect unless expressly agreed upon, in writing, by an authorized officer of 3M.
Warranty; Limited Remedy; Limited Liability.
This product will be free from defects in material and manufacture for a period of one (1) year from the time of purchase.
3M MAKES NO OTHER WARRANTIES
INCLUDING, BUT NOT LIMITED TO, ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
If this product is defective within the
warranty period stated above, your exclusive remedy shall be, at 3M’s option, to replace or repair the 3M product or refund the purchase price of the 3M product.
Except
where prohibited by law, 3M will not be liable for any indirect, special, incidental or consequential loss or damage arising from this 3M product, regardless of
Everyone has been experimenting with launchPad and touchpads recently. What is the principle of touchpads?How to identify the IO port of LaunchPad?How can we use touch buttons in our own designs in th...
I need to use AD9854 because I need to do course design recently. I have read a lot of information but still don't understand it. If any expert has done this before, please give me some advice. I will...
This is the 485 circuit diagram on the module I bought. There is a download port on the board that can provide 3.3V, and then there is an external power supply, which is stepped down by 1117-3.3. I fo...
Communication Electronic Circuits : https://training.eeworld.com.cn/course/5031This course mainly studies the working principle and composition of each unit of the transmitting and receiving equipment...
[i=s]This post was last edited by qwqwqw2088 on 2018-7-9 09:50[/i] [b][color=#5E7384]This content was originally created by EEWORLD forum netizen [size=3]qwqwqw2088[/size]. If you need to reprint or u...
China's photovoltaic power generation installed capacity achieved rapid growth in 2017, and distributed photovoltaics achieved explosive growth. In 2017, the country's photovoltaic installed capaci...[Details]
1. Placement suspension void NVIC_Configuration(void) { NVIC_InitTypeDef NVIC_InitStructure; /* Set the Vector Table base location at 0x08004000 NVIC_SetVectorTable(NVIC_VectTab_FLASH, 0x4000)...[Details]
In the previous article, I wrote a simple GPIO running light test, which looked a bit monotonous. I was used to serial port debugging. If there was no serial port on the board, I had to find another ...[Details]
Chip: STM32F103C8T6 Application Pin: Output: PA0, PA1 TIM2 CH2 channel To achieve 50HZ (20ms) adjustable PWM output on the PA1 pin, set the system TIMx_CNT=8MHZ=8000 000HZ, set TIMx_PSC=800-1, then T...[Details]
introduction STM32 has many registers, which are difficult to remember, so the official packaged two sets of library functions. One is the standard library, but the official has not updated it on F7,...[Details]
Function List and Notes (lower-level driver part) 1. IO port initialization: control IO and communication IO. Control includes power control, reset and low power mode. Communication is the serial po...[Details]
In 1952, Bell Labs built a 6-foot-tall automatic number recognition machine called "Audrey", which could recognize the pronunciation of the numbers 0 to 9 with an accuracy of more than 90%. And its...[Details]
Our photovoltaic power station starts working at 5:30 in the morning. When you are still sleeping, the inverter starts working to make money!
Some people are skeptical. The sun hasn't even...[Details]
Processors with artificial intelligence are mostly integrated into cars, PCs, security cameras, smart speakers, robots and other related technology equipment, but
AI
chips were initially de...[Details]
Every era has its own representative company, and the small game between representative companies in the big era also reflects the big game between countries to a certain extent. Let's learn about ...[Details]
Different from 51, AVR and other single-chip microcomputers, the clock signal sources of msp430 include LFXT1, XT2 and DCO. 1. LFXT1: It can connect high-speed and low-speed crystal oscillators. In l...[Details]
From concept proposal, prototype exploration, technology accumulation to product iteration and industrial development,
VR
has gradually expanded from the military market to the consumer market...[Details]
Many embedded geeks are wondering what the future holds if they continue to invest time, energy and money in MICroChip's PIC32 series MCUs. Will their investment be safe, and how does it compare ...[Details]
Similar to the development trend of photovoltaic modules, photovoltaic inverters are also one of the examples of China's successful localization of manufacturing and leading the global market and tech...[Details]
On May 8,
Google
I/O 2018 Developer Conference was held as scheduled in Mountain View, California. In the second year of the full promotion of the "AI first" strategy, artificial intelligen...[Details]
Discrete Device
京公网安备 11010802033920号
EEWORLD
