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SN5J4HCU04FK

Description
HC/UH SERIES, HEX 1-INPUT INVERT GATE, CQCC20, CERAMIC, LCC-20
Categorylogic    logic   
File Size76KB,5 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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SN5J4HCU04FK Overview

HC/UH SERIES, HEX 1-INPUT INVERT GATE, CQCC20, CERAMIC, LCC-20

SN5J4HCU04FK Parametric

Parameter NameAttribute value
MakerTexas Instruments
Parts packaging codeQLCC
package instructionQCCN,
Contacts20
Reach Compliance Codeunknown
seriesHC/UH
JESD-30 codeS-CQCC-N20
length8.89 mm
Logic integrated circuit typeINVERTER
Number of functions6
Number of entries1
Number of terminals20
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQCCN
Package shapeSQUARE
Package formCHIP CARRIER
propagation delay (tpd)120 ns
Certification statusNot Qualified
Maximum seat height2.03 mm
Maximum supply voltage (Vsup)6 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
width8.89 mm

SN5J4HCU04FK Related Products

SN5J4HCU04FK SN5J4HCU04W SN5J4HCU04WR SN5J4HCU04FKR
Description HC/UH SERIES, HEX 1-INPUT INVERT GATE, CQCC20, CERAMIC, LCC-20 HC/UH SERIES, HEX 1-INPUT INVERT GATE, CDFP14, CERAMIC, FP-14 HC/UH SERIES, HEX 1-INPUT INVERT GATE, CDFP14, CERAMIC, FP-14 HC/UH SERIES, HEX 1-INPUT INVERT GATE, CQCC20, CERAMIC, LCC-20
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code QLCC DFP DFP QLCC
package instruction QCCN, DFP, DFP, QCCN,
Contacts 20 14 14 20
Reach Compliance Code unknown unknown unknown unknown
series HC/UH HC/UH HC/UH HC/UH
JESD-30 code S-CQCC-N20 R-GDFP-F14 R-GDFP-F14 S-CQCC-N20
length 8.89 mm 9.21 mm 9.21 mm 8.89 mm
Logic integrated circuit type INVERTER INVERTER INVERTER INVERTER
Number of functions 6 6 6 6
Number of entries 1 1 1 1
Number of terminals 20 14 14 20
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
encapsulated code QCCN DFP DFP QCCN
Package shape SQUARE RECTANGULAR RECTANGULAR SQUARE
Package form CHIP CARRIER FLATPACK FLATPACK CHIP CARRIER
propagation delay (tpd) 120 ns 120 ns 120 ns 120 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.03 mm 2.03 mm 2.03 mm 2.03 mm
Maximum supply voltage (Vsup) 6 V 6 V 6 V 6 V
Minimum supply voltage (Vsup) 2 V 2 V 2 V 2 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY
Terminal form NO LEAD FLAT FLAT NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location QUAD DUAL DUAL QUAD
width 8.89 mm 6.29 mm 6.29 mm 8.89 mm
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