SN54LV08AFK datasheet, PDF - EEWORLD Datasheet

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SN54LV08AFK: DescriptionLV/LV-A/LVX/H SERIES, QUAD 2-INPUT AND GATE, CQCC20, CERAMIC, LCC-20; Categorylogic logic; File Size104KB，6 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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SN54LV08AFK Overview

LV/LV-A/LVX/H SERIES, QUAD 2-INPUT AND GATE, CQCC20, CERAMIC, LCC-20

SN54LV08AFK Parametric

Parameter Name	Attribute value
Maker	Texas Instruments
Parts packaging code	QLCC
package instruction	QCCN,
Contacts	20
Reach Compliance Code	unknown
series	LV/LV-A/LVX/H
JESD-30 code	S-CQCC-N20
length	8.89 mm
Logic integrated circuit type	AND GATE
Number of functions	4
Number of entries	2
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Package shape	SQUARE
Package form	CHIP CARRIER
propagation delay (tpd)	21 ns
Certification status	Not Qualified
Maximum seat height	2.03 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
width	8.89 mm

SN54LV08AFK Related Products

	SN54LV08AFK	SN54LV08AW	SN54LV08AJ	SN74LV08ADGV
Description	LV/LV-A/LVX/H SERIES, QUAD 2-INPUT AND GATE, CQCC20, CERAMIC, LCC-20	LV/LV-A/LVX/H SERIES, QUAD 2-INPUT AND GATE, CDFP14, CERAMIC, QFP-14	LV/LV-A/LVX/H SERIES, QUAD 2-INPUT AND GATE, CDIP14, CERAMIC, DIP-14	LV/LV-A/LVX/H SERIES, QUAD 2-INPUT AND GATE, PDSO14
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	QCCN,	DFP,	DIP,	TSSOP, TSSOP14,.25
Reach Compliance Code	unknown	unknown	unknown	unknown
series	LV/LV-A/LVX/H	LV/LV-A/LVX/H	LV/LV-A/LVX/H	LV/LV-A/LVX/H
JESD-30 code	S-CQCC-N20	R-GDFP-F14	R-GDIP-T14	R-PDSO-G14
length	8.89 mm	9.21 mm	19.56 mm	4.4 mm
Logic integrated circuit type	AND GATE	AND GATE	AND GATE	AND GATE
Number of functions	4	4	4	4
Number of entries	2	2	2	2
Number of terminals	20	14	14	14
Maximum operating temperature	125 °C	125 °C	125 °C	85 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-40 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	QCCN	DFP	DIP	TSSOP
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	FLATPACK	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
propagation delay (tpd)	21 ns	21 ns	21 ns	20 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.03 mm	2.03 mm	5.08 mm	1.2 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	2 V	2 V	2 V	2 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	INDUSTRIAL
Terminal form	NO LEAD	FLAT	THROUGH-HOLE	GULL WING
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	0.4 mm
Terminal location	QUAD	DUAL	DUAL	DUAL
width	8.89 mm	6.29 mm	7.62 mm	3.6 mm
Parts packaging code	QLCC	DFP	DIP	-
Contacts	20	14	14	-

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