2SC2500C(TO-92L) datasheet, PDF

Datasheet> All Categories > Discrete semiconductor> The transistor> 2SC2500C(TO-92L)

2SC2500C(TO-92L): DescriptionTransistor; CategoryDiscrete semiconductor The transistor; File Size254KB，1 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet Parametric View All

2SC2500C(TO-92L) Overview

Transistor

2SC2500C(TO-92L) Parametric

Parameter Name	Attribute value
package instruction	,
Reach Compliance Code	unknow
Base Number Matches	1

2SC2500C(TO-92L) Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

TO-92L Plastic-Encapsulate Transistors

2SC2500

TRANSISTOR (NPN)

TO-92L

FEATURES

Strobe Flash Applications

Medium Power Amplifier Applications

1. EMITTER

2. COLLECTOR

3. BASE

MAXIMUM RATINGS (T

=25

℃

unless otherwise noted)

Symbol

CBO

CEO

EBO

stg

Collector-Base Voltage

Collector-Emitter Voltage

Emitter-Base Voltage

Collector Current -Continuous

Collector Power Dissipation

Junction Temperature

Storage Temperature

Parameter

Value

900

150

-55 to +150

Unit

℃

ELECTRICAL CHARACTERISTICS (T

=25℃ unless otherwise specified)

Parameter

Collector-base breakdown voltage

Collector-emitter breakdown voltage

Emitter-base breakdown voltage

Collector cut-off current

Emitter cut-off current

DC current gain

FE(2)

Collector-emitter saturation voltage

Base-emitter voltage

Transition frequency

Collector output capacitance

CE(sat)

=1V,I

=2A

=2A,I

=50mA

=1V,I

=2A

=1V,I

=500mA

=10V,I

=0,f=1MHz

150

0.5

1.5

MHz

Symbol

(BR)CBO

(BR)CEO

(BR)EBO

CBO

EBO

FE(1)

Test

conditions

Min

0.1

140

600

Typ

Max

Unit

µA

=1mA,I

=10mA,I

=1mA,I

=30V,I

=6V,I

=1V,I

=500mA

CLASSIFICATION OF

Rank

Range

FE(1)

140-240

200-330

300-450

420-600

A,Jun,2011

Recommended Resources

Sound speed measurement circuit

Two-stage motor speed regulation main circuit and level indication circuit

DC stabilized power supply circuit diagram without power transformer

NB7232 stepless touch dimming circuit diagram

25W arc power circuit

Typical application circuit diagram of KA2803

TI eStore offers 20% off on three wireless development boards!: To celebrate the launch of 50 new products, TI eStore is offering 80% off on 3 wireless development boards from now until September 16! These 3 tools are the low-energy Bluetooth development kit #CC25...; qinkaiabc Microcontroller MCU

ISP hardware connection diagram: There is no hardware connection diagram for ISP FLASH LOADER V1.3 on the ST website. Where can I refer to it?...; 绝缘胶布 stm32/stm8

What is the difference between the Code Area and Data Area in GD32's Flash?: What is the difference between the Code Area and Data Area in GD32's Flash?...; dianhang GD32 MCU

[BBB Quadcopter] ESC Progress Report 6: I burned two MOSFET drivers again today :Cry: I adjusted the peripheral parameters of the hardware circuit, but the problem of the back EMF waveform on the falling edge is still not solved. :surrender...; azhiking DSP and ARM Processors

MicroPython adds littlefs: MicroPython has added littlefs, which seems to be able to solve the problem of file corruption after accidentally disconnecting the USB.ARM's littlefs system descriptionextmod: Add VFS littlefs bindin...; dcexpert MicroPython Open Source section

I'm a novice and I can't debug the FPGA development board (EP2C8Q208C8N). Can you guys help me?: I am a novice. I loaded the debugging program of the purchased board into the board I made. It can be downloaded, but I can't see any phenomenon. My board is basically designed according to the previo...; zhang0389 FPGA/CPLD

Popular Components