HD64F2128PS20 datasheet, PDF - EEWORLD Datasheet

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HD64F2128PS20: Description16-BIT, FLASH, 20MHz, MICROCONTROLLER, PDIP64, SHRINK, PLASTIC, DIP-64; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，843 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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HD64F2128PS20 Overview

16-BIT, FLASH, 20MHz, MICROCONTROLLER, PDIP64, SHRINK, PLASTIC, DIP-64

HD64F2128PS20 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
Parts packaging code	DIP
package instruction	SHRINK, PLASTIC, DIP-64
Contacts	64
Reach Compliance Code	compliant
Has ADC	YES
Other features	ALSO OPERATES AT 4V SUPPLY
Address bus width	16
bit size	16
CPU series	H8S/2000
maximum clock frequency	20 MHz
DAC channel	NO
DMA channel	NO
External data bus width	8
JESD-30 code	R-PDIP-T64
JESD-609 code	e0
length	57.6 mm
Number of I/O lines	51
Number of terminals	64
Maximum operating temperature	75 °C
Minimum operating temperature	-20 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	SDIP
Encapsulate equivalent code	SDIP64,.75
Package shape	RECTANGULAR
Package form	IN-LINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3/5 V
Certification status	Not Qualified
RAM (bytes)	4096
rom(word)	65536
ROM programmability	FLASH
Maximum seat height	5.08 mm
speed	20 MHz
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL EXTENDED
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	1.778 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	19.05 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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To all our customers

Regarding the change of names mentioned in the document, such as Hitachi

Electric and Hitachi XX, to Renesas Technology Corp.

The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas

Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog

and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)

Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand

names are mentioned in the document, these names have in fact all been changed to Renesas

Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and

corporate statement, no changes whatsoever have been made to the contents of the document, and

these changes do not constitute any alteration to the contents of the document itself.

Renesas Technology Home Page: http://www.renesas.com

Renesas Technology Corp.

Customer Support Dept.

April 1, 2003

Cautions

Keep safety first in your circuit designs!

1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better

and more reliable, but there is always the possibility that trouble may occur with them. Trouble with

semiconductors may lead to personal injury, fire or property damage.

Remember to give due consideration to safety when making your circuit designs, with appropriate

measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or

(iii) prevention against any malfunction or mishap.

Notes regarding these materials

1. These materials are intended as a reference to assist our customers in the selection of the Renesas

Technology Corporation product best suited to the customer's application; they do not convey any

license under any intellectual property rights, or any other rights, belonging to Renesas Technology

Corporation or a third party.

2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any

third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or

circuit application examples contained in these materials.

3. All information contained in these materials, including product data, diagrams, charts, programs and

algorithms represents information on products at the time of publication of these materials, and are

subject to change by Renesas Technology Corporation without notice due to product improvements or

other reasons. It is therefore recommended that customers contact Renesas Technology Corporation

or an authorized Renesas Technology Corporation product distributor for the latest product information

before purchasing a product listed herein.

The information described here may contain technical inaccuracies or typographical errors.

Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss

rising from these inaccuracies or errors.

Please also pay attention to information published by Renesas Technology Corporation by various

means, including the Renesas Technology Corporation Semiconductor home page

(http://www.renesas.com).

4. When using any or all of the information contained in these materials, including product data, diagrams,

charts, programs, and algorithms, please be sure to evaluate all information as a total system before

making a final decision on the applicability of the information and products. Renesas Technology

Corporation assumes no responsibility for any damage, liability or other loss resulting from the

information contained herein.

5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device

or system that is used under circumstances in which human life is potentially at stake. Please contact

Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor

when considering the use of a product contained herein for any specific purposes, such as apparatus or

systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.

6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in

whole or in part these materials.

7. If these products or technologies are subject to the Japanese export control restrictions, they must be

exported under a license from the Japanese government and cannot be imported into a country other

than the approved destination.

Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the

country of destination is prohibited.

8. Please contact Renesas Technology Corporation for further details on these materials or the products

contained therein.

Cautions

1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s

patent, copyright, trademark, or other intellectual property rights for information contained in

this document. Hitachi bears no responsibility for problems that may arise with third party’s

rights, including intellectual property rights, in connection with use of the information

contained in this document.

2. Products and product specifications may be subject to change without notice. Confirm that you

have received the latest product standards or specifications before final design, purchase or

use.

3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.

However, contact Hitachi’s sales office before using the product in an application that

demands especially high quality and reliability or where its failure or malfunction may directly

threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear

power, combustion control, transportation, traffic, safety equipment or medical equipment for

life support.

4. Design your application so that the product is used within the ranges guaranteed by Hitachi

particularly for maximum rating, operating supply voltage range, heat radiation characteristics,

installation conditions and other characteristics. Hitachi bears no responsibility for failure or

damage when used beyond the guaranteed ranges. Even within the guaranteed ranges,

consider normally foreseeable failure rates or failure modes in semiconductor devices and

employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi

product does not cause bodily injury, fire or other consequential damage due to operation of

the Hitachi product.

5. This product is not designed to be radiation resistant.

6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document

without written approval from Hitachi.

7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi

semiconductor products.

Preface

The H8S/2128 Series and H8S/2124 Series comprise high-performance microcomputers with a

32-bit H8S/2000 CPU core, and a set of on-chip supporting functions required for system

configuration.

The H8S/2000 CPU can execute basic instructions in one state, and is provided with sixteen

internal 16-bit general registers with a 32-bit configuration, and a concise and optimized

instruction set. The CPU can handle a 16-Mbyte linear address space (architecturally 4 Gbytes).

Programs based on the high-level language C can also be run efficiently.

Single-power-supply flash memory (F-ZTAT™*) and mask ROM versions are available,

providing a quick and flexible response to conditions from ramp-up through full-scale volume

production, even for applications with frequently changing specifications.

On-chip peripheral functions include a 16-bit free-running timer module (FRT), 8-bit timer

module (TMR), watchdog timer module (WDT), two PWM timers (PWM and PWMX), a serial

communication interface (SCI), A/D converter (ADC), and I/O ports. An I

C bus interface (IIC)

can also be incorporated as an option.

An on-chip data transfer controller (DTC) is also provided, enabling high-speed data transfer

without CPU intervention.

The H8S/2128 Series has all the above on-chip supporting functions, and can also be provided

with an IIC module as an options. The H8S/2124 Series comprises reduced-function versions, with

fewer TMR, and no PWM, IIC, or DTC modules.

Use of the H8S/2128 or H8S/2124 Series enables compact, high-performance systems to be

implemented easily. The various timer functions and their interconnectability (timer connection),

plus the interlinked operation of the I

C bus interface and data transfer controller (DTC), in

particular, make these devices ideal for use in PC monitors. In addition, the combination of F-

ZTAT

and reduced-function versions is ideal for system applications in which on-chip program

memory is essential to meet performance requirements, product start-up times are short, and

program modifications may be necessary after end-product assembly.

This manual describes the hardware of the H8S/2128 Series and H8S/2124 Series. Refer to the

H8S/2600 Series and H8S/2000 Series Programming Manual

for a detailed description of the

instruction set.

Note: * F-ZTAT

(Flexible-ZTAT) is a trademark of Hitachi, Ltd.

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